JP2017504177A5 - - Google Patents
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- JP2017504177A5 JP2017504177A5 JP2016519996A JP2016519996A JP2017504177A5 JP 2017504177 A5 JP2017504177 A5 JP 2017504177A5 JP 2016519996 A JP2016519996 A JP 2016519996A JP 2016519996 A JP2016519996 A JP 2016519996A JP 2017504177 A5 JP2017504177 A5 JP 2017504177A5
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- 239000002245 particle Substances 0.000 claims description 59
- 239000007771 core particle Substances 0.000 claims description 25
- 239000002131 composite material Substances 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910001593 boehmite Inorganic materials 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- 239000000454 talc Substances 0.000 claims description 4
- 229910052623 talc Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000001747 exhibiting Effects 0.000 claims description 2
- 229910021382 natural graphite Inorganic materials 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 1
Description
この成形品の横断面を電子顕微鏡で観察したとき、黒鉛含有複合物41とその表面をコートする絶縁層42とを含有する熱伝導性粒子が図4に示されるように観察された。さらに、熱伝導性粒子は樹脂43内でほとんど平行に整列された。
以下、本明細書に記載の主な発明について列記する。
(1) 複合コアと、
絶縁層とを含む熱伝導性粒子であって、
前記複合コアが複数のコア粒子と前記コア粒子を一緒に結合する有機バインダーとを含み、
前記コア粒子が熱伝導性であり、金属粒子、セラミック粒子、炭素をベースとする粒子、およびこれらの混合物からなる群から選択され、
絶縁材料が前記複合コアの少なくとも一部をコートし、
前記熱伝導性粒子が、10mmの直径および3.0mmの高さを有する前記熱伝導性粒子のシリンダー上で500Vの印加電圧で測定された時に、少なくとも1×104Ω・cm〜1×1010Ω・cmの範囲である体積抵抗率を示す、熱伝導性粒子。
(2) 前記コア粒子が炭素をベースとする粒子である、(1)に記載の熱伝導性粒子。
(3) 前記炭素をベースとする粒子が黒鉛である、(1)に記載の熱伝導性粒子。
(4) 前記コア粒子が、3:2〜99:1の比の天然黒鉛およびフレーク状の炭素をベースとする粒子であり、
前記フレーク状の炭素をベースとする粒子が、前記天然黒鉛の平均厚さよりも小さい平均厚さを有する、(1)または(2)に記載の熱伝導性粒子。
(5) 前記コア粒子が100体積部であり、
前記有機バインダーが前記コア粒子の体積の3〜25体積部の範囲であり、前記絶縁材料が前記コア粒子の4〜48体積部の範囲である、(1)または(2)に記載の熱伝導性粒子。
(6) 前記コア粒子が、3:2〜99:1の比の天然黒鉛およびフレーク状の炭素をベースとする粒子であり、
前記フレーク状の炭素をベースとする粒子が、前記天然黒鉛の平均厚さよりも小さい平均厚さを有する、(5)に記載の熱伝導性粒子。
(7) 前記有機バインダーが熱硬化性樹脂である、(1)または(2)に記載の熱伝導性粒子。
(8) 前記有機バインダーが熱硬化性樹脂である、(6)に記載の熱伝導性粒子。
(9) 前記熱伝導性粒子の平均粒径が0.5μm〜300μmの範囲である、(1)または(2)に記載の熱伝導性粒子。
(10) 前記熱伝導性粒子の平均粒径が0.5μm〜300μmの範囲である、(8)に記載の熱伝導性粒子。
(11) 前記絶縁材料が、セリサイト、ベーマイト、タルク、マイカ、およびこれらの混合物からなる群から選択される、(1)または(2)に記載の熱伝導性粒子。
(12) 前記絶縁材料が、セリサイト、ベーマイト、タルク、マイカ、およびこれらの混合物からなる群から選択される、(10)に記載の熱伝導性粒子。
(13) 複合コアを絶縁材料で少なくとも部分的にコートする工程を含む熱伝導性粒子を製造する方法であって、
前記複合コアが、複数のコア粒子と前記コア粒子を一緒に結合する有機バインダーとを含み、
前記コア粒子が熱伝導性であり、金属粒子、セラミック粒子、炭素をベースとする粒子、およびこれらの混合物からなる群から選択され、
前記絶縁材料が、セリサイト、ベーマイト、タルク、マイカ、およびこれらの混合物からなる群から選択され、
前記熱伝導性粒子が、10mmの直径および3.0mmの高さを有する前記熱伝導性粒子のシリンダー上で500Vの印加電圧で測定された時に、少なくとも1×104Ω・cm〜1×1010Ω・cmの範囲である体積抵抗率を示す、方法。
(14) 前記複合コアが、圧縮力および剪断力を適用して前記コア粒子を前記有機バインダーと混合させることによって形成される、(13)に記載の方法。
(15) 熱伝導性粒子と、
からなる群から選択される樹脂とを含む樹脂組成物であって、
前記熱伝導性粒子が複合コアと絶縁層とを含み、
前記複合コアが複数のコア粒子と前記コア粒子を一緒に結合する有機バインダーとを含み、
前記コア粒子が熱伝導性であり、金属粒子、セラミック粒子、炭素をベースとする粒子、およびこれらの混合物からなる群から選択され、
絶縁材料が前記複合コアの少なくとも一部をコートし、
前記熱伝導性粒子が、10mmの直径および3.0mmの高さを有する前記熱伝導性粒子のシリンダー上で500Vの印加電圧で測定された時に、少なくとも1×104Ω・cm〜1×1010Ω・cmの範囲である体積抵抗率を示し、
前記熱伝導性粒子が、樹脂組成物の全体積の10〜70体積%の範囲である、樹脂組成物。
When the cross section of this molded product was observed with an electron microscope, thermally conductive particles containing the graphite-containing composite 41 and the insulating layer 42 coating the surface thereof were observed as shown in FIG. Furthermore, the thermally conductive particles were aligned almost parallel in the resin 43.
The main inventions described in this specification are listed below.
(1) a composite core;
A thermally conductive particle comprising an insulating layer,
