JP2012072364A5 - - Google Patents

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Publication number
JP2012072364A5
JP2012072364A5 JP2011173874A JP2011173874A JP2012072364A5 JP 2012072364 A5 JP2012072364 A5 JP 2012072364A5 JP 2011173874 A JP2011173874 A JP 2011173874A JP 2011173874 A JP2011173874 A JP 2011173874A JP 2012072364 A5 JP2012072364 A5 JP 2012072364A5
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JP
Japan
Prior art keywords
composition according
resin composition
conductive resin
thermally conductive
metal powder
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Pending
Application number
JP2011173874A
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Japanese (ja)
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JP2012072364A (en
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Publication date
Application filed filed Critical
Priority to JP2011173874A priority Critical patent/JP2012072364A/en
Priority claimed from JP2011173874A external-priority patent/JP2012072364A/en
Priority to PCT/JP2012/054722 priority patent/WO2013021669A1/en
Publication of JP2012072364A publication Critical patent/JP2012072364A/en
Publication of JP2012072364A5 publication Critical patent/JP2012072364A5/ja
Pending legal-status Critical Current

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Claims (7)

5質量%以上50質量%以下のフレーク状金属粉末と、50質量%以上95質量%以下の樹脂とを含み、
前記フレーク状金属粉末は、その平均粒子径が1μm以上100μm以下であり、その平均厚みが0.01μm以上5μm以下であり、そのアスペクト比が5以上1000以下である、熱伝導性樹脂組成物。
5 mass% to 50 mass% of flaky metal powder, and 95 wt% to 50 wt% of resin seen including,
The flaky metal powder has a mean particle size of 1 μm or more and 100 μm or less, an average thickness of 0.01 μm or more and 5 μm or less, and an aspect ratio of 5 or more and 1000 or less .
前記フレーク状金属粉末は、アルミニウムである、請求項1に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 1 , wherein the flaky metal powder is aluminum. 前記フレーク状金属粉末は、その表面が重合体皮膜により被覆されている、請求項1または2に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 1 or 2 , wherein the surface of the flaky metal powder is coated with a polymer film. 前記重合体皮膜は、1以上の重合性二重結合を有するモノマーまたはオリゴマーを1種以上重合させることによって得られた重合体からなる、請求項3に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 3 , wherein the polymer film is made of a polymer obtained by polymerizing one or more monomers or oligomers having one or more polymerizable double bonds. 前記フレーク状金属粉末は、その表面が金属酸化物皮膜により被覆されている、請求項1または2に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 1 or 2 , wherein the surface of the flaky metal powder is coated with a metal oxide film. 前記金属酸化物皮膜は、シリカからなる、請求項5に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 5 , wherein the metal oxide film is made of silica. 請求項1〜6のいずれかに記載の熱伝導性樹脂組成物を含む、放熱材。 A heat dissipating material comprising the heat conductive resin composition according to claim 1 .
JP2011173874A 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same Pending JP2012072364A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011173874A JP2012072364A (en) 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same
PCT/JP2012/054722 WO2013021669A1 (en) 2011-08-09 2012-02-27 Thermally conductive resin composition and heat dissipating material containing same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010193408 2010-08-31
JP2010193408 2010-08-31
JP2011173874A JP2012072364A (en) 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same

Publications (2)

Publication Number Publication Date
JP2012072364A JP2012072364A (en) 2012-04-12
JP2012072364A5 true JP2012072364A5 (en) 2014-08-28

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JP2011173874A Pending JP2012072364A (en) 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same
JP2011173873A Active JP5814688B2 (en) 2010-08-31 2011-08-09 Thermally conductive resin composition and heat dissipation material containing the same

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WO2013021669A1 (en) * 2011-08-09 2013-02-14 東洋アルミニウム株式会社 Thermally conductive resin composition and heat dissipating material containing same
JP2014065159A (en) * 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd Urethane foam molding and method for producing the same
JP6105269B2 (en) * 2012-12-11 2017-03-29 帝人フィルムソリューション株式会社 Low volume resistivity film
JP5798136B2 (en) * 2013-01-25 2015-10-21 日信工業株式会社 Method for producing thermoplastic resin composition and thermoplastic resin composition
JP6591141B2 (en) * 2013-02-20 2019-10-16 旭化成株式会社 METALLIC RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING THE SAME
JP6526939B2 (en) * 2013-06-14 2019-06-05 スターライト工業株式会社 Thermal conductive resin molding
US10544334B2 (en) 2015-02-04 2020-01-28 Namics Corporation Heat conductive paste and method for producing the same
JP2016207424A (en) * 2015-04-21 2016-12-08 旭化成株式会社 Aluminum powder composition for conductive material paste
JP6527010B2 (en) * 2015-04-27 2019-06-05 スターライト工業株式会社 Thermally conductive resin molding and method for producing the same
KR101799573B1 (en) * 2016-02-19 2017-11-20 금호석유화학 주식회사 Conductive resin composition and plastic article using the same
US20190300771A1 (en) * 2016-09-28 2019-10-03 Teijin Limited Heat dissipation sheet
JP2022552545A (en) 2019-10-30 2022-12-16 ザ プロクター アンド ギャンブル カンパニー Moldings with a metallic appearance
WO2021081786A1 (en) * 2019-10-30 2021-05-06 The Procter & Gamble Company Molded article with metallic appearance
CN116490550A (en) * 2021-04-30 2023-07-25 宝洁公司 Molded article having metallic appearance

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JPS6268854A (en) * 1985-09-19 1987-03-28 Toyo Alum Kk Electrically conductive resin composition
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