JP2023073317A5 - - Google Patents
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- Publication number
- JP2023073317A5 JP2023073317A5 JP2023043722A JP2023043722A JP2023073317A5 JP 2023073317 A5 JP2023073317 A5 JP 2023073317A5 JP 2023043722 A JP2023043722 A JP 2023043722A JP 2023043722 A JP2023043722 A JP 2023043722A JP 2023073317 A5 JP2023073317 A5 JP 2023073317A5
- Authority
- JP
- Japan
- Prior art keywords
- readable medium
- vacuum pump
- computer
- gas
- loadlock chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024221528A JP2025041727A (ja) | 2018-07-17 | 2024-12-18 | 粒子ビーム検査装置 |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862699643P | 2018-07-17 | 2018-07-17 | |
| US62/699,643 | 2018-07-17 | ||
| US201962869986P | 2019-07-02 | 2019-07-02 | |
| US62/869,986 | 2019-07-02 | ||
| PCT/EP2019/068637 WO2020016087A1 (en) | 2018-07-17 | 2019-07-11 | Particle beam inspection apparatus |
| JP2020572986A JP7296410B2 (ja) | 2018-07-17 | 2019-07-11 | 粒子ビーム検査装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020572986A Division JP7296410B2 (ja) | 2018-07-17 | 2019-07-11 | 粒子ビーム検査装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024221528A Division JP2025041727A (ja) | 2018-07-17 | 2024-12-18 | 粒子ビーム検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023073317A JP2023073317A (ja) | 2023-05-25 |
| JP2023073317A5 true JP2023073317A5 (enExample) | 2023-07-18 |
| JP7608500B2 JP7608500B2 (ja) | 2025-01-06 |
Family
ID=67297162
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020572986A Active JP7296410B2 (ja) | 2018-07-17 | 2019-07-11 | 粒子ビーム検査装置 |
| JP2023043722A Active JP7608500B2 (ja) | 2018-07-17 | 2023-03-20 | 粒子ビーム検査装置 |
| JP2024221528A Pending JP2025041727A (ja) | 2018-07-17 | 2024-12-18 | 粒子ビーム検査装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020572986A Active JP7296410B2 (ja) | 2018-07-17 | 2019-07-11 | 粒子ビーム検査装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024221528A Pending JP2025041727A (ja) | 2018-07-17 | 2024-12-18 | 粒子ビーム検査装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US11430678B2 (enExample) |
| JP (3) | JP7296410B2 (enExample) |
| KR (4) | KR20250057069A (enExample) |
| CN (2) | CN112424922A (enExample) |
| TW (5) | TWI738028B (enExample) |
| WO (1) | WO2020016087A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7296410B2 (ja) * | 2018-07-17 | 2023-06-22 | エーエスエムエル ネザーランズ ビー.ブイ. | 粒子ビーム検査装置 |
| WO2020069206A1 (en) | 2018-09-28 | 2020-04-02 | Lam Research Corporation | Vacuum pump protection against deposition byproduct buildup |
| EP3916482A1 (en) * | 2020-05-27 | 2021-12-01 | ASML Netherlands B.V. | Conditioning device and corresponding object handler, stage apparatus and lithographic apparatus |
| WO2022038080A1 (en) * | 2020-08-21 | 2022-02-24 | Asml Netherlands B.V. | Charged-particle inspection apparatus |
| JP7249989B2 (ja) * | 2020-12-16 | 2023-03-31 | 日本電子株式会社 | 荷電粒子線装置 |
| US11892382B2 (en) * | 2021-08-27 | 2024-02-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for detecting environmental parameter in semiconductor fabrication facility |
| EP4213176A1 (en) | 2022-01-13 | 2023-07-19 | ASML Netherlands B.V. | Charged particle assessment system |
| WO2023110244A1 (en) * | 2021-12-15 | 2023-06-22 | Asml Netherlands B.V. | Charged particle assessment system |
