JP2012072364A5 - - Google Patents

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Publication number
JP2012072364A5
JP2012072364A5 JP2011173874A JP2011173874A JP2012072364A5 JP 2012072364 A5 JP2012072364 A5 JP 2012072364A5 JP 2011173874 A JP2011173874 A JP 2011173874A JP 2011173874 A JP2011173874 A JP 2011173874A JP 2012072364 A5 JP2012072364 A5 JP 2012072364A5
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JP
Japan
Prior art keywords
composition according
resin composition
conductive resin
thermally conductive
metal powder
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Pending
Application number
JP2011173874A
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Japanese (ja)
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JP2012072364A (en
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Publication date
Application filed filed Critical
Priority to JP2011173874A priority Critical patent/JP2012072364A/en
Priority claimed from JP2011173874A external-priority patent/JP2012072364A/en
Priority to PCT/JP2012/054722 priority patent/WO2013021669A1/en
Publication of JP2012072364A publication Critical patent/JP2012072364A/en
Publication of JP2012072364A5 publication Critical patent/JP2012072364A5/ja
Pending legal-status Critical Current

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Claims (7)

５質量％以上５０質量％以下のフレーク状金属粉末と、５０質量％以上９５質量％以下の樹脂とを含み、
前記フレーク状金属粉末は、その平均粒子径が１μｍ以上１００μｍ以下であり、その平均厚みが０．０１μｍ以上５μｍ以下であり、そのアスペクト比が５以上１０００以下である、熱伝導性樹脂組成物。 5 mass% to 50 mass% of flaky metal powder, and 95 wt% to 50 wt% of resin seen including,
The flaky metal powder has a mean particle size of 1 μm or more and 100 μm or less, an average thickness of 0.01 μm or more and 5 μm or less, and an aspect ratio of 5 or more and 1000 or less . 前記フレーク状金属粉末は、アルミニウムである、請求項１に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 1 , wherein the flaky metal powder is aluminum. 前記フレーク状金属粉末は、その表面が重合体皮膜により被覆されている、請求項１または２に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 1 or 2 , wherein the surface of the flaky metal powder is coated with a polymer film. 前記重合体皮膜は、１以上の重合性二重結合を有するモノマーまたはオリゴマーを１種以上重合させることによって得られた重合体からなる、請求項３に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 3 , wherein the polymer film is made of a polymer obtained by polymerizing one or more monomers or oligomers having one or more polymerizable double bonds. 前記フレーク状金属粉末は、その表面が金属酸化物皮膜により被覆されている、請求項１または２に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 1 or 2 , wherein the surface of the flaky metal powder is coated with a metal oxide film. 前記金属酸化物皮膜は、シリカからなる、請求項５に記載の熱伝導性樹脂組成物。 The thermally conductive resin composition according to claim 5 , wherein the metal oxide film is made of silica. 請求項１〜６のいずれかに記載の熱伝導性樹脂組成物を含む、放熱材。 A heat dissipating material comprising the heat conductive resin composition according to claim 1 .
JP2011173874A 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same Pending JP2012072364A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011173874A JP2012072364A (en) 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same
PCT/JP2012/054722 WO2013021669A1 (en) 2011-08-09 2012-02-27 Thermally conductive resin composition and heat dissipating material containing same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010193408 2010-08-31
JP2010193408 2010-08-31
JP2011173874A JP2012072364A (en) 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same

Publications (2)

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JP2012072364A JP2012072364A (en) 2012-04-12
JP2012072364A5 true JP2012072364A5 (en) 2014-08-28

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JP2011173874A Pending JP2012072364A (en) 2010-08-31 2011-08-09 Heat conductive resin composition and heat radiation material including the same

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013021669A1 (en) * 2011-08-09 2013-02-14 東洋アルミニウム株式会社 Thermally conductive resin composition and heat dissipating material containing same
JP2014065159A (en) * 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd Urethane foam molding and method for producing the same
JP6105269B2 (en) * 2012-12-11 2017-03-29 帝人フィルムソリューション株式会社 Low volume resistivity film
JP5798136B2 (en) * 2013-01-25 2015-10-21 日信工業株式会社 Method for producing thermoplastic resin composition and thermoplastic resin composition
JP6591141B2 (en) * 2013-02-20 2019-10-16 旭化成株式会社 METALLIC RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING THE SAME
JP6526939B2 (en) * 2013-06-14 2019-06-05 スターライト工業株式会社 Thermal conductive resin molding
JP6682455B2 (en) * 2015-02-04 2020-04-15 ナミックス株式会社 Thermally conductive paste and manufacturing method thereof
JP2016207424A (en) * 2015-04-21 2016-12-08 旭化成株式会社 Aluminum powder composition for conductive material paste
JP6527010B2 (en) * 2015-04-27 2019-06-05 スターライト工業株式会社 Thermally conductive resin molding and method for producing the same
KR101799573B1 (en) * 2016-02-19 2017-11-20 금호석유화학 주식회사 Conductive resin composition and plastic article using the same
US20190300771A1 (en) * 2016-09-28 2019-10-03 Teijin Limited Heat dissipation sheet
WO2021081786A1 (en) * 2019-10-30 2021-05-06 The Procter & Gamble Company Molded article with metallic appearance
JP7534398B2 (en) 2019-10-30 2024-08-14 ザ プロクター アンド ギャンブル カンパニー Molded products with a metallic appearance
EP4330321A1 (en) * 2021-04-30 2024-03-06 The Procter & Gamble Company Molded article with metallic appearance

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716072A (en) * 1980-05-26 1982-01-27 Toyo Alum Kk Metal pigment composition for electrostatic coating paint and preparation of the same
JPS6268854A (en) * 1985-09-19 1987-03-28 Toyo Alum Kk Electrically conductive resin composition
JPH07103392B2 (en) * 1987-06-29 1995-11-08 旭化成工業株式会社 Electrorheological fluid
JP3391557B2 (en) * 1993-06-25 2003-03-31 住友化学工業株式会社 Liquid crystal polyester resin composition and lamp reflector
US6238596B1 (en) * 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
JP2003113272A (en) * 2001-10-05 2003-04-18 Bridgestone Corp Thermoplastic elastomer composition and radiating sheet
JP2004176062A (en) * 2002-11-15 2004-06-24 Toray Ind Inc Tablet for optical pickup part, optical pickup part obtained therefrom, and method for preparation of the same
JP2005194317A (en) * 2003-12-26 2005-07-21 Yokohama Rubber Co Ltd:The Rubber composition
JP2005255984A (en) * 2004-02-04 2005-09-22 Toyo Aluminium Kk Colored flake pigment and paint composition containing the same
JP4768302B2 (en) * 2004-04-06 2011-09-07 三菱エンジニアリングプラスチックス株式会社 Molded body made of highly heat conductive insulating polycarbonate resin composition
JP5078053B2 (en) * 2004-11-29 2012-11-21 昭和電工株式会社 Composition for heat conductive composite material containing carbon material and use thereof
WO2006132185A1 (en) * 2005-06-06 2006-12-14 Nippon Kagaku Yakin Co., Ltd. Insulative and thermally conductive resin composition and formed article, and method for production thereof
KR100963673B1 (en) * 2007-10-23 2010-06-15 제일모직주식회사 Thermal conductive polymer composite and article using the same
JP5332464B2 (en) * 2008-09-30 2013-11-06 住友ベークライト株式会社 Resin composition and semiconductor device produced using resin composition
JP5315970B2 (en) * 2008-12-15 2013-10-16 三菱化学株式会社 Aluminum nitride having high aspect ratio, method for producing the same, and resin composition using the same

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