JP2012162650A5 - - Google Patents
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- Publication number
- JP2012162650A5 JP2012162650A5 JP2011024149A JP2011024149A JP2012162650A5 JP 2012162650 A5 JP2012162650 A5 JP 2012162650A5 JP 2011024149 A JP2011024149 A JP 2011024149A JP 2011024149 A JP2011024149 A JP 2011024149A JP 2012162650 A5 JP2012162650 A5 JP 2012162650A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- conductive resin
- powder
- magnesium oxide
- inorganic oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 15
- 239000000843 powder Substances 0.000 claims 7
- 239000000945 filler Substances 0.000 claims 6
- 229910052809 inorganic oxide Inorganic materials 0.000 claims 6
- 239000000395 magnesium oxide Substances 0.000 claims 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 6
- 229920001187 thermosetting polymer Polymers 0.000 claims 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 2
- 239000003566 sealing material Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000012798 spherical particle Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011024149A JP5795168B2 (ja) | 2011-02-07 | 2011-02-07 | 熱伝導性樹脂組成物及び半導体パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011024149A JP5795168B2 (ja) | 2011-02-07 | 2011-02-07 | 熱伝導性樹脂組成物及び半導体パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012162650A JP2012162650A (ja) | 2012-08-30 |
| JP2012162650A5 true JP2012162650A5 (enExample) | 2013-11-07 |
| JP5795168B2 JP5795168B2 (ja) | 2015-10-14 |
Family
ID=46842362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011024149A Active JP5795168B2 (ja) | 2011-02-07 | 2011-02-07 | 熱伝導性樹脂組成物及び半導体パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5795168B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015059130A (ja) | 2013-09-17 | 2015-03-30 | 明和化成株式会社 | エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材 |
| JP6156061B2 (ja) * | 2013-10-29 | 2017-07-05 | 株式会社デンソー | 送風装置 |
| JP6879690B2 (ja) | 2016-08-05 | 2021-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | 放熱用樹脂組成物、その硬化物、及びこれらの使用方法 |
| JP6335374B2 (ja) * | 2017-07-25 | 2018-05-30 | 明和化成株式会社 | エポキシ樹脂組成物及びその用途 |
| WO2022181429A1 (ja) * | 2021-02-25 | 2022-09-01 | 三菱瓦斯化学株式会社 | 脱酸素剤粉体 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6185474A (ja) * | 1984-10-03 | 1986-05-01 | Daicel Chem Ind Ltd | 熱伝導性樹脂組成物 |
| JPH0710939B2 (ja) * | 1985-07-17 | 1995-02-08 | 宇部興産株式会社 | 電子部品封止用樹脂組成物 |
| JPS62135516A (ja) * | 1985-12-09 | 1987-06-18 | Polyplastics Co | 電気部品封止剤 |
| JPH01236270A (ja) * | 1988-03-17 | 1989-09-21 | Showa Denko Kk | 樹脂組成物 |
| JPH08143781A (ja) * | 1994-11-22 | 1996-06-04 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物 |
| JPH08157693A (ja) * | 1994-12-06 | 1996-06-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPH11260839A (ja) * | 1998-03-16 | 1999-09-24 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
| JP2002038010A (ja) * | 2000-07-26 | 2002-02-06 | Idemitsu Petrochem Co Ltd | 電気絶縁・放熱部品用成形材料及びそれを用いた画像形成装置用部品 |
| JP3995421B2 (ja) * | 2001-01-19 | 2007-10-24 | 株式会社ルネサステクノロジ | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
| JP5507477B2 (ja) * | 2011-01-20 | 2014-05-28 | パナソニック株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
-
2011
- 2011-02-07 JP JP2011024149A patent/JP5795168B2/ja active Active
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