JP2012162650A5 - - Google Patents

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JP2012162650A5
JP2012162650A5 JP2011024149A JP2011024149A JP2012162650A5 JP 2012162650 A5 JP2012162650 A5 JP 2012162650A5 JP 2011024149 A JP2011024149 A JP 2011024149A JP 2011024149 A JP2011024149 A JP 2011024149A JP 2012162650 A5 JP2012162650 A5 JP 2012162650A5
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resin composition
conductive resin
powder
magnesium oxide
inorganic oxide
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JP2011024149A
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Japanese (ja)
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JP5795168B2 (en
JP2012162650A (en
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Publication of JP2012162650A5 publication Critical patent/JP2012162650A5/ja
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Claims (8)

熱硬化性樹脂組成物に無機酸化物フィラーが分散されてなる熱伝導性樹脂組成物であって、熱硬化性樹脂組成物と無機酸化物フィラーとの容量比が７０：３０〜５：９５の範囲にあり、該無機酸化物フィラーが、容量比で５：９５〜４０：６０の範囲にある酸化マグネシウム粉末と二酸化ケイ素粉末とを含むことを特徴とする熱伝導性樹脂組成物。 A heat conductive resin composition in which an inorganic oxide filler is dispersed in a thermosetting resin composition, wherein the volume ratio of the thermosetting resin composition to the inorganic oxide filler is 70:30 to 5:95. The thermally conductive resin composition is characterized in that the inorganic oxide filler comprises magnesium oxide powder and silicon dioxide powder in a volume ratio of 5:95 to 40:60. 酸化マグネシウム粉末が、硬焼酸化マグネシウム粉末もしくは電融酸化マグネシウム粉末である請求項１に記載の熱伝導性樹脂組成物。   The heat conductive resin composition according to claim 1, wherein the magnesium oxide powder is a hard-burned magnesium oxide powder or an electrofused magnesium oxide powder. 酸化マグネシウム粉末が、１〜１００μｍの範囲に平均粒子径を有する請求項１もしくは２に記載の熱伝導性樹脂組成物。   The heat conductive resin composition of Claim 1 or 2 in which a magnesium oxide powder has an average particle diameter in the range of 1-100 micrometers. 二酸化ケイ素粉末が、球状粒子の粉末である請求項１乃至３のうちのいずれかの項に記載の熱伝導性樹脂組成物。   The thermally conductive resin composition according to any one of claims 1 to 3, wherein the silicon dioxide powder is a powder of spherical particles. 二酸化ケイ素粉末が、１〜１００μｍの範囲に平均粒子径を有する請求項１乃至４のうちのいずれかの項に記載の熱伝導性樹脂組成物。   The thermally conductive resin composition according to any one of claims 1 to 4, wherein the silicon dioxide powder has an average particle diameter in the range of 1 to 100 µm. 熱硬化性樹脂組成物がエポキシ樹脂とフェノール樹脂とを含む請求項１乃至５のうちのいずれかの項に記載の熱伝導性樹脂組成物。   The heat conductive resin composition according to any one of claims 1 to 5, wherein the thermosetting resin composition contains an epoxy resin and a phenol resin. 半導体パッケージの封止用である請求項１乃至６のうちのいずれかの項に記載の熱伝導性樹脂組成物。   The thermally conductive resin composition according to any one of claims 1 to 6, which is used for sealing a semiconductor package. 半導体素子の周囲が封止材で封止された半導体パッケージであって、上記封止材が、熱硬化性樹脂組成物に無機酸化物フィラーが分散されてなる熱伝導性樹脂組成物であって、熱硬化性樹脂組成物と無機酸化物フィラーとの容量比が７０：３０〜５：９５の範囲にあり、該無機酸化物フィラーが、容量比で５：９５〜４０：６０の範囲にある酸化マグネシウム粉末と二酸化ケイ素粉末とを含むことを特徴とする熱伝導性樹脂組成物の硬化物である半導体パッケージ。 A semiconductor package in which a periphery of a semiconductor element is sealed with a sealing material, and the sealing material is a heat conductive resin composition in which an inorganic oxide filler is dispersed in a thermosetting resin composition. The volume ratio between the thermosetting resin composition and the inorganic oxide filler is in the range of 70:30 to 5:95, and the inorganic oxide filler is in the range of 5:95 to 40:60 by volume ratio. A semiconductor package, which is a cured product of a thermally conductive resin composition, comprising magnesium oxide powder and silicon dioxide powder.
JP2011024149A 2011-02-07 2011-02-07 Thermally conductive resin composition and semiconductor package Active JP5795168B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011024149A JP5795168B2 (en) 2011-02-07 2011-02-07 Thermally conductive resin composition and semiconductor package

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Application Number Priority Date Filing Date Title
JP2011024149A JP5795168B2 (en) 2011-02-07 2011-02-07 Thermally conductive resin composition and semiconductor package

Publications (3)

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JP2012162650A JP2012162650A (en) 2012-08-30
JP2012162650A5 true JP2012162650A5 (en) 2013-11-07
JP5795168B2 JP5795168B2 (en) 2015-10-14

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JP2011024149A Active JP5795168B2 (en) 2011-02-07 2011-02-07 Thermally conductive resin composition and semiconductor package

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015059130A (en) * 2013-09-17 2015-03-30 明和化成株式会社 Epoxy resin composition, use thereof and filler for epoxy resin composition
JP6156061B2 (en) * 2013-10-29 2017-07-05 株式会社デンソー Blower
JP6879690B2 (en) 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー Resin composition for heat dissipation, its cured product, and how to use them
JP6335374B2 (en) * 2017-07-25 2018-05-30 明和化成株式会社 Epoxy resin composition and use thereof
EP4299161A1 (en) * 2021-02-25 2024-01-03 Mitsubishi Gas Chemical Company, Inc. Oxygen scavenger powder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185474A (en) * 1984-10-03 1986-05-01 Daicel Chem Ind Ltd Heat-conductive resin composition
JPH0710939B2 (en) * 1985-07-17 1995-02-08 宇部興産株式会社 Resin composition for electronic component encapsulation
JPS62135516A (en) * 1985-12-09 1987-06-18 Polyplastics Co Sealant for electrical component
JPH01236270A (en) * 1988-03-17 1989-09-21 Showa Denko Kk Resin composition
JPH08143781A (en) * 1994-11-22 1996-06-04 Sumitomo Bakelite Co Ltd Thermosetting resin composition
JPH08157693A (en) * 1994-12-06 1996-06-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH11260839A (en) * 1998-03-16 1999-09-24 Toray Ind Inc Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the adhesive composition
JP2002038010A (en) * 2000-07-26 2002-02-06 Idemitsu Petrochem Co Ltd Molding material for electric insulation and radiator parts and parts for image-forming apparatus using the same
JP3995421B2 (en) * 2001-01-19 2007-10-24 株式会社ルネサステクノロジ Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP5507477B2 (en) * 2011-01-20 2014-05-28 パナソニック株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device

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