JP2023067951A5 - - Google Patents
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- Publication number
- JP2023067951A5 JP2023067951A5 JP2023032122A JP2023032122A JP2023067951A5 JP 2023067951 A5 JP2023067951 A5 JP 2023067951A5 JP 2023032122 A JP2023032122 A JP 2023032122A JP 2023032122 A JP2023032122 A JP 2023032122A JP 2023067951 A5 JP2023067951 A5 JP 2023067951A5
- Authority
- JP
- Japan
- Prior art keywords
- inorganic filler
- sealing composition
- particle size
- composition according
- size distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011256 inorganic filler Substances 0.000 claims 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims 8
- 239000002245 particle Substances 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000010954 inorganic particle Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017254883 | 2017-12-28 | ||
| JP2017254883 | 2017-12-28 | ||
| PCT/JP2018/047642 WO2019131669A1 (ja) | 2017-12-28 | 2018-12-25 | 封止組成物及び半導体装置 |
| JP2019562046A JP7238791B2 (ja) | 2017-12-28 | 2018-12-25 | 封止組成物及び半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019562046A Division JP7238791B2 (ja) | 2017-12-28 | 2018-12-25 | 封止組成物及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023067951A JP2023067951A (ja) | 2023-05-16 |
| JP2023067951A5 true JP2023067951A5 (enExample) | 2023-06-16 |
| JP7571810B2 JP7571810B2 (ja) | 2024-10-23 |
Family
ID=67067545
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019562046A Active JP7238791B2 (ja) | 2017-12-28 | 2018-12-25 | 封止組成物及び半導体装置 |
| JP2023032122A Active JP7571810B2 (ja) | 2017-12-28 | 2023-03-02 | 封止組成物及び半導体装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019562046A Active JP7238791B2 (ja) | 2017-12-28 | 2018-12-25 | 封止組成物及び半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7238791B2 (enExample) |
| KR (2) | KR20250016469A (enExample) |
| CN (1) | CN111566163B (enExample) |
| TW (1) | TWI797222B (enExample) |
| WO (1) | WO2019131669A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111566163B (zh) * | 2017-12-28 | 2024-02-13 | 株式会社力森诺科 | 密封组合物和半导体装置 |
| KR20230164858A (ko) | 2022-05-26 | 2023-12-05 | 동우 화인켐 주식회사 | 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2874089B2 (ja) * | 1994-04-13 | 1999-03-24 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
| JP4112396B2 (ja) * | 2003-02-13 | 2008-07-02 | 電気化学工業株式会社 | 樹脂用充填材および用途 |
| JP4525139B2 (ja) * | 2004-03-31 | 2010-08-18 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物の製造方法。 |
| JP4774778B2 (ja) | 2005-03-28 | 2011-09-14 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| WO2008044579A1 (fr) * | 2006-10-06 | 2008-04-17 | Sumitomo Bakelite Company Limited | composition de résine époxy pour le scellement d'un semi-conducteur, et dispositif semi-conducteur |
| JP4973322B2 (ja) * | 2007-06-04 | 2012-07-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| WO2009133904A1 (ja) * | 2008-04-30 | 2009-11-05 | 電気化学工業株式会社 | アルミナ粉末、その製造方法、及びそれを用いた樹脂組成物 |
| JP5407767B2 (ja) | 2009-11-04 | 2014-02-05 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| CN102382422B (zh) * | 2010-09-01 | 2013-01-02 | 北京科化新材料科技有限公司 | 包含一水合氧化铝的环氧树脂组合物 |
| JP6282390B2 (ja) * | 2010-12-16 | 2018-02-21 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置 |
| JP2013028659A (ja) * | 2011-07-26 | 2013-02-07 | Hitachi Chemical Co Ltd | アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置 |
| US20150014867A1 (en) * | 2012-03-29 | 2015-01-15 | Sumitomo Bakelite Co., Ltd. | Resin composition and semiconductor device |
| JP2014031460A (ja) * | 2012-08-06 | 2014-02-20 | Panasonic Corp | 封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
| EP3015487B1 (en) * | 2013-06-27 | 2018-04-04 | Hitachi Chemical Co., Ltd. | Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device |
| US9711378B2 (en) * | 2014-01-08 | 2017-07-18 | Shin-Etsu Chemical Co., Ltd. | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
| JP5905917B2 (ja) | 2014-03-20 | 2016-04-20 | 住友ベークライト株式会社 | 表面処理粒子の製造方法 |
| JP6347653B2 (ja) | 2014-04-21 | 2018-06-27 | 新日鉄住金マテリアルズ株式会社 | 球状粒子の製造方法 |
| JP6501211B2 (ja) * | 2016-01-13 | 2019-04-17 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ |
| CN111566163B (zh) * | 2017-12-28 | 2024-02-13 | 株式会社力森诺科 | 密封组合物和半导体装置 |
-
2018
- 2018-12-25 CN CN201880084098.XA patent/CN111566163B/zh active Active
- 2018-12-25 KR KR1020257001450A patent/KR20250016469A/ko active Pending
- 2018-12-25 KR KR1020207018215A patent/KR102815688B1/ko active Active
- 2018-12-25 WO PCT/JP2018/047642 patent/WO2019131669A1/ja not_active Ceased
- 2018-12-25 JP JP2019562046A patent/JP7238791B2/ja active Active
- 2018-12-26 TW TW107147230A patent/TWI797222B/zh active
-
2023
- 2023-03-02 JP JP2023032122A patent/JP7571810B2/ja active Active
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