JPH10284544A5 - - Google Patents

Info

Publication number
JPH10284544A5
JPH10284544A5 JP1997092609A JP9260997A JPH10284544A5 JP H10284544 A5 JPH10284544 A5 JP H10284544A5 JP 1997092609 A JP1997092609 A JP 1997092609A JP 9260997 A JP9260997 A JP 9260997A JP H10284544 A5 JPH10284544 A5 JP H10284544A5
Authority
JP
Japan
Prior art keywords
package substrate
wiring
semiconductor chip
semiconductor device
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997092609A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10284544A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9092609A priority Critical patent/JPH10284544A/ja
Priority claimed from JP9092609A external-priority patent/JPH10284544A/ja
Publication of JPH10284544A publication Critical patent/JPH10284544A/ja
Publication of JPH10284544A5 publication Critical patent/JPH10284544A5/ja
Pending legal-status Critical Current

Links

JP9092609A 1997-04-10 1997-04-10 半導体装置およびその製造方法 Pending JPH10284544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9092609A JPH10284544A (ja) 1997-04-10 1997-04-10 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9092609A JPH10284544A (ja) 1997-04-10 1997-04-10 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPH10284544A JPH10284544A (ja) 1998-10-23
JPH10284544A5 true JPH10284544A5 (enExample) 2005-02-24

Family

ID=14059187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9092609A Pending JPH10284544A (ja) 1997-04-10 1997-04-10 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPH10284544A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340736A (ja) * 1999-05-26 2000-12-08 Sony Corp 半導体装置及びその実装構造、並びにこれらの製造方法
JP2001156212A (ja) 1999-09-16 2001-06-08 Nec Corp 樹脂封止型半導体装置及びその製造方法
JP4635329B2 (ja) * 2000-12-01 2011-02-23 凸版印刷株式会社 配線回路基板の製造方法
US6469384B2 (en) * 2001-02-01 2002-10-22 Fairchild Semiconductor Corporation Unmolded package for a semiconductor device
USRE44438E1 (en) 2001-02-27 2013-08-13 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US8143108B2 (en) 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
JP2005268575A (ja) * 2004-03-19 2005-09-29 Hitachi Ltd 半導体装置
JP2006237324A (ja) * 2005-02-25 2006-09-07 Seiko Epson Corp 半導体装置及びその製造方法
JP5260067B2 (ja) * 2007-02-01 2013-08-14 日本特殊陶業株式会社 配線基板、半導体パッケージ
JP4881369B2 (ja) * 2008-12-24 2012-02-22 ラピスセミコンダクタ株式会社 半導体装置の製造方法
JP5330184B2 (ja) * 2009-10-06 2013-10-30 新光電気工業株式会社 電子部品装置
JP5271402B2 (ja) * 2011-10-31 2013-08-21 ラピスセミコンダクタ株式会社 半導体装置の製造方法

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