WO2015051354A1 - Thermally conductive electrically insulating particles and compositions - Google Patents

Thermally conductive electrically insulating particles and compositions Download PDF

Info

Publication number
WO2015051354A1
WO2015051354A1 PCT/US2014/059239 US2014059239W WO2015051354A1 WO 2015051354 A1 WO2015051354 A1 WO 2015051354A1 US 2014059239 W US2014059239 W US 2014059239W WO 2015051354 A1 WO2015051354 A1 WO 2015051354A1
Authority
WO
WIPO (PCT)
Prior art keywords
particles
thermally conductive
core
organic binder
volume
Prior art date
Application number
PCT/US2014/059239
Other languages
French (fr)
Inventor
Yuji Saga
Takashi Hirahara
Original Assignee
E. I. Du Pont De Nemours And Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E. I. Du Pont De Nemours And Company filed Critical E. I. Du Pont De Nemours And Company
Priority to JP2016519996A priority Critical patent/JP6654562B2/en
Priority to CN201480065537.4A priority patent/CN105764969B/en
Priority to KR1020167008836A priority patent/KR20160068762A/en
Publication of WO2015051354A1 publication Critical patent/WO2015051354A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/08Ingredients agglomerated by treatment with a binding agent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/04Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/10Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002Inhomogeneous material in general
    • H01B3/004Inhomogeneous material in general with conductive additives or conductive layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • thermally conductive particles that are also electrically
  • thermally conductive particle with excellent electrical insulating properties has been sought as a building block for materials used in electronics devices.
  • WO2011/027757 discloses ceramic coated carbon particles, which are thermally conductive, and formed by adding a slurry of carbon particles to a slurry of ceramic particles, whereby the ceram ic particles adhere to the carbon particles.
  • U.S. Pat. No. 5,246,897 discloses coated graphite particles formed by a mechanical impact method in which graphite particles and coating particles are collided using high speed gas flow.
  • U.S. Pat. No. 7,588,826 discloses coated graphite particles formed by mechanical melting in the presence of an interactive functional agent.
  • thermally conductive particles that comprise a composite core and insulating material that at least partially coats the composite core, wherein the
  • composite core contains thermally conductive core particles bound together by an organic binder via mechanofusion processing, and the volume resistivity of the thermally
  • conductive particle ranges from at least ixio 4 ⁇ ⁇ cm to ixio 10 ⁇ - cm.
  • resin compositions comprising thermoplastic resin, thermosetting resin, aramid resin, rubber, or mixtures of these, and 10 to 70% by volume of these particles. Also described herein are methods of making these particles.
  • FIG. 1 is a cross-sectional drawing of thermally conductive particles recited in the claims.
  • FIG. 2 is a schematic of an apparatus that measure volume resistivity of thermally conductive particles.
  • FIG. 3 is a top-view photograph of a molded product comprising thermally
  • FIG. 4 is a cross-sectional photograph of a molded product comprising thermally conductive particles recited in the claims.
  • volume resistivity refers to electrical resistivity of a material and determines the electrical insulating capacity of a material. Volume resistivity is measured by placing the sample carbon particles in a transparent cylinder between two electrodes with terminals. In the examples herein, a voltage of 500 V was applied through the terminals to measure the resistivity of the particles described herein.
  • the term "aspect ratio" of a particle refers to the ratio of the particle's greatest length divided by its width, that is, its greatest thickness.
  • composite core refers to thermally conductive core particles bound to an organic binder by the process of mechanofusion.
  • thermal conductivity refers to the property of a material to conduct or transfer heat. Heat transfer occurs at a higher rate across materials of high thermal conductivity than across materials of low thermal conductivity. Correspondingly materials of high thermal conductivity are widely used in heat sink applications and materials of low thermal conductivity are used as thermal insulation. Thermal conductivity is typically measured as thermal conductance, which refers to the quantity of heat that passes in unit time through a plate of particular area and thickness when its opposite faces differ in temperature by one kelvin. For a plate of thermal conductivity k, area A and thickness L, the conductance calculated is kA/L, measured in W/m-K and equivalent to: W/°C.
  • p density (kg/m 3 );
  • % refers to percent. As used herein, “wt %” refers to weight percent
  • vol % refers to volume percent
  • refers to microns.
  • nm refers to nanometers.
  • rpm revolutions per minute
  • mm refers to millimeters.
  • centimeters As used herein, “cm” refers to centimeters
  • V refers to volts
  • ⁇ - cm refers to ohms - centimeters.
  • W refers to watts
  • m refers to meter
  • Kelvin As used herein, “K” refers to Kelvin
  • mPa - s refers to millipascal second
  • any range set forth herein expressly includes its endpoints unless explicitly stated otherwise. Setting forth an amount, concentration, or other value or parameter as a range specifically discloses all ranges formed from any pair of any upper range limit and any lower range lim it, regardless of whether such pairs are separately disclosed herein. The processes and articles described herein are not limited to the specific values disclosed in defining a range in the description.
  • thermally conductive particles one of which is shown as element 10 in FIG. l, which comprise a composite core made up of core particles n bonded together with an organic binder 12; and insulating material 13, which at least partially coats the composite core.
  • thermoplastic resin thermosetting resin
  • aramid resin thermosetting resin
  • rubber thermosetting resin
