JP2002038010A - Molding material for electric insulation and radiator parts and parts for image-forming apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyarylene sulfide resin molding material used for radiator parts required for high thermal conductivity and electric insulation, and parts for an image-forming apparatus using the same. SOLUTION: A molding material for electric insulation and radiator parts contains: (A) 20-50 wt.% of a polyarylene sulfide resin; (B) 50-80 wt.% of powdered magnesium oxide comprising the surface treatment after calcination over 800 deg.C; and (C) 0-30 wt.% of an inorganic filler for electric insulation, and parts for fixation and a paper-delivery unit system on an image-forming apparatus comprises injection-molding of the molding material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding material for electrical insulation and heat dissipation components and a component for an image forming apparatus using the same. More specifically, the present invention provides a polyarylene sulfide resin-based molding material to be used for heat radiation parts requiring high thermal conductivity and electrical insulation, and a copier, a printer, which is obtained by injection-molding the same. The present invention relates to a fixing / discharge unit mechanism component of an image forming apparatus such as a facsimile.

[0002]

2. Description of the Related Art In recent years, in image forming apparatuses such as copying machines, laser beam printers, and facsimile machines, there has been an increasing demand for a reduction in processing time, and accordingly, it has been necessary to increase the speed of printing functions and increase the fixing temperature. Has arisen.
As a result, for example, the normal use atmosphere temperature around the accelerated image forming apparatus is 25 to 150 ° C., and may instantaneously reach about 50 to 250 ° C. Due to such an increase in the fixing temperature due to the shortening of the processing time, and the shortening of the distance between the fixing unit and the paper discharging unit and the internal heat storage due to the downsizing of the apparatus, the toner adhered to the fixing paper is separated from the separation claw, the guide, There is a problem that the toner adheres to a roller or the like and causes stain on an image.

[0003]

SUMMARY OF THE INVENTION Under such circumstances, the present invention suppresses the fusion of the fixing toner in the fixing section and the paper discharge section in the image forming apparatus, suppresses the occurrence of image defects, and reduces the size of the image forming apparatus. Electrical insulation that can reduce internal heat storage due to
An object of the present invention is to provide a molding material for a heat radiating component and a fixing / discharge unit mechanism component of an image forming apparatus using the same.

[0004]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, have found that a polyarylene sulfide resin, a magnesium oxide powder which has been subjected to a specific treatment, and, in some cases, It has been found that the object can be achieved by a molding material containing the electrically insulating inorganic filler used in a predetermined ratio. The present invention has been completed based on such findings. That is, the present invention relates to (A) 20 to 50% by weight of a polyarylene sulfide resin, (B) 50 to 80% by weight of a magnesium oxide powder which is surface-treated after firing at 800 ° C. or more, and (C) an electrically insulating inorganic material. An object of the present invention is to provide a molding material for electric insulation and heat dissipation components, which contains a filler of 0 to 30% by weight. The present invention also provides a fixing / discharge unit mechanism component in an image apparatus, which is formed by injection-molding the above-described molding material for an electrical insulating / radiating component.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION In the molding material for electrical insulation and heat dissipation parts of the present invention (hereinafter sometimes simply referred to as "the molding material of the present invention"), a polyarylene sulfide resin (A) is used as the component (A). PAS resin) is used. The P
AS resin has a structural unit represented by the general formula [-Ar-S
-] (Ar is an arylene group) and is a polymer based on a unit represented by the following general formula (I):

[0006]

Embedded image

(Wherein R ¹ is a halogen atom, having 1 to 1 carbon atoms)
6, an alkyl group having 6 carbon atoms, an alkoxyl group having 1 to 6 carbon atoms, a phenyl group, a carboxyl group or a metal salt thereof, or a nitro group; )). The average polymerization degree of this PAS resin is about 20 to 100. Among the repeating units represented by the general formula (I), 70 mol% or more of a repeating unit composed of a p-phenylene sulfide group,
Particularly, a PAS resin having 80 mol% or more is preferable. When the content of the repeating unit is less than 70 mol%, the original crystalline component, which is a characteristic of the crystalline polymer, is small, and the mechanical strength may be insufficient.

[0008] PAS resins are generally known to have a substantially linear structure and a molecular structure having a branched or cross-linked structure, depending on the production method, and any of the PAS resins used in the present invention may be used. . Further, a copolymer may be used in addition to a homopolymer. Examples of the copolymerized structural unit include m-phenylene sulfide unit, o-phenylene sulfide unit, p, p'-diphenylene ketone sulfide unit, p, p'-diphenylene sulfone sulfide unit, and p, p'-biphenylene sulfide unit. , P, p '
-Diphenylene methylene sulfide unit, p, p'-diphenylene cumenyl sulfide unit, naphthylene sulfide unit and the like. The PAS resin used in the present invention can be produced by a known method. For example, it can be obtained by subjecting a dihalo aromatic compound and a sulfur source to a polycondensation reaction in an organic polar solvent, washing and drying. This (A)
The PAS resin used as a component has a resin temperature of 3
The melt viscosity at 00 ° C and a shear rate of 500 sec ^-1 is 1
Those in the range of 0 to 50 Pa · s are preferred. If the melt viscosity is less than 10 Pa · s, the mechanical strength may be insufficient. If the melt viscosity is more than 50 Pa · s, the fluidity is reduced and the moldability is deteriorated. In particular, those having a melt viscosity in the range of 12 to 30 Pa · s are preferred.

