JPH01236270A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH01236270A JPH01236270A JP6183488A JP6183488A JPH01236270A JP H01236270 A JPH01236270 A JP H01236270A JP 6183488 A JP6183488 A JP 6183488A JP 6183488 A JP6183488 A JP 6183488A JP H01236270 A JPH01236270 A JP H01236270A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- magnesium oxide
- polyphenylene sulfide
- molding
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical class [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 16
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 8
- 238000004898 kneading Methods 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 6
- 238000001746 injection moulding Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000003963 antioxidant agent Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000000314 lubricant Substances 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 230000003078 antioxidant effect Effects 0.000 abstract 1
- 235000012245 magnesium oxide Nutrition 0.000 description 16
- 239000000395 magnesium oxide Substances 0.000 description 15
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- 208000005156 Dehydration Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009366 sericulture Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔蚕業上の利用分野］
本発明は樹脂組成物に関し、さらに詳しくは放熱性、熱
伝導性、電気絶縁性、成形加工性２機械的強度等におい
て優れたポリフェニレンスルフィド樹脂組成物に関する
。[Detailed Description of the Invention] [Field of Application in Sericulture] The present invention relates to a resin composition, and more specifically, a polyphenylene sulfide resin that is excellent in heat dissipation, thermal conductivity, electrical insulation, moldability, mechanical strength, etc. Regarding the composition.
〔従来の技術及び発明が解決しようとする課題〕各種の
設備９機器類において、従来から使用されている金属材
料が、近年、樹脂材料に急激に転換されつつある。しか
し、樹脂材料は、一般に熱伝導率が金属材料に比較して
二指も小さいため、放熱性、熱伝導性に劣り、各種設備
や機器類から発生する熱により、樹脂の軟化、融解、劣
化あるいは分解を起こし易いという問題がある。[Prior Art and Problems to be Solved by the Invention] In recent years, metal materials conventionally used in various types of equipment are being rapidly replaced with resin materials. However, resin materials generally have a thermal conductivity that is two orders of magnitude lower than that of metal materials, so they are inferior in heat dissipation and thermal conductivity, and the heat generated from various equipment and equipment causes the resin to soften, melt, and deteriorate. Alternatively, there is a problem that it is easy to cause decomposition.
樹脂に放熱性及び熱伝導性を付与するために、各種金属
を含有させる方法が提案されているが、この方法では、
電気伝導性が同時に付与されるため、絶縁性を要求され
名ような設備１機器２部品類には使用することができな
い。In order to impart heat dissipation and thermal conductivity to the resin, a method of incorporating various metals has been proposed, but with this method,
Because electrical conductivity is imparted at the same time, it cannot be used for equipment, equipment, or two parts that require insulation.
また、電気絶縁性を付与するために、樹脂にシリカ、ア
ルミナ、各種珪酸塩等の充填材を添加する方法も検討さ
れているが、この場合には熱伝導率の向上が極めて少な
く、所期の目的を達成することができない。In addition, methods of adding fillers such as silica, alumina, and various silicates to the resin are being considered in order to impart electrical insulation properties, but in this case, the improvement in thermal conductivity is extremely small and the desired result is not achieved. unable to achieve its purpose.
そこで、本発明者らは、前記の従来技術の欠点を克服し
て、放熱性、熱伝導性、電気絶縁性。Therefore, the present inventors have overcome the drawbacks of the above-mentioned prior art to improve heat dissipation, thermal conductivity, and electrical insulation.
成形加工性１機械的強度等において優れた樹脂組成物を
開発すべ（鋭意研究を重ねた。A resin composition with excellent molding processability 1 mechanical strength etc. should be developed (intensive research was carried out).
その結果、ポリフェニレンスルフィドに特定の前処理を
施した一定範囲の粒径の酸化マグネシウムを添加するこ
とによって、前記の課題を解決しうるごとを見出した。As a result, it has been found that the above-mentioned problems can be solved by adding magnesium oxide having a particle size within a certain range that has been subjected to a specific pretreatment to polyphenylene sulfide.