| CN118922925A (zh) * | 2022-03-11 | 2024-11-08 | Asml荷兰有限公司 | 包括温度调节板的真空腔系统 |
| US20250379075A1 (en) * | 2022-08-05 | 2025-12-11 | Asml Netherlands B.V. | High-throughput load lock chamber |
| CN115020308B (zh) * | 2022-08-08 | 2022-11-22 | 上海果纳半导体技术有限公司武汉分公司 | 晶圆传输装置、设备平台系统及其晶圆传输方法 |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5314541A (en) * | 1991-05-28 | 1994-05-24 | Tokyo Electron Limited | Reduced pressure processing system and reduced pressure processing method |
| JP3225170B2 (ja) * | 1993-10-22 | 2001-11-05 | 東京エレクトロン株式会社 | 真空処理装置 |
| US5944940A (en) * | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
| US6375746B1 (en) * | 1998-07-10 | 2002-04-23 | Novellus Systems, Inc. | Wafer processing architecture including load locks |
| US6110232A (en) * | 1998-10-01 | 2000-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for preventing corrosion in load-lock chambers |
| KR200231865Y1 (ko) | 1998-10-17 | 2001-10-25 | 김영환 | 반도체증착장비용로드락챔버의이물질증착방지장치 |
| US6402401B1 (en) * | 1999-10-19 | 2002-06-11 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| JP2001222099A (ja) * | 2000-02-10 | 2001-08-17 | Toshiba Corp | 荷電ビーム描画装置および荷電ビーム描画方法 |
| KR20070037517A (ko) * | 2000-09-15 | 2007-04-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 장비용 더블 이중 슬롯 로드록 |
| JP4553471B2 (ja) * | 2000-09-19 | 2010-09-29 | 東京エレクトロン株式会社 | 処理装置及び処理システム |
| JP2002151569A (ja) * | 2000-11-14 | 2002-05-24 | Tokyo Electron Ltd | 基板処理装置 |
| JP2003152046A (ja) * | 2001-08-31 | 2003-05-23 | Tdk Corp | 真空処理装置及び被処理物の製造方法 |
| SG115630A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock |
| JP4194495B2 (ja) * | 2004-01-07 | 2008-12-10 | 東京エレクトロン株式会社 | 塗布・現像装置 |
| US20050284572A1 (en) * | 2004-06-29 | 2005-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Heating system for load-lock chamber |
| US9305814B2 (en) * | 2004-12-20 | 2016-04-05 | Tokyo Electron Limited | Method of inspecting substrate processing apparatus and storage medium storing inspection program for executing the method |
| JP4860167B2 (ja) * | 2005-03-30 | 2012-01-25 | 東京エレクトロン株式会社 | ロードロック装置,処理システム及び処理方法 |
| JP4619854B2 (ja) * | 2005-04-18 | 2011-01-26 | 東京エレクトロン株式会社 | ロードロック装置及び処理方法 |
| US7665951B2 (en) * | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
| JP5036290B2 (ja) * | 2006-12-12 | 2012-09-26 | 東京エレクトロン株式会社 | 基板処理装置および基板搬送方法、ならびにコンピュータプログラム |
| KR100855325B1 (ko) * | 2006-12-27 | 2008-09-04 | 세메스 주식회사 | 로드락 챔버, 기판 처리 장치 및 기판 처리 방법 |
| US8905124B2 (en) * | 2007-06-27 | 2014-12-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temperature controlled loadlock chamber |
| JP2009123723A (ja) * | 2007-11-12 | 2009-06-04 | Hitachi High-Technologies Corp | 真空処理装置または真空処理方法 |
| NL1036164A1 (nl) * | 2007-11-15 | 2009-05-18 | Asml Netherlands Bv | Substrate processing apparatus and device manufacturing method. |
| JP5410174B2 (ja) * | 2009-07-01 | 2014-02-05 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理システム |
| JP5391055B2 (ja) * | 2009-12-25 | 2014-01-15 | 東京エレクトロン株式会社 | 半導体装置の製造方法及び半導体装置の製造システム |
| JP5552826B2 (ja) * | 2010-02-10 | 2014-07-16 | 株式会社ニコン | 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 |
| US8808788B2 (en) * | 2010-09-20 | 2014-08-19 | Tokyo Electron Limited | Processing a wafer with a post application bake (PAB) procedure |
| TWI524456B (zh) * | 2011-11-04 | 2016-03-01 | 東京威力科創股份有限公司 | 基板處理系統、基板運送方法、程式及電腦記憶媒體 |
