JP2016204420A5 - - Google Patents
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- Publication number
- JP2016204420A5 JP2016204420A5 JP2015083444A JP2015083444A JP2016204420A5 JP 2016204420 A5 JP2016204420 A5 JP 2016204420A5 JP 2015083444 A JP2015083444 A JP 2015083444A JP 2015083444 A JP2015083444 A JP 2015083444A JP 2016204420 A5 JP2016204420 A5 JP 2016204420A5
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- epoxy resin
- sic
- sealing
- gan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 238000000465 moulding Methods 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 229910002601 GaN Inorganic materials 0.000 claims 5
- 229910003465 moissanite Inorganic materials 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 125000004432 carbon atoms Chemical group C* 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229910001410 inorganic ion Inorganic materials 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- -1 for example Chemical compound 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
Description
シラザン処理されたシリカを含む（Ｅ）成分の無機充填材として、例えば、平均粒径１０〜３０μｍの溶融球状シリカに、シラザン処理された平均粒径０．５〜１．０μｍの合成シリカを、該溶融球状シリカの１〜１０質量％程度混合して（Ｅ）成分とする、等を例示することができる。 As the inorganic filler of the component (E) containing silazane-treated silica, for example, fused silica having an average particle size of 10 to 30 μm and silazane-treated synthetic silica having an average particle size of 0.5 to 1.0 μm, Examples thereof include mixing about 1 to 10% by mass of the fused spherical silica to make the component (E) .
Claims (5)
前記（Ｅ）成分がシラザンにより表面処理されたシリカを含有することを特徴とするＳｉＣ又はＧａＮ素子封止用エポキシ樹脂成形材料。
（式中、Ｒ１はそれぞれ独立に炭素数１〜１０の炭化水素基である。複数のＲ１は、互いに同一でも異なっていてもよい。ｐは０〜４の整数、ｑは０〜３の整数、ｚは０〜１０である。） (A) epoxy resin, (B) phenolic curing agent, (C) maleimide resin represented by the following general formula (I), (D) silane coupling agent , (E) inorganic filler and ion trapping agent And
An epoxy resin molding material for sealing SiC or GaN elements, wherein the component (E) contains silica surface-treated with silazane .
(In the formula, each R 1 is independently a hydrocarbon group having 1 to 10 carbon atoms. The plurality of R 1 may be the same as or different from each other. P is an integer of 0 to 4, q is 0 to 3) And z is 0-10.)
An electronic component device provided with the element sealed with the epoxy resin molding material for SiC or GaN element sealing as described in any one of Claims 1-4 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015083444A JP6497652B2 (en) | 2015-04-15 | 2015-04-15 | Epoxy resin molding material for sealing and electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015083444A JP6497652B2 (en) | 2015-04-15 | 2015-04-15 | Epoxy resin molding material for sealing and electronic parts |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018103752A Division JP6611861B2 (en) | 2018-05-30 | 2018-05-30 | Epoxy resin molding material for sealing and electronic parts |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016204420A JP2016204420A (en) | 2016-12-08 |
| JP2016204420A5 true JP2016204420A5 (en) | 2018-07-12 |
| JP6497652B2 JP6497652B2 (en) | 2019-04-10 |
Family
ID=57489017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015083444A Active JP6497652B2 (en) | 2015-04-15 | 2015-04-15 | Epoxy resin molding material for sealing and electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6497652B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6537170B2 (en) * | 2015-05-12 | 2019-07-03 | 京セラ株式会社 | Molding material for sealing and electronic component device |
| JP7296191B2 (en) | 2018-01-09 | 2023-06-22 | 味の素株式会社 | Curable resin composition, resin sheet, printed wiring board and semiconductor device |
| WO2020090491A1 (en) * | 2018-11-01 | 2020-05-07 | 住友ベークライト株式会社 | Power device-sealing resin composition and power device |
| CN111621152A (en) | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | Molding material composition for sealing element and electronic component device |
| JPWO2021039687A1 (en) * | 2019-08-26 | 2021-03-04 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05239426A (en) * | 1992-03-03 | 1993-09-17 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| JP4276423B2 (en) * | 2002-11-13 | 2009-06-10 | トヨタ自動車株式会社 | Basic silica powder, method for producing the same, and resin composition |
| JP5217119B2 (en) * | 2005-06-15 | 2013-06-19 | 日立化成株式会社 | Liquid epoxy resin composition for sealing, electronic component device and wafer level chip size package |
| KR20090071774A (en) * | 2007-12-28 | 2009-07-02 | 주식회사 두산 | Resine composition for adhesive and use thereof |
| JP2010100803A (en) * | 2008-09-24 | 2010-05-06 | Sekisui Chem Co Ltd | Epoxy resin composition, sheet-like form, prepreg, cured product, laminated board, and multilayered laminated board |
| JP5195454B2 (en) * | 2009-01-22 | 2013-05-08 | 味の素株式会社 | Resin composition |
| JP5609165B2 (en) * | 2009-04-30 | 2014-10-22 | 横浜ゴム株式会社 | Topcoat composition for sealant |
| JP5691312B2 (en) * | 2010-09-06 | 2015-04-01 | 横浜ゴム株式会社 | Curing accelerator for sealant and sealant construction method using the same |
| US20130289187A1 (en) * | 2010-10-19 | 2013-10-31 | Sumitomo Bakelite Company Limited | Resin composition for encapsulation and electronic component device |
| US8735733B2 (en) * | 2011-01-18 | 2014-05-27 | Hitachi Chemical Company, Ltd. | Resin composition, prepreg laminate obtained with the same and printed-wiring board |
| KR101355777B1 (en) * | 2011-01-24 | 2014-02-04 | 스미토모 베이클리트 컴퍼니 리미티드 | Prepreg, laminate, printed wiring board, and semiconductor device |
| JP5307263B1 (en) * | 2012-03-01 | 2013-10-02 | 住友ベークライト株式会社 | Fixing resin composition, rotor, and automobile |
| JP2014019815A (en) * | 2012-07-20 | 2014-02-03 | Mitsubishi Gas Chemical Co Inc | Curable resin composition and cured product thereof |
| JPWO2014065152A1 (en) * | 2012-10-26 | 2016-09-08 | 新日鉄住金化学株式会社 | Epoxy resin composition, method for producing cured epoxy resin, and semiconductor device |
| JP6021150B2 (en) * | 2012-12-05 | 2016-11-09 | 中部電力株式会社 | Low temperature resistant resin composition and superconducting wire using the same |
| JP2014237861A (en) * | 2014-09-26 | 2014-12-18 | 日本化薬株式会社 | Epoxy resin composition and curable resin composition |
-
2015
- 2015-04-15 JP JP2015083444A patent/JP6497652B2/en active Active
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