本発明は、かかる知見に基いて完成したものである。The present invention was completed based on this knowledge.
すなわち、本発明は、ポリフェニレンスルフィド５〜４
０重量％と脱水処理された平均粒径０．３〜５０μの酸
化マグネシウム９５〜６０重量％とからなることを特徴
とする樹脂組成物を提供するものである。That is, the present invention provides polyphenylene sulfide 5-4
The present invention provides a resin composition comprising 0% by weight of magnesium oxide and 95% to 60% by weight of dehydrated magnesium oxide having an average particle size of 0.3 to 50μ.
本発明において使用されるポリフェニレンスルフィドは
、特に制限はなく各種のものを用いることができる。分
子量については一般に１０，０００〜４０．０００の範
囲、好ましくは１５．０００〜２５．０００の範囲のも
のであればよい。また、このポリフェニレンスルフィド
は、単独重合体は勿論のこと、５０重量％未満の範囲で
他の単量体を重合させた共重合体でもよい。共重合に使
用しうる他の単量体としては、
本発明の樹脂組成物は、前記のようにポリフェニレンス
ルフィドと脱水処理された酸化マグネラムを含むもので
ある。脱水処理は、酸化マグネシウムの含水量を１重量
％以下、好ましくは０．１重量％以下にできる方法であ
れば、各種の方法で行うことができるが、その代表的方
法としては１０００〜１５００°Ｃの温度で１０分〜２
０時間程度焼成する方法（硬焼）があげられる。本発明
において脱水処理されていない酸化マグネシウムを用い
ると、得られる組成物の成形性が著しく悪化し、成形困
難となる。The polyphenylene sulfide used in the present invention is not particularly limited, and various types can be used. The molecular weight generally ranges from 10,000 to 40,000, preferably from 15,000 to 25,000. Moreover, this polyphenylene sulfide may be a homopolymer or a copolymer obtained by polymerizing other monomers in an amount of less than 50% by weight. As other monomers that can be used in the copolymerization, the resin composition of the present invention contains polyphenylene sulfide and dehydrated magnesium oxide as described above. The dehydration treatment can be carried out by various methods as long as the water content of magnesium oxide can be reduced to 1% by weight or less, preferably 0.1% by weight or less, but a typical method is at a temperature of 1000° to 1500°. 10 minutes at temperature C~2
A method of firing for about 0 hours (hard firing) is mentioned. If magnesium oxide that has not been dehydrated is used in the present invention, the moldability of the resulting composition will significantly deteriorate, making molding difficult.
本発明に用いられる酸化マグネシウムは、上記の如く脱
水処理されたもので、その平均粒径は、通常０．３〜５
０μ、好ましくは０．５〜２５μのものである。酸化マ
グネシウムの平均粒径が０．３μ未満であると、混練時
にこれを均一に分散することが困難となり、生産性が大
幅に低下するとともに、得られる成形品の機械的強度が
著しく低下する。また、平均粒径が５０μを超えると、
成形品の機械的強度が低下するため好ましくない。The magnesium oxide used in the present invention has been dehydrated as described above, and its average particle size is usually 0.3 to 5.
0μ, preferably 0.5 to 25μ. If the average particle size of the magnesium oxide is less than 0.3μ, it will be difficult to uniformly disperse it during kneading, resulting in a significant decrease in productivity and a significant decrease in the mechanical strength of the resulting molded product. In addition, if the average particle size exceeds 50μ,
This is not preferable because the mechanical strength of the molded product decreases.