The composite core includes a plurality of core particles and an organic binder that binds the core particles together;
The core particles are thermally conductive and are selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures thereof;
An insulating material coats at least a portion of the composite core;
When the thermally conductive particles are measured at an applied voltage of 500 V on a cylinder of the thermally conductive particles having a diameter of 10 mm and a height of 3.0 mm, at least 1 × 10 4 Ω · cm to 1 × 10 6 Thermally conductive particles exhibiting a volume resistivity in the range of 10 Ω · cm.
(2) The thermally conductive particle according to (1), wherein the core particle is a carbon-based particle.
(3) The thermally conductive particles according to (1), wherein the carbon-based particles are graphite.
(4) the core particles are particles based on natural graphite and flaky carbon in a ratio of 3: 2 to 99: 1;
The thermally conductive particles according to (1) or (2), wherein the flaky carbon-based particles have an average thickness smaller than an average thickness of the natural graphite.
(5) The core particle is 100 parts by volume,
The heat conduction according to (1) or (2), wherein the organic binder is in the range of 3 to 25 parts by volume of the core particles, and the insulating material is in the range of 4 to 48 parts by volume of the core particles. Sex particles.
(6) the core particles are particles based on natural graphite and flaky carbon in a ratio of 3: 2 to 99: 1;
The thermally conductive particles according to (5), wherein the flaky carbon-based particles have an average thickness smaller than the average thickness of the natural graphite.
(7) The thermally conductive particles according to (1) or (2), wherein the organic binder is a thermosetting resin.
(8) The thermally conductive particles according to (6), wherein the organic binder is a thermosetting resin.
(9) The thermally conductive particles according to (1) or (2), wherein the average particle diameter of the thermally conductive particles is in the range of 0.5 μm to 300 μm.
(10) The thermally conductive particles according to (8), wherein the average particle diameter of the thermally conductive particles is in the range of 0.5 μm to 300 μm.
(11) The thermally conductive particles according to (1) or (2), wherein the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and a mixture thereof.
(12) The thermally conductive particles according to (10), wherein the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and a mixture thereof.
(13) A method of producing thermally conductive particles comprising the step of at least partially coating a composite core with an insulating material,
The composite core includes a plurality of core particles and an organic binder that binds the core particles together;
The core particles are thermally conductive and are selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures thereof;
The insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures thereof;
When the thermally conductive particles are measured at an applied voltage of 500 V on a cylinder of the thermally conductive particles having a diameter of 10 mm and a height of 3.0 mm, at least 1 × 10 4 Ω · cm to 1 × 10 6 A method of indicating a volume resistivity in the range of 10 Ω · cm.
(14) The method according to (13), wherein the composite core is formed by applying a compressive force and a shearing force to mix the core particles with the organic binder.
