JP7428821B2 - 配線基体および電子装置 - Google Patents

配線基体および電子装置 Download PDF

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Publication number
JP7428821B2
JP7428821B2 JP2022553973A JP2022553973A JP7428821B2 JP 7428821 B2 JP7428821 B2 JP 7428821B2 JP 2022553973 A JP2022553973 A JP 2022553973A JP 2022553973 A JP2022553973 A JP 2022553973A JP 7428821 B2 JP7428821 B2 JP 7428821B2
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Japan
Prior art keywords
conductor
opening
region
ground conductor
signal
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JP2022553973A
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English (en)
Japanese (ja)
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JPWO2022071256A1 (enExample
Inventor
芳規 川頭
泰人 木村
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Kyocera Corp
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Kyocera Corp
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Publication of JPWO2022071256A1 publication Critical patent/JPWO2022071256A1/ja
Priority to JP2024009105A priority Critical patent/JP2024050679A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H01P3/006—Conductor backed coplanar waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6694—Optical signal interface included within high-frequency semiconductor device housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022553973A 2020-09-30 2021-09-28 配線基体および電子装置 Active JP7428821B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024009105A JP2024050679A (ja) 2020-09-30 2024-01-25 配線基体および電子装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020165236 2020-09-30
JP2020165236 2020-09-30
PCT/JP2021/035477 WO2022071256A1 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024009105A Division JP2024050679A (ja) 2020-09-30 2024-01-25 配線基体および電子装置

Publications (2)

Publication Number Publication Date
JPWO2022071256A1 JPWO2022071256A1 (enExample) 2022-04-07
JP7428821B2 true JP7428821B2 (ja) 2024-02-06

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JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
JP2024009105A Pending JP2024050679A (ja) 2020-09-30 2024-01-25 配線基体および電子装置

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JP2024009105A Pending JP2024050679A (ja) 2020-09-30 2024-01-25 配線基体および電子装置

Country Status (5)

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US (1) US20240074035A1 (enExample)
EP (1) EP4224519A4 (enExample)
JP (2) JP7428821B2 (enExample)
CN (1) CN116235293A (enExample)
WO (1) WO2022071256A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115343812B (zh) * 2022-08-22 2023-10-17 德阳三环科技有限公司 输入输出构件和制备方法及封装基座和光器件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086293A (ja) 2004-09-15 2006-03-30 Canon Inc プリント配線基板及び該配線基板のグランドパターン設計方法
JP2019129287A (ja) 2018-01-26 2019-08-01 住友電気工業株式会社 光受信モジュール用パッケージ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170030B2 (ja) * 1992-03-17 2001-05-28 新光電気工業株式会社 高周波用電子部品の信号線路
US6891731B1 (en) * 1999-11-01 2005-05-10 Advanced Micro Devices, Inc. Crosstalk cancellation for integrated circuit package configuration
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기
JP5842850B2 (ja) * 2012-06-29 2016-01-13 株式会社村田製作所 フラットケーブルおよび電子機器
JP6272131B2 (ja) * 2014-05-02 2018-01-31 日本電信電話株式会社 光モジュール
CN205828619U (zh) * 2014-05-29 2016-12-21 株式会社村田制作所 高频信号线路以及包括该高频信号线路的电子设备
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation SEMICONDUCTOR ELEMENT HOUSING, SEMICONDUCTOR ELEMENT AND MOUNTING STRUCTURE
JP6441850B2 (ja) * 2016-03-31 2018-12-19 Ｒｉｔａエレクトロニクス株式会社 多層プリント配線板
JP6724648B2 (ja) * 2016-08-16 2020-07-15 富士ゼロックス株式会社 配線基板
JP6825986B2 (ja) * 2017-05-26 2021-02-03 京セラ株式会社 配線基板、電子部品収納用パッケージおよび電子装置
JP7100487B2 (ja) * 2018-04-27 2022-07-13 京セラ株式会社 印刷配線板
CN113519048B (zh) * 2019-03-07 2024-09-24 京瓷株式会社 布线基板、电子部件用封装体以及电子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086293A (ja) 2004-09-15 2006-03-30 Canon Inc プリント配線基板及び該配線基板のグランドパターン設計方法
JP2019129287A (ja) 2018-01-26 2019-08-01 住友電気工業株式会社 光受信モジュール用パッケージ

Also Published As

Publication number Publication date
EP4224519A4 (en) 2024-10-16
JPWO2022071256A1 (enExample) 2022-04-07
WO2022071256A1 (ja) 2022-04-07
EP4224519A1 (en) 2023-08-09
US20240074035A1 (en) 2024-02-29
CN116235293A (zh) 2023-06-06
JP2024050679A (ja) 2024-04-10

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