本発明において、ポリフェニレンスルフィドと酸化マグ
ネシウムとの配合割合は、ポリフェニレンスルフィド５
〜４０重量％及び酸化マグネシウム９５〜６０重量％、
好ましくはポリフェニレンスルフィド１０〜３０重量％
及び酸化マグネシウム９０〜７０重世％の範囲で選・定
する。酸化マグネシウムの配合量が６０重量％未満では
、放熱性及び熱伝導性の改良効果が不充分であり、また
、９５重量％を超えると、得られる成形品の強度が極端
に低下する傾向がある。In the present invention, the blending ratio of polyphenylene sulfide and magnesium oxide is 5
~40% by weight and 95-60% by weight of magnesium oxide,
Preferably 10 to 30% by weight of polyphenylene sulfide
and magnesium oxide in the range of 90 to 70%. If the amount of magnesium oxide is less than 60% by weight, the effect of improving heat dissipation and thermal conductivity will be insufficient, and if it exceeds 95% by weight, the strength of the molded product obtained tends to be extremely reduced. .
さらに、本発明の樹脂組成物には、必要に応じて樹脂の
総量に対して５０重量％未満の範囲で他種のポリマーを
ブレンドすることができる。ブレンドしうるポリマーと
しては、ポリアミド、ポリカーボネート、ポリフェニレ
ンオキサイド、ポリエチレン、エチレン−プロピレンゴ
ム（ＥＰＲ）。Furthermore, other types of polymers can be blended into the resin composition of the present invention in an amount of less than 50% by weight based on the total amount of the resin, if necessary. Blendable polymers include polyamide, polycarbonate, polyphenylene oxide, polyethylene, and ethylene-propylene rubber (EPR).
フッ素樹脂等がある。There are fluororesins, etc.
本発明の樹脂組成物は、上述の如く、ポリフェニレンス
ルフィドと脱水した酸化マグネシウムを主成分とするも
のであるが、さらに必要に応じて一般に高分子加工分野
で用いられている各種の添加剤を適宜配合することがで
きる。添加剤の例としては、金属を含む無機物質や高分
子の接着性を向上させるための各種カップリング剤、例
えばシランカップリング剤あるいは滑剤、可塑剤９着色
剤、酸化防止剤、紫外線吸収剤、核剤、安定剤等があげ
られる。As mentioned above, the resin composition of the present invention is mainly composed of polyphenylene sulfide and dehydrated magnesium oxide, but may also contain various additives generally used in the field of polymer processing, if necessary. Can be blended. Examples of additives include various coupling agents for improving the adhesion of inorganic substances including metals and polymers, such as silane coupling agents or lubricants, plasticizers, colorants, antioxidants, ultraviolet absorbers, Examples include nucleating agents and stabilizers.
上記のようなポリフェニレンスルフィド、酸化マグネシ
ウム及ｑ必要に応じて用いられる各種の添加剤の混合は
、通常用いられる混合機、例えばヘンシェルミキサー、
タンブラ−、リボンブレンダー等で行われる。混練機と
しては、一般に単軸または二軸の押出機が用いられ、こ
のような押出機により、通常はまず上記本発明の組成物
からなるベレットが製造され、このベレットを、圧縮成
形、射出成形、押出成形等により任意の形状に成形して
所望の樹脂製品とすればよい。The above-mentioned polyphenylene sulfide, magnesium oxide, and various additives used as necessary are mixed using a commonly used mixer, such as a Henschel mixer,
This is done using a tumbler, ribbon blender, etc. As a kneader, a single-screw or twin-screw extruder is generally used, and such an extruder usually first produces pellets made of the composition of the present invention, which are then subjected to compression molding, injection molding, etc. A desired resin product may be obtained by molding into an arbitrary shape by extrusion molding or the like.
［実施例］
次に、実施例及び比較例により本発明をさらに具体的に
説明する。なお、実施例及び比較例において、放熱性効
果は、昭和電工■製の迅速熱伝導早計（Ｓｈｏｔｈｅｒ
ｍ ＱＴＭ）を用いて熱伝導率を測定し、その測定値を
もって表わすこととする。また、機械的強度の代表とし
て曲げ強度を採用し、曲げ試験は、ＡＳＴＭ Ｄ ７
９０に準拠して実施し、表面の電気抵抗は、試験片の中
央部３点の平均値で示し、成形品の表面状態は、肉眼で
観察して判定した。[Example] Next, the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, in the Examples and Comparative Examples, the heat dissipation effect was measured using a rapid heat conduction meter (Shother) manufactured by Showa Denko ■.