(15) thermally conductive particles;
A resin composition comprising a resin selected from the group consisting of:
The thermally conductive particles include a composite core and an insulating layer;
The composite core includes a plurality of core particles and an organic binder that binds the core particles together;
The core particles are thermally conductive and are selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures thereof;
An insulating material coats at least a portion of the composite core;
When the thermally conductive particles are measured at an applied voltage of 500 V on a cylinder of the thermally conductive particles having a diameter of 10 mm and a height of 3.0 mm, at least 1 × 10 4 Ω · cm to 1 × 10 6 Shows volume resistivity in the range of 10 Ω · cm,
The resin composition, wherein the thermally conductive particles are in the range of 10 to 70% by volume of the total volume of the resin composition.
Claims (3)
絶縁層とを含む熱伝導性粒子であって、
前記複合コアが複数のコア粒子と前記コア粒子を一緒に結合する有機バインダーとを含み、
前記コア粒子が熱伝導性であり、金属粒子、セラミック粒子、炭素をベースとする粒子、およびこれらの混合物からなる群から選択され、
絶縁材料が前記複合コアの少なくとも一部をコートし、
前記熱伝導性粒子が、10mmの直径および3.0mmの高さを有する前記熱伝導性粒子のシリンダー上で500Vの印加電圧で測定された時に、少なくとも1×104Ω・cm〜1×1010Ω・cmの範囲である体積抵抗率を示す、熱伝導性粒子。 A composite core,
A thermally conductive particle comprising an insulating layer,
The composite core includes a plurality of core particles and an organic binder that binds the core particles together;
The core particles are thermally conductive and are selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures thereof;
An insulating material coats at least a portion of the composite core;
When the thermally conductive particles are measured at an applied voltage of 500 V on a cylinder of the thermally conductive particles having a diameter of 10 mm and a height of 3.0 mm, at least 1 × 10 4 Ω · cm to 1 × 10 6 Thermally conductive particles exhibiting a volume resistivity in the range of 10 Ω · cm.
前記複合コアが、複数のコア粒子と前記コア粒子を一緒に結合する有機バインダーとを含み、
前記コア粒子が熱伝導性であり、金属粒子、セラミック粒子、炭素をベースとする粒子、およびこれらの混合物からなる群から選択され、
前記絶縁材料が、セリサイト、ベーマイト、タルク、マイカ、およびこれらの混合物からなる群から選択され、
前記熱伝導性粒子が、10mmの直径および3.0mmの高さを有する前記熱伝導性粒子のシリンダー上で500Vの印加電圧で測定された時に、少なくとも1×104Ω・cm〜1×1010Ω・cmの範囲である体積抵抗率を示す、方法。 A method of producing thermally conductive particles comprising the step of at least partially coating a composite core with an insulating material comprising:
The composite core includes a plurality of core particles and an organic binder that binds the core particles together;
The core particles are thermally conductive and are selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures thereof;
The insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures thereof;
When the thermally conductive particles are measured at an applied voltage of 500 V on a cylinder of the thermally conductive particles having a diameter of 10 mm and a height of 3.0 mm, at least 1 × 10 4 Ω · cm to 1 × 10 6 A method of indicating a volume resistivity in the range of 10 Ω · cm.
からなる群から選択される樹脂とを含む樹脂組成物であって、
前記熱伝導性粒子が複合コアと絶縁層とを含み、
前記複合コアが複数のコア粒子と前記コア粒子を一緒に結合する有機バインダーとを含み、
前記コア粒子が熱伝導性であり、金属粒子、セラミック粒子、炭素をベースとする粒子、およびこれらの混合物からなる群から選択され、
絶縁材料が前記複合コアの少なくとも一部をコートし、
前記熱伝導性粒子が、10mmの直径および3.0mmの高さを有する前記熱伝導性粒子のシリンダー上で500Vの印加電圧で測定された時に、少なくとも1×104Ω・cm〜1×1010Ω・cmの範囲である体積抵抗率を示し、
前記熱伝導性粒子が、樹脂組成物の全体積の10〜70体積%の範囲である、樹脂組成物。 Thermally conductive particles;
A resin composition comprising a resin selected from the group consisting of:
The thermally conductive particles include a composite core and an insulating layer;
The composite core includes a plurality of core particles and an organic binder that binds the core particles together;
The core particles are thermally conductive and are selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures thereof;
An insulating material coats at least a portion of the composite core;
When the thermally conductive particles are measured at an applied voltage of 500 V on a cylinder of the thermally conductive particles having a diameter of 10 mm and a height of 3.0 mm, at least 1 × 10 4 Ω · cm to 1 × 10 6 Shows volume resistivity in the range of 10 Ω · cm,
The resin composition, wherein the thermally conductive particles are in the range of 10 to 70% by volume of the total volume of the resin composition.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2013209304 | 2013-10-04 | ||
