JP2018188611A5 - - Google Patents
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- JP2018188611A5 JP2018188611A5 JP2017163515A JP2017163515A JP2018188611A5 JP 2018188611 A5 JP2018188611 A5 JP 2018188611A5 JP 2017163515 A JP2017163515 A JP 2017163515A JP 2017163515 A JP2017163515 A JP 2017163515A JP 2018188611 A5 JP2018188611 A5 JP 2018188611A5
- Authority
- JP
- Japan
- Prior art keywords
- hollow structure
- filler
- molding material
- gan
- sic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000945 filler Substances 0.000 claims 14
- 238000000465 moulding Methods 0.000 claims 11
- 229910002601 GaN Inorganic materials 0.000 claims 10
- 239000000463 material Substances 0.000 claims 10
- 229910003465 moissanite Inorganic materials 0.000 claims 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims 10
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N Imidazole Chemical compound C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 125000004432 carbon atoms Chemical group C* 0.000 claims 3
- 150000002430 hydrocarbons Chemical group 0.000 claims 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2H-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 125000004430 oxygen atoms Chemical group O* 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Claims (10)
前記(E)充填材は(e−1)中空構造充填材を含有するSiC素子又はGaN素子封止用成形材料組成物。 Containing (A) maleimide resin, (B) curing agent , (C) epoxy resin, (D) curing accelerator and (E) filler,
The (E) filler is a molding material composition for encapsulating a SiC device or a GaN device, which contains (e-1) a hollow structure filler.
(式中、R1はそれぞれ独立に炭素数1〜10の炭化水素基であって、炭化水素基はハロゲン原子で置換されていてもよい。R1が複数存在する場合、該複数のR1は、互いに同一でも異なっていてもよい。pはそれぞれ独立に0〜4の整数、qは0〜3の整数、zは0〜10の整数である。)
(式中、xは0〜10である。)
(式中、y1は0〜10である。)
(式中、X1は炭素数1〜10のアルキレン基、酸素原子、又は直接結合である。R2及びR3は、それぞれ独立に炭素数1〜10の炭化水素基である。R2及びR3が複数存在する場合、複数のR2及び複数のR3は、それぞれ同一でも異なっていてもよい。m1及びm2は、それぞれ独立に0〜4の整数である。)
(式中、n1は0〜10である。)
(式中、n2は0〜10である。)
(Wherein, a hydrocarbon group having 1 to 10 carbon atoms R 1 each independently if hydrocarbon group which may .R 1 optionally substituted by halogen atoms there are a plurality, R 1 of said plurality of May be the same or different from each other. P is independently an integer of 0 to 4, q is an integer of 0 to 3, and z is an integer of 0 to 10.)
(In the formula, x is 0 to 10.)
(In the formula, y1 is 0 to 10.)
(In the formula, X1 is an alkylene group having 1 to 10 carbon atoms, an oxygen atom, or a direct bond. R 2 and R 3 are each independently a hydrocarbon group having 1 to 10 carbon atoms. R 2 and R When plural 3 are present, plural R 2 and plural R 3 may be the same or different, and m1 and m2 are each independently an integer of 0 to 4.)
(In the formula, n1 is 0 to 10.)
(In the formula, n2 is 0 to 10.)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107121348A TWI696655B (en) | 2017-08-28 | 2018-06-21 | Molding material composition for sealing SiC and GaN elements, electronic parts device |
CN201880030381.4A CN110603294B (en) | 2017-08-28 | 2018-06-21 | Molding material composition for sealing SiC and GaN elements, and electronic component device |
PCT/JP2018/023651 WO2019044133A1 (en) | 2017-08-28 | 2018-06-21 | MOLDING COMPOSITION FOR SiC AND GaN ELEMENT SEALING, AND ELECTRONIC COMPONENT DEVICE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017089980 | 2017-04-28 | ||
JP2017089980 | 2017-04-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018188611A JP2018188611A (en) | 2018-11-29 |
JP2018188611A5 true JP2018188611A5 (en) | 2020-05-21 |
JP6992967B2 JP6992967B2 (en) | 2022-01-13 |
Family
ID=64478022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017163515A Active JP6992967B2 (en) | 2017-04-28 | 2017-08-28 | Compositions for encapsulation molding materials and electronic component equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6992967B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102427036B1 (en) | 2017-10-27 | 2022-08-01 | 에네오스 가부시키가이샤 | A composition for a cured resin, a cured product of the composition, a method for manufacturing the composition and the cured product, and a semiconductor device |
KR20210102281A (en) * | 2018-12-10 | 2021-08-19 | 에네오스 가부시키가이샤 | A composition for a cured resin, a cured product of the composition, a method for manufacturing the composition and the cured product, and a semiconductor device |
CN111621152A (en) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | Molding material composition for sealing element and electronic component device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6126837B2 (en) * | 2012-12-21 | 2017-05-10 | 株式会社日本触媒 | Liquid curable resin composition and use thereof |
JP6185342B2 (en) * | 2013-09-05 | 2017-08-23 | 信越化学工業株式会社 | Encapsulant laminated composite, post-sealing semiconductor element mounting substrate or post-sealing semiconductor element forming wafer, and method for manufacturing semiconductor device |
-
2017
- 2017-08-28 JP JP2017163515A patent/JP6992967B2/en active Active
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