In the molding material of the present invention, the magnesium oxide powder used as the component (B) is obtained by firing at a temperature of 800 ° C. or more, preferably in the range of 1000 to 1500 ° C., and then performing a surface treatment. If the sintering temperature is less than 800 ° C, the water resistance is inferior, and the obtained molded product is easily deformed,
Insufficient dimensional accuracy. This magnesium oxide may be obtained industrially by thermally decomposing magnesium carbonate, magnesium hydroxide, or the like, and may be manufactured at a firing temperature of 800 ° C. or higher, preferably 1000 to 1500 ° C. I just need. The firing method is not particularly limited, but it is advantageous to use a firing device such as a rotary kiln, a tunnel furnace or a muffle furnace.

[0010] The surface treatment of the magnesium oxide after the calcination treatment is preferably performed using a surface treatment agent having a hydrophobic group. As the surface treatment agent, for example, a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, a fluoroalkyl coupling agent, or the like can be used. Here, examples of the silane coupling agent include vinyltrichlorosilane, vinyltriethoxysilane, vinyltrimethoxysilane,
Chloropropyltrimethoxysilane, 3-chloropropylmethyldichlorosilane, 3-chloropropylmethyldiethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxysilane
Aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, Examples thereof include 3-glycidoxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, and 3-mercaptopropyltrimethoxysilane. Examples of titanate-based coupling agents include isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, and tetraoctyl bis (ditridecyl phosphite) titanate. , Tetra (2,2
-Diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate / bis (dioctylpyrophosphate) oxyacetate titanate; bis (dioctylpyrophosphate) ethylene titanate; Further, as the aluminum-based coupling agent, acetoalkoxyaluminum diisopropylate is commercially available.

[0011] These coupling agents may be used alone or in a combination of two or more.
Examples of the surface treatment method include a method in which magnesium oxide and a surface treatment agent are mixed in a stirrer such as a Henschel mixer at ordinary temperature, or a method in which the mixture is treated in an organic solvent such as toluene, xylene, and hexane. The amount of these coupling agents to be added is generally 0.1 to 10 parts by weight, preferably 0.5 to 2.0 parts by weight, based on 100 parts by weight of magnesium oxide. Further, after surface treatment, refired one can be preferably used, and further, surface treatment such as thermal spraying of silica, chemical vapor deposition, spray adhesion and the like can be used.

In the present invention, the magnesium oxide powder of the component (B) has an average particle diameter of preferably 1 to 40.
Advantageously those in the range of μm, more preferably in the range of 10 to 35 μm. If the average particle size is less than 1 μm, it may be difficult to handle due to aggregation or the like.
Exceeding the above causes a decrease in the mechanical strength of the obtained molded article. The particle size of this magnesium oxide powder, after firing,
It can be adjusted by pulverizing and classifying. In the present invention, if desired, an electrically insulating inorganic filler can be blended as the component (C). Examples of the electrically insulating inorganic filler include glass fibers, potassium titanate whiskers, calcium carbonate whiskers, calcium metasilicate whiskers, and aluminum borate whiskers. These may be used alone or in combination of two or more.

In the molding material of the present invention, the content of the PAS resin (A) is 20 to 50% by weight, and the content of the magnesium oxide powder (B) is 50 to 80% by weight.
And the content of the electrically insulating inorganic filler of the component (C) is 0 to
It is selected in the range of 30% by weight. When the content of the component (A) is less than 20% by weight, the fluidity is reduced and the moldability is deteriorated. On the other hand, when the content is more than 50% by weight, the thermal conductivity is reduced and sufficient heat dissipation cannot be obtained. When the content of the component (B) is less than 50% by weight, the thermal conductivity is low, and when it exceeds 80% by weight, the fluidity is reduced and the moldability is deteriorated. further,
When the content of the component (C) exceeds 30% by weight, the thermal conductivity decreases. In consideration of thermal conductivity and fluidity (moldability), the preferred content of each component is as follows:
0% by weight, the component (B) is selected in the range of 55 to 75% by weight, and the component (C) is selected in the range of 0 to 25% by weight. In the molding material of the present invention, various additives, for example, an antioxidant, a light stabilizer, a flame retardant, a flame retardant auxiliary, a lubricant, a plasticizer, and a charge, as long as the object of the present invention is not impaired. An inhibitor, a release agent, a colorant, and the like may be added, and other thermoplastic resins and thermoplastic elastomers may be added.