PCT/US2014/059239 WO2015051354A1 (en) | 2013-10-04 | 2014-10-06 | Thermally conductive electrically insulating particles and compositions |
Publications (3)
Publication Number | Publication Date |
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JP2017504177A JP2017504177A (en) | 2017-02-02 |
JP2017504177A5 true JP2017504177A5 (en) | 2017-08-31 |
JP6654562B2 JP6654562B2 (en) | 2020-02-26 |
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JP2016519996A Active JP6654562B2 (en) | 2013-10-04 | 2014-10-06 | Thermally conductive electrical insulating particles and compositions |
Country Status (4)
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JP (1) | JP6654562B2 (en) |
KR (1) | KR20160068762A (en) |
CN (1) | CN105764969B (en) |
WO (1) | WO2015051354A1 (en) |
Families Citing this family (9)
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KR101933417B1 (en) | 2016-12-28 | 2018-12-28 | 삼성전기 주식회사 | Dielectric Powder and Multilayered Capacitor Using the Same |
CN107445520A (en) * | 2017-07-27 | 2017-12-08 | 泾县信达工贸有限公司 | A kind of electric rice cooker heated disk thermostable heat-conductive insulating materials |
JP7236211B2 (en) * | 2017-12-15 | 2023-03-09 | 株式会社フジミインコーポレーテッド | Filler, method for producing filler, and method for producing molded product |
CN111725145A (en) * | 2020-06-16 | 2020-09-29 | 杰群电子科技(东莞)有限公司 | Semiconductor packaging structure, packaging method and electronic product |
CN111725159A (en) * | 2020-06-16 | 2020-09-29 | 杰群电子科技(东莞)有限公司 | High-heat-dissipation semiconductor product, packaging method and electronic product |
CN111725160A (en) * | 2020-06-16 | 2020-09-29 | 杰群电子科技(东莞)有限公司 | High-power semiconductor module, packaging method and electronic product |
US20220020511A1 (en) * | 2020-07-15 | 2022-01-20 | Ge Aviation Systems Llc | Method of making an insulated conductive component |
KR102411685B1 (en) * | 2020-11-30 | 2022-06-22 | 한국과학기술연구원 | Filler composite material with high insulation and heat resistance, and the method for manufacturing through dry particle-particle complexation |
JP2023047361A (en) * | 2021-09-27 | 2023-04-06 | 東特塗料株式会社 | electric insulated wire |
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US6620497B2 (en) * | 2000-01-11 | 2003-09-16 | Cool Options, Inc. | Polymer composition with boron nitride coated carbon flakes |
WO2008133172A1 (en) * | 2007-04-17 | 2008-11-06 | Hitachi High-Technologies Corporation | Composite fillers for resins |
CN101149995A (en) * | 2007-10-29 | 2008-03-26 | 苏州巨峰绝缘材料有限公司 | C-grade high heat conduction flexible composite insulation material |
JP2012124449A (en) * | 2010-11-19 | 2012-06-28 | Bando Chem Ind Ltd | Thermally conductive composite particle, thermally conductive sheet and manufacturing method therefor |
US8741998B2 (en) * | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
US8552101B2 (en) * | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
JP5660324B2 (en) * | 2011-06-20 | 2015-01-28 | 株式会社豊田中央研究所 | Resin composition and method for producing the same |
JP2013122003A (en) * | 2011-12-09 | 2013-06-20 | Sato Research Co Ltd | Heat conductive filler and manufacturing method thereof |
CN102615873A (en) * | 2012-03-07 | 2012-08-01 | 华中科技大学 | Method for preparing non-porcelain insulating heat conduction materials at low temperature |
JP5263429B1 (en) * | 2012-05-21 | 2013-08-14 | 東洋インキScホールディングス株式会社 | Thermally conductive easily deformable aggregate and method for producing the same |
JP2014065769A (en) * | 2012-09-25 | 2014-04-17 | Tokai Rubber Ind Ltd | Elastomer molding and method for producing the same |
CN103013411B (en) * | 2012-12-26 | 2013-11-13 | 赛伦(厦门)新材料科技有限公司 | Insulated and heat-conducting film adhesive and preparation method thereof |
-
2014
- 2014-10-06 WO PCT/US2014/059239 patent/WO2015051354A1/en active Application Filing
- 2014-10-06 KR KR1020167008836A patent/KR20160068762A/en not_active Application Discontinuation
- 2014-10-06 CN CN201480065537.4A patent/CN105764969B/en not_active Expired - Fee Related
- 2014-10-06 JP JP2016519996A patent/JP6654562B2/en active Active
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