Thermal conductivity is measured using a 300-m QTM) and expressed as the measured value. In addition, bending strength is adopted as a representative of mechanical strength, and the bending test is conducted according to ASTM D 7.
The electrical resistance of the surface was shown as the average value of three points at the center of the test piece, and the surface condition of the molded product was determined by observing with the naked eye.
これらの測定を行うための試験片は、射出成形で製作し
、放熱性の効果測定、表面の電気抵抗及び成形品の表面
状態の試験には、１２０Ｘ１２０Ｘ５ｍの寸法のものを
、曲げ試験用には、ＡＳＴＭ試験片を用いた。成形条件
は、次のとおりである。The test pieces used for these measurements were manufactured by injection molding, and those measuring 120 x 120 x 5 m were used for measuring the heat dissipation effect, testing the electrical resistance of the surface, and testing the surface condition of the molded product, and those for bending tests were used. , using ASTM test pieces. The molding conditions were as follows.
成形機として日＠Ｎ−１００Ｂｎ型を用い、シリンダー
温度３００°Ｃ（各ゾーン共）、射出圧（１次） １３
０ ｋｇ／ｃ＋ｆｌ、射出圧（２次） ９０ ｋｇ／ｃ
＋ｆｌ。The molding machine was N-100Bn type, the cylinder temperature was 300°C (for each zone), and the injection pressure (primary) was 13.
0 kg/c+fl, injection pressure (secondary) 90 kg/c
+ fl.
秒を採用した。Seconds were adopted.
実施例１〜２及び比較例１〜５
第１表に示した配合割合のポリフェニレンスルフィド、
各種の酸化マグネシウム及びシランカップリング剤をヘ
ンシェルミキサー（８００ｒｐｍ）で３分間混合した後
、直径３０ｍｍの二軸同方向混練押出機（３００℃、６
０ｒρｍ）でペレツト化した。Examples 1 to 2 and Comparative Examples 1 to 5 Polyphenylene sulfide in the blending ratio shown in Table 1,
After mixing various magnesium oxides and silane coupling agents in a Henschel mixer (800 rpm) for 3 minutes, the mixture was mixed in a twin-shaft codirectional kneading extruder with a diameter of 30 mm (300 °C, 6
It was pelletized at 0rpm).
このペレットを射出成形して得られた試験片の物性を測
定した。その結果を第１表に示す。The physical properties of test pieces obtained by injection molding the pellets were measured. The results are shown in Table 1.
なお、用いたポリフェニレンスルフィド、Ｍ化マグネシ
ウム及びシランカップリング剤は、下記のとおりである
。In addition, the polyphenylene sulfide, magnesium oxide, and silane coupling agent used are as follows.
ポリフェニレンスルフィド
粒状ベースポリマー〔製品番号Ｔ４．トープレン■製２
分子量１ｓｏｏｏ〜２５０００ ）面上だ５乙も２夕Ｊ
２
（１） 脱水処理していない酸化マグネシウム協和化
学工業■製、平均粒径５μ
（２）硬焼酸化マグネシウム
１３００°Ｃで焼成したもの。Polyphenylene sulfide granular base polymer [product number T4. Made of Tauprene 2
Molecular weight 1sooo ~ 25000) It's on the surface.
2 (1) Undehydrated magnesium oxide manufactured by Kyowa Kagaku Kogyo ■, average particle size 5μ (2) Hard-calcined magnesium oxide fired at 1300°C.