There is no particular limitation on the method of preparing the molding material for electrical insulation and heat dissipation components of the present invention, and any conventionally known method can be used. For example, a method of dry blending the component (A), the component (B), the component (C) and various optional components to be used with a mixer such as a V-type blender, a ribbon blender, and a Henschel mixer.
Or a single-screw or multi-screw extruder, a mixing roll, a Banbury mixer, a kneader such as a kneader, and the like.
A method of melt-kneading at a temperature of about ° C and pelletizing, or a method combining these can be used.
When the component (C) is fibrous, it is preferable to side-feed the component (C) using the uniaxial or multiaxial kneader described above. The molding material for an electrical insulating and heat radiating component of the present invention thus prepared is injection-molded by a known method, so that a fixing and discharging unit mechanism in an image forming apparatus such as a copying machine, a laser beam printer, and a facsimile. Part is obtained.

[0015]

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. The various properties of the molding material in each example were determined according to the following methods. (1) Bending strength Using a 50-ton injection molding machine (manufactured by Nippon Steel Works), at a resin temperature of 320 ° C and a mold temperature of 135 ° C, a bending test piece (127
× 12.7 × 3.2 mm), and the flexural strength was measured according to ASTM790. (2) Thermal conductivity A flat plate (80 × 80 × 3.2 mm) is injection molded and has a diameter of 50 mm.
A disk having a thickness of mm was cut out, and the thermal conductivity was measured using “UNISHERMO 2021” (manufactured by Anter) in accordance with ASTM E1530.

(3) Moisture and heat resistance Flat plate (80 × 80 × 3.2 mm) obtained by injection molding
Was placed in a thermo-hygrostat adjusted to 80 ° C. and a relative humidity of 90%, kept for 500 hours, taken out, checked for any change in appearance, and measured for volume specific resistance. The type and properties of each component are as follows. (A) Polyarylene sulfide resin PPS-1: Polyphenylene sulfide (manufactured by Idemitsu Petrochemical Co., Ltd., linear type, melt viscosity 150 Pa · s) PPS-2: Polyphenylene sulfide (manufactured by Idemitsu Petrochemical Company, semi-linear type, melt viscosity 180 Pa · s) (B) Magnesium oxide MgO-1: surface-treated with γ-aminopropyltriethoxysilane after firing at 1300 ° C., average particle size 20 μm, MgO-2 manufactured by Kyowa Chemical Industry Co., Ltd. -Aminopropyltriethoxysilane surface-treated, average particle size 30 μm, Kyowa Chemical Industry Co., Ltd.MgO-3: one that was surface-treated with γ-aminopropyltriethoxysilane after firing at 1300 ° C., average particle size 2 μm, manufactured by Kyowa chemical industry Co., Ltd. MgO-4: surface with SiO ₂ after firing at 1300 ℃ Coated, average particle size 30 μm, MgO-5 manufactured by Kyowa Chemical Industry: baked at 1300 ° C., no surface treatment, average particle size 30 μm, MgO-6 manufactured by Kyowa Chemical Industry: unfired, γ-aminopropyl Surface-treated with triethoxysilane, average particle size 30 μm, manufactured by Kyowa Chemical Industry Co., Ltd. MgO-7: unfired, no surface treatment, average particle size 30 μm (C) Electrically insulating inorganic filler Glass fiber: fiber diameter 10 μm Chopped glass, calcium metasilicate whisker manufactured by Asahi Fiber Glass Co., Ltd .: fiber diameter 1 to 7 μm, manufactured by NYCO (D) Silane coupling agent γ-aminopropyltriethoxysilane: manufactured by Nippon Unicar

Examples 1 to 7 Molding materials having the compositions shown in Table 1 were prepared and their properties were determined. The results are shown in Table 1.

[0018]

[Table 1]

[0019]

[Table 2]

Comparative Examples 1 to 5 Molding materials having the compositions shown in Table 2 were prepared and their properties were determined. The results are shown in Table 2.

[0021]

[Table 3]

[0022]

The molding material for an electric insulating and heat radiating component of the present invention suppresses the fusion of the fixing toner in the fixing section and the paper discharge section in the image forming apparatus, suppresses the occurrence of image defects, and reduces the size. It is suitably used as a molding material for electrical insulation and heat dissipation components that can reduce internal heat storage.

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Claims (4)

[Claims] 1. A polyarylene sulfide resin (A)
0 to 50% by weight, (B) 50 to 80% by weight of magnesium oxide powder which is surface-treated after firing at 800 ° C. or more, and (C) 0 to 30% by weight of an electrically insulating inorganic filler. Molding materials for electrical insulation and heat dissipation components. 2. The molding material for electric insulation and heat dissipation components according to claim 1, wherein the polyarylene sulfide resin as the component (A) contains at least 70 mol% of a repeating unit comprising a p-phenylene sulfide group. 3. The magnesium oxide powder of the component (B),
3. The molding material for electrical insulation and heat dissipation components according to claim 1, which has an average particle size of 1 to 40 [mu] m. 4. A fixing / discharge unit mechanism component in an image apparatus, wherein the molding material according to claim 1, 2 or 3 is injection-molded.