JP2016108556A5 - - Google Patents
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- Publication number
- JP2016108556A5 JP2016108556A5 JP2015232286A JP2015232286A JP2016108556A5 JP 2016108556 A5 JP2016108556 A5 JP 2016108556A5 JP 2015232286 A JP2015232286 A JP 2015232286A JP 2015232286 A JP2015232286 A JP 2015232286A JP 2016108556 A5 JP2016108556 A5 JP 2016108556A5
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- acrylic particles
- epoxy
- polymethacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 14
- 239000002245 particle Substances 0.000 claims 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 12
- 239000003822 epoxy resin Substances 0.000 claims 6
- 229920000058 polyacrylate Polymers 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 229920000193 polymethacrylate Polymers 0.000 claims 6
- 239000005062 Polybutadiene Substances 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 125000000524 functional group Chemical group 0.000 claims 4
- 229920002857 polybutadiene Polymers 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000011258 core-shell material Substances 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 238000002156 mixing Methods 0.000 claims 2
- 229910000077 silane Inorganic materials 0.000 claims 2
- -1 silane compound Chemical class 0.000 claims 2
- 229920002050 silicone resin Polymers 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014242550 | 2014-11-28 | ||
| JP2014242550 | 2014-11-28 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016108556A JP2016108556A (ja) | 2016-06-20 |
| JP2016108556A5 true JP2016108556A5 (enExample) | 2016-11-17 |
| JP6067828B2 JP6067828B2 (ja) | 2017-01-25 |
Family
ID=56074505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015232286A Active JP6067828B2 (ja) | 2014-11-28 | 2015-11-27 | 粘着剤組成物及びそれを用いた粘着シート |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10808152B2 (enExample) |
| EP (1) | EP3225673B1 (enExample) |
| JP (1) | JP6067828B2 (enExample) |
| KR (1) | KR102472818B1 (enExample) |
| CN (1) | CN107001898B (enExample) |
| WO (1) | WO2016084960A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5888349B2 (ja) * | 2014-01-29 | 2016-03-22 | 大日本印刷株式会社 | 粘着剤組成物およびそれを用いた粘着シート |
| CN107001898B (zh) * | 2014-11-28 | 2020-10-27 | 大日本印刷株式会社 | 粘合剂组合物和使用该粘合剂组合物的粘合片材 |
| US11952514B2 (en) * | 2017-02-07 | 2024-04-09 | Ppg Industries Ohio, Inc. | Low-temperature curing adhesive compositions |
| EP3704201A4 (en) * | 2017-11-01 | 2021-07-21 | 3M Innovative Properties Company | LIGHTLY FLAMMABLE ADHESIVE COMPOSITION WITH LAYER STRUCTURE |
| CN109837032B (zh) * | 2017-11-27 | 2024-02-13 | 中国科学院大连化学物理研究所 | 一种金属表面用高拉伸强度快速固化胶黏剂的结构及应用 |
| RU2020129685A (ru) | 2018-02-09 | 2022-03-09 | Ппг Индастриз Огайо, Инк. | Композиции покрытия |
| WO2020022795A1 (ko) | 2018-07-25 | 2020-01-30 | 주식회사 엘지화학 | 접착제 조성물 |
| US12173195B2 (en) | 2018-07-25 | 2024-12-24 | Lg Chem, Ltd. | Adhesive composition |
| WO2020022801A1 (ko) | 2018-07-25 | 2020-01-30 | 주식회사 엘지화학 | 접착제 조성물 |
| US12173194B2 (en) | 2018-07-25 | 2024-12-24 | Lg Chem, Ltd. | Adhesive composition |
| EP3825377B1 (en) | 2018-07-25 | 2022-11-02 | LG Chem, Ltd. | Adhesive composition |
| US12116506B2 (en) | 2018-07-25 | 2024-10-15 | Lg Chem, Ltd. | Adhesive composition |
| EP3816253B1 (en) | 2018-07-25 | 2024-06-26 | Lg Chem, Ltd. | Adhesive composition |
| JP2020105280A (ja) * | 2018-12-26 | 2020-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | 耐熱性積層体及び耐熱性接着剤 |
| JP2020105268A (ja) * | 2018-12-26 | 2020-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | 帯電防止性積層体及び帯電防止性接着剤 |
| KR102535958B1 (ko) * | 2019-02-26 | 2023-05-26 | 애버리 데니슨 코포레이션 | 높은 전단 특성 및 박리 특성을 갖는 psa 조성물 |