| TWI550686B (zh) * | 2011-11-04 | 2016-09-21 | 東京威力科創股份有限公司 | 基板處理系統、基板運送方法及電腦記憶媒體 |
| JP5973731B2 (ja) * | 2012-01-13 | 2016-08-23 | 東京エレクトロン株式会社 | プラズマ処理装置及びヒータの温度制御方法 |
| TWI624897B (zh) * | 2013-03-15 | 2018-05-21 | Applied Materials, Inc. | 多位置批次負載鎖定裝置與系統,以及包括該裝置與系統的方法 |
| US10269603B2 (en) * | 2013-07-09 | 2019-04-23 | Kokusai Electric Corporation | Substrate processing apparatus, gas-purging method, method for manufacturing semiconductor device, and recording medium containing abnormality-processing program |
| WO2015045163A1 (ja) * | 2013-09-30 | 2015-04-02 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、基板処理システム及び記録媒体 |
| JP6293645B2 (ja) * | 2013-12-27 | 2018-03-14 | 東京エレクトロン株式会社 | 基板処理システム |
| WO2017057623A1 (ja) * | 2015-09-30 | 2017-04-06 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US11802340B2 (en) * | 2016-12-12 | 2023-10-31 | Applied Materials, Inc. | UHV in-situ cryo-cool chamber |
| US10714362B2 (en) * | 2018-03-15 | 2020-07-14 | Kokusai Electric Corporation | Substrate processing apparatus and method of manufacturing semiconductor device |
| EP3575873A1 (en) | 2018-05-28 | 2019-12-04 | ASML Netherlands B.V. | Particle beam apparatus |
| JP7296410B2 (ja) * | 2018-07-17 | 2023-06-22 | エーエスエムエル ネザーランズ ビー.ブイ. | 粒子ビーム検査装置 |
| US10896821B2 (en) * | 2018-09-28 | 2021-01-19 | Lam Research Corporation | Asymmetric wafer bow compensation by physical vapor deposition |
| WO2020094371A1 (en) * | 2018-11-06 | 2020-05-14 | Asml Netherlands B.V. | Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus |
| JP7188256B2 (ja) * | 2019-04-18 | 2022-12-13 | 株式会社Sumco | 気相成長方法及び気相成長装置 |
| US11440117B2 (en) * | 2019-09-27 | 2022-09-13 | Jian Zhang | Multiple module chip manufacturing arrangement |
| US11581204B2 (en) * | 2020-10-20 | 2023-02-14 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device manufacturing system and method for manufacturing semiconductor device |
-
2019
- 2019-07-11 JP JP2020572986A patent/JP7296410B2/ja active Active
- 2019-07-11 CN CN201980047675.2A patent/CN112424922A/zh active Pending
- 2019-07-11 KR KR1020257011736A patent/KR20250057069A/ko active Pending
- 2019-07-11 CN CN202410737231.4A patent/CN118737894A/zh active Pending
- 2019-07-11 KR KR1020247004344A patent/KR102796031B1/ko active Active
- 2019-07-11 KR KR1020247004343A patent/KR102790227B1/ko active Active
- 2019-07-11 KR KR1020217001541A patent/KR20210022068A/ko not_active Ceased
- 2019-07-11 WO PCT/EP2019/068637 patent/WO2020016087A1/en not_active Ceased
- 2019-07-17 TW TW108125301A patent/TWI738028B/zh active
- 2019-07-17 TW TW113100794A patent/TWI879378B/zh active
- 2019-07-17 TW TW114112056A patent/TW202531455A/zh unknown
- 2019-07-17 US US16/514,843 patent/US11430678B2/en active Active
- 2019-07-17 TW TW110127856A patent/TWI824271B/zh active
- 2019-07-17 TW TW112116941A patent/TWI842517B/zh active
-
2022
- 2022-07-06 US US17/811,047 patent/US11942340B2/en active Active
-
2023
- 2023-03-20 JP JP2023043722A patent/JP7608500B2/ja active Active
-
2024
- 2024-01-25 US US18/423,199 patent/US12354891B2/en active Active
- 2024-12-18 JP JP2024221528A patent/JP2025041727A/ja active Pending
-
2025
- 2025-07-08 US US19/262,098 patent/US20250336696A1/en active Pending
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