協和化学工業■製、平均粒径４μ
（３）硬焼酸化マグネシウム
１３００ ”Ｃで焼成したもの
平均粒径０．１５μ
（４）硬焼酸化マグネシウム
１３００°Ｃで焼成したもの
平均粒径７０μ
シランカップリング
γ−アミノプロピルトリエトキシシランユニカー株製、
カップリンク剤Ａｌ １ ０ ０）（以下余白）
（発明の効果〕
本発明の樹脂組成物は、混練時や成形時に混練機や射出
成形機等に著しい損傷や摩耗を与えることがなく、しか
も成形加工性に優れたものである。Manufactured by Kyowa Chemical Industry ■, average particle size 4μ (3) Hard-baked magnesium oxide, fired at 1300”C, average particle size 0.15μ (4) Hard-baked magnesium oxide, fired at 1300°C, average particle size 70μ Silane cup Ring γ-aminopropyltriethoxysilane manufactured by Unicar Co., Ltd.
Cup linking agent Al 100) (hereinafter referred to as blank space) (Effects of the invention) The resin composition of the present invention does not cause significant damage or wear to kneading machines, injection molding machines, etc. during kneading or molding, and moreover, It has excellent workability.
また、本発明の樹脂組成物を用いて製造した成形品は、
電気絶縁性を有すると共に、放熱性、熱伝導性に優れ、
かつ機械的強度に優れている。Moreover, the molded article manufactured using the resin composition of the present invention is
It has electrical insulation properties, as well as excellent heat dissipation and thermal conductivity.
It also has excellent mechanical strength.
したがって、本発明の樹脂組成物は、電子部品のハウジ
ング等、機械的強度、電気絶縁性及び放熱性を要求され
る部分に有効な利用が期待される。Therefore, the resin composition of the present invention is expected to be effectively used in parts that require mechanical strength, electrical insulation, and heat dissipation properties, such as housings for electronic components.
Claims (1)
脱水処理された平均粒径０．３〜５０μの酸化マグネシ
ウム９５〜６０重量％とからなることを特徴とする樹脂
組成物。(1) A resin composition comprising 5 to 40% by weight of polyphenylene sulfide and 95 to 60% by weight of dehydrated magnesium oxide having an average particle size of 0.3 to 50μ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6183488A JPH01236270A (en) | 1988-03-17 | 1988-03-17 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6183488A JPH01236270A (en) | 1988-03-17 | 1988-03-17 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01236270A true JPH01236270A (en) | 1989-09-21 |
Family
ID=13182521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6183488A Pending JPH01236270A (en) | 1988-03-17 | 1988-03-17 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01236270A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002038010A (en) * | 2000-07-26 | 2002-02-06 | Idemitsu Petrochem Co Ltd | Molding material for electric insulation and radiator parts and parts for image-forming apparatus using the same |
| US6641878B2 (en) * | 1997-04-18 | 2003-11-04 | Kureha Kagaku Kogyo K.K. | Optical pickup device holding container |
| JP2006282783A (en) * | 2005-03-31 | 2006-10-19 | Polyplastics Co | Highly heat-conductive resin composition |
| WO2007135749A1 (en) * | 2006-05-24 | 2007-11-29 | Polyplastics Co., Ltd. | Resin composition of high heat conduction |
| JP2012162650A (en) * | 2011-02-07 | 2012-08-30 | Meiwa Kasei Kk | Thermoconductive resin composition, and semiconductor package |
-
1988
- 1988-03-17 JP JP6183488A patent/JPH01236270A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6641878B2 (en) * | 1997-04-18 | 2003-11-04 | Kureha Kagaku Kogyo K.K. | Optical pickup device holding container |
| JP2002038010A (en) * | 2000-07-26 | 2002-02-06 | Idemitsu Petrochem Co Ltd | Molding material for electric insulation and radiator parts and parts for image-forming apparatus using the same |
| JP2006282783A (en) * | 2005-03-31 | 2006-10-19 | Polyplastics Co | Highly heat-conductive resin composition |
| WO2007135749A1 (en) * | 2006-05-24 | 2007-11-29 | Polyplastics Co., Ltd. | Resin composition of high heat conduction |
| JP2012162650A (en) * | 2011-02-07 | 2012-08-30 | Meiwa Kasei Kk | Thermoconductive resin composition, and semiconductor package |
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