| CN111668122B (zh) * | 2019-03-08 | 2022-03-25 | 矽磐微电子(重庆)有限公司 | 半导体封装方法 |
| WO2020196119A1 (ja) * | 2019-03-28 | 2020-10-01 | 日東電工株式会社 | 硬化型粘接着シート、及び硬化型粘接着シートの製造方法 |
| KR102556232B1 (ko) * | 2019-04-26 | 2023-07-18 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 점착성 필름 및 전자 장치의 제조 방법 |
| EP4253039A4 (en) * | 2020-11-27 | 2024-10-23 | Toray Industries, Inc. | PREPREG AND PREPREG PRODUCTION METHOD |
| CN119731283A (zh) | 2022-09-05 | 2025-03-28 | 大日本印刷株式会社 | 粘接片、粘接剂组合物及结构体 |
| KR102879361B1 (ko) * | 2023-12-07 | 2025-10-31 | 주식회사 케이씨씨 | 접착제 조성물 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928591B2 (ja) * | 1980-11-25 | 1984-07-13 | 大日本塗料株式会社 | ジエツト印刷用インク |
| BR8606779A (pt) * | 1985-06-26 | 1987-10-13 | Dow Chemical Co | Compostos epoxi modificados com borracha |
| ES2243977T3 (es) * | 1996-02-21 | 2005-12-01 | Toray Industries, Inc. | Hilo preparado y material compuesto de fibra pra reforzar a partir de este. |
| JP2003082034A (ja) | 2001-09-13 | 2003-03-19 | Hitachi Chem Co Ltd | アクリル樹脂、これを用いた接着剤及び接着フィルム |
| JP2004018803A (ja) * | 2002-06-20 | 2004-01-22 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| EP1780239B1 (en) * | 2004-08-18 | 2017-02-01 | Kaneka Corporation | Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
| CA2620028C (en) * | 2005-08-24 | 2014-01-28 | Henkel Kommanditgesellschaft Auf Aktien | Epoxy compositions having improved impact resistance |
| JP5307714B2 (ja) * | 2006-07-31 | 2013-10-02 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 硬化性エポキシ樹脂系粘着組成物 |
| US20080051524A1 (en) * | 2006-08-28 | 2008-02-28 | Henkel Corporation | Epoxy-Based Compositions Having Improved Impact Resistance |
| GB0700960D0 (en) | 2007-01-18 | 2007-02-28 | 3M Innovative Properties Co | High strength epoxy adhesive and uses thereof |
| JP5019363B2 (ja) * | 2007-02-22 | 2012-09-05 | 信越化学工業株式会社 | エポキシ樹脂接着剤組成物 |
| US8193293B2 (en) * | 2008-03-17 | 2012-06-05 | Ppg Industries Ohio, Inc. | Low temperature curable coating compositions and related methods |
| WO2009126862A1 (en) * | 2008-04-11 | 2009-10-15 | 3M Innovative Properties Company | One-part epoxy-based structural adhesive |
| EP2135909B1 (en) | 2008-06-12 | 2018-01-10 | Henkel IP & Holding GmbH | Next generation, highly toughened two part structural epoxy adhesive compositions |
| JP2011529118A (ja) | 2008-07-23 | 2011-12-01 | スリーエム イノベイティブ プロパティズ カンパニー | 二液型エポキシ系構造用接着剤 |
| JP5332471B2 (ja) * | 2008-10-02 | 2013-11-06 | 横浜ゴム株式会社 | 接着剤用エポキシ樹脂組成物 |
| JP5970814B2 (ja) * | 2009-08-05 | 2016-08-17 | 味の素株式会社 | フィルム |
| JP5540814B2 (ja) * | 2010-03-26 | 2014-07-02 | 大日本印刷株式会社 | 粘接着シート |
| BR112013018934A2 (pt) * | 2011-01-28 | 2017-11-07 | Toray Industries | composição de resina epóxi para a produção de material compósito reforçado com fibras, pré-impregnado e material compósito reforçado com fibras |
| JP2013006974A (ja) * | 2011-06-24 | 2013-01-10 | Dainippon Printing Co Ltd | 接着剤組成物およびそれを用いた接着シート |
| CN103131374B (zh) * | 2013-03-21 | 2015-02-11 | 黑龙江省科学院石油化学研究院 | 无机有机纳米粒子复合改性环氧树脂胶粘剂及其制备方法 |
| CN107001898B (zh) * | 2014-11-28 | 2020-10-27 | 大日本印刷株式会社 | 粘合剂组合物和使用该粘合剂组合物的粘合片材 |
-
2015
- 2015-11-27 CN CN201580063762.9A patent/CN107001898B/zh active Active
- 2015-11-27 KR KR1020177013573A patent/KR102472818B1/ko active Active
- 2015-11-27 JP JP2015232286A patent/JP6067828B2/ja active Active
- 2015-11-27 US US15/531,564 patent/US10808152B2/en active Active
- 2015-11-27 WO PCT/JP2015/083487 patent/WO2016084960A1/ja not_active Ceased
- 2015-11-27 EP EP15863067.3A patent/EP3225673B1/en active Active
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