JP2001019928A5 - - Google Patents

Download PDF

Info

Publication number
JP2001019928A5
JP2001019928A5 JP1999193829A JP19382999A JP2001019928A5 JP 2001019928 A5 JP2001019928 A5 JP 2001019928A5 JP 1999193829 A JP1999193829 A JP 1999193829A JP 19382999 A JP19382999 A JP 19382999A JP 2001019928 A5 JP2001019928 A5 JP 2001019928A5
Authority
JP
Japan
Prior art keywords
adhesive according
spherical filler
polymer composition
curable
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999193829A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001019928A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11193829A priority Critical patent/JP2001019928A/ja
Priority claimed from JP11193829A external-priority patent/JP2001019928A/ja
Priority to US09/597,218 priority patent/US6750550B1/en
Priority to EP00305237A priority patent/EP1067163B1/en
Priority to DE60001434T priority patent/DE60001434T2/de
Priority to KR1020000038822A priority patent/KR100637611B1/ko
Priority to TW089113524A priority patent/TWI225886B/zh
Publication of JP2001019928A publication Critical patent/JP2001019928A/ja
Publication of JP2001019928A5 publication Critical patent/JP2001019928A5/ja
Pending legal-status Critical Current

Links

JP11193829A 1999-07-08 1999-07-08 接着剤、および半導体装置 Pending JP2001019928A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP11193829A JP2001019928A (ja) 1999-07-08 1999-07-08 接着剤、および半導体装置
US09/597,218 US6750550B1 (en) 1999-07-08 2000-06-20 Adhesive and semiconductor devices
EP00305237A EP1067163B1 (en) 1999-07-08 2000-06-21 Adhesive and semiconductor devices
DE60001434T DE60001434T2 (de) 1999-07-08 2000-06-21 Klebstoff und Halbleiterbauelemente
KR1020000038822A KR100637611B1 (ko) 1999-07-08 2000-07-07 접착제 및 반도체 장치
TW089113524A TWI225886B (en) 1999-07-08 2000-09-19 Adhesive and semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11193829A JP2001019928A (ja) 1999-07-08 1999-07-08 接着剤、および半導体装置

Publications (2)

Publication Number Publication Date
JP2001019928A JP2001019928A (ja) 2001-01-23
JP2001019928A5 true JP2001019928A5 (enExample) 2006-08-10

Family

ID=16314444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11193829A Pending JP2001019928A (ja) 1999-07-08 1999-07-08 接着剤、および半導体装置

Country Status (6)

Country Link
US (1) US6750550B1 (enExample)
EP (1) EP1067163B1 (enExample)
JP (1) JP2001019928A (enExample)
KR (1) KR100637611B1 (enExample)
DE (1) DE60001434T2 (enExample)
TW (1) TWI225886B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139894A (ja) * 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、および半導体装置
JP4037619B2 (ja) * 2001-04-27 2008-01-23 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤及び電気装置
US7074481B2 (en) * 2001-09-17 2006-07-11 Dow Corning Corporation Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
US6784555B2 (en) 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
JP2005026363A (ja) * 2003-06-30 2005-01-27 Toshiba Corp 半導体装置とその製造方法
US7118940B1 (en) * 2005-08-05 2006-10-10 Delphi Technologies, Inc. Method of fabricating an electronic package having underfill standoff
JP2007288003A (ja) * 2006-04-18 2007-11-01 Sharp Corp 半導体装置
US20100076119A1 (en) * 2007-01-12 2010-03-25 Sekisui Chemical Co., Ltd. Adhesive for electronic components
JP2010018675A (ja) * 2008-07-09 2010-01-28 Mitsuboshi Belting Ltd 厚膜形成用ペースト
JP2012074512A (ja) * 2010-09-28 2012-04-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
KR101733529B1 (ko) * 2013-01-29 2017-05-08 주식회사 케이씨씨 반도체칩 접착용 실리콘 고무 조성물
DE112014001220T5 (de) * 2013-03-11 2016-01-07 Panasonic Intellectual Property Management Co., Ltd. Beschichtung zum Verhindern des Verstreuens von Bruchstücken
KR101854501B1 (ko) * 2015-04-29 2018-05-04 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR102164171B1 (ko) * 2019-04-26 2020-10-13 (주)엘프스 미니 led 칩 본딩용 자가융착형 도전접속 페이스트, 이를 포함하는 미니 led 칩-회로기판 본딩 모듈 및 이의 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189229A (ja) * 1984-03-09 1985-09-26 Toshiba Chem Corp 半導体素子
JPH0791475B2 (ja) * 1988-02-29 1995-10-04 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP2882823B2 (ja) 1989-11-15 1999-04-12 東レ・ダウコーニング・シリコーン株式会社 接着剤
JPH04152642A (ja) * 1990-10-17 1992-05-26 Fujitsu Ltd 接着用ペースト
JP2605970B2 (ja) 1993-06-21 1997-04-30 日本電気株式会社 半導体チップ用ダイボンディング樹脂及びそれを用いた半導体装置。
JP2983816B2 (ja) * 1993-10-29 1999-11-29 住友ベークライト株式会社 導電性樹脂ペースト
JPH07221125A (ja) * 1994-01-27 1995-08-18 Toyota Autom Loom Works Ltd 半導体部品の実装構造及び絶縁性接着剤
JP3519779B2 (ja) * 1994-04-27 2004-04-19 東レ・ダウコーニング・シリコーン株式会社 接着剤および半導体装置
EP0699717A3 (en) * 1994-08-30 1997-01-02 Dow Corning Organopolysiloxane compositions curable into products having good adhesiveness and reduced flammability
US6201055B1 (en) * 1999-03-11 2001-03-13 Dow Corning Corporation Silicone composition and silicone pressure sensitive adhesive

Similar Documents

Publication Publication Date Title
JP2001019928A5 (enExample)
JP2003504425A5 (enExample)
MY145804A (en) Underfill composition and package solid state device
MY126953A (en) Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same
JP2012518717A5 (enExample)
EP1170346A3 (en) Die attach adhesives with epoxy resin having allyl or vinyl groups
US9041228B2 (en) Molding compound including a carbon nano-tube dispersion
WO2006014418A3 (en) Encapsulated semiconductor device with reliable down bonds
SG77576A1 (en) Curable organosiloxane compositions and semiconductor devices
BRPI0413778A (pt) sistema de resina modificada contendo enchimento que tem alto tg, transparência e boa confiabilidade em aplicações de enchimento no nìvel de wafer
MY121624A (en) Inorganic filler, epoxy resin composition, and semiconductor device
WO2007100642A3 (en) No lead package with heat spreader
EP0880175A3 (en) Thin power tape ball grid array package
TW200501862A (en) Wiring substrate and electronic parts packaging structure
EP1650798A3 (en) A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
MY116439A (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP2004130371A5 (enExample)
TW200613435A (en) Epoxy resin composition and semiconductor device
ATE502979T1 (de) Harzzusammensetzung und integrierte hybridleiterplatte damit
WO2009069783A1 (ja) 回路部材接続用接着剤及び半導体装置
ATE268370T1 (de) Anisotropisch leitfähige klebstoffzusammensetzung und daraus hergestellte anisotropisch leitfähige klebstofffolie
JPH10284544A5 (enExample)
TW200633158A (en) Nanotube-based filler
Syed et al. Solder joint reliability of chiparray BGA
WO2003044858A3 (en) Semiconductor device and method of enveloping an integrated circuit