  • the composite core comprises a plurality of core particles and an organic binder binding the core particles together,
  • the core particles are thermally conductive and selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures of these,
  • the insulating material is selected from the group consisting of sericite, boehmite, talc, and mixtures of these, and
  • the thermally conductive particle exhibits a volume resistivity, when measured on a cylinder of said thermally conductive particles having a 10 mm diameter and a height of 3.0 mm at 500V applied voltage, which ranges from at least ixio 4 ⁇ - cm to 1 x 10 10 ⁇ - cm.
  • Binding a plurality of core particles with an organic binder using a compression shear mixing method results in a composite core, which can be prepared to have a desired particle size or shape.
  • the volume of organic binder per ioo parts by volume core particles ranges from l to 30 parts by volume, preferably from 2 to 26 parts by volume, and more preferably from 4 to 22 parts by volume.
  • the composite cores are coated, either partially or entirely, with an insulating layer, the thickness of which ranges from 0.1 to 10 ⁇ , and preferably from 0.5 to 6 ⁇ .
  • the volume of insulating material per 100 parts by volume of the composite core ranges from 3 to 48 parts, preferably from 5 to 35 parts, and more preferably from 10 to 32 parts. Such volume concentrations of the insulating material and thicknesses of the insulating coating impart to the thermally conductive particle sufficient thermal conductivity and the desired volume resistivity as recited in the claims.
  • the average particle size of the thermally conductive particles described herein ranges from 0.5 to 300 ⁇ , preferably from 20 to 250 ⁇ , and more preferably from go to 190 ⁇ . Average particle size may be determined by measuring its longest axis 14 via scanning electron microscopy (SEM).
  • FIG. 1 shows aspect ratio as the particle length (along long axis 14) divided by particle thickness 15.
  • the aspect ratio of the thermally conductive particles described herein is preferably greater than 2 and preferably ranges from 3 to about 7 When the thermally conductive particles have a flat shape, molding them with a resin into an article can give the molded article anisotropic thermal conductivity.
  • the volume resistivity of the thermally conductive particles described herein ranges from at least 1x10 ⁇ - cm ⁇ - cm and ranges preferably from i.oxio 4 to i.oxio 18 ⁇ - cm, more preferably from i.oxio 4 to i.oxio 10 ⁇ - cm.
  • any or all of the following elements may be combined to result in a wide ranging number of variants, each of which is contemplated as a recited invention:
  • the core particles may be carbon-based particles; and/or
  • the carbon-based particles are graphite;
  • the core particles are naturally occurring graphite and flaky carbon-based particles in a ratio of 3:2 to 99:1; and/or
  • the flaky carbon-based particles when a mixture of graphite and flaky carbon-based particles are used, the flaky carbon-based particles have an average thickness less than that of the naturally occurring graphite; and/or
  • the core particles are 100 parts by volume of the thermally conductive particles described herein; and/or
  • the organic binder ranges from 3 to 25 parts by volume of the volume of the core particles;
  • the insulating material ranges from 4 to 48 parts by volume of the core particles; and/or the organic binder is a thermosetting resin; and/or
  • average particle size of the thermally conductive particles described herein ranges from 0.5 ⁇ to 300 ⁇ ;
  • the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures of these; and/or
  • the thermally conductive particles range from 10 to 70% by volume of the total volume of the
  • composition comprising
  • thermoplastic resin thermosetting resin
  • aramid resin rubber
  • thermoplastic resin thermosetting resin
  • aramid resin thermosetting resin
  • rubber thermosetting resin
  • thermosetting resin thermosetting resin
  • aramid resin thermosetting resin
  • rubber thermosetting resin
  • thermosetting resin thermosetting resin
  • aramid resin thermosetting resin
  • rubber thermosetting resin
  • thermosetting resin thermosetting resin
  • aramid resin thermosetting resin
  • rubber thermosetting resin
  • thermosetting resin thermosetting resin
  • rubber or mixtures of these.
  • the composite cores exhibit sufficient thermal conductivity of at least loo W- m " K "1 and preferably less than or equal to 800 W - m "1 - K "1 .
  • the maximum value occurs with composite cores having anisotropic thermal conductivity.
  • Composite cores may comprise core particles of metal, ceramic, or carbon or mixtures of these.
  • Metal particles include, copper, silver, nickel, aluminum, of alloys of these.
  • Ceramic particles include alum inum nitride, silicon carbide, and alumina.
  • Carbon- based particles include graphite, carbon nanotubes, fullerene, graphene, carbon black, glass carbon, carbon fibers, amorphous carbon, boron carbide, or mixtures of these.
  • the composite cores include carbon-based particles.
  • Carbon-based particles preferably contain graphite, which may be natural or synthetic, with natural being preferred because of its thermal conductivity and cost.
  • the carbon-based particles comprise a mixture of graphite that is more of less spherical as well as platy shaped, aka as flaky, in a volume ratio of 3:2 to 99:1 and preferably in a volume ratio of 1:1 to 6:1 of spherical to flaky.
  • Flaky carbon-based particles that are thinner than natural graphite include expanded graphite, graphene, and mixtures of these.
  • Expanded graphite is a flaky natural graphite in which the interlaminar space is expanded by chemical and heat treatment to expand and separate graphite in the direction in which the lamina are stacked.
  • Graphene is a flaky particle in which the carbon atoms are aligned into a hexagonal lattice. T, natural graphite is several ⁇ thick, while expanded graphite and graphene are less than 1 ⁇ thick.
  • the average particle size of the composite core ranges from 1 to 150 ⁇ , preferably from 15 to 100 ⁇ , and more preferably from 30 to 90 ⁇ .
  • the average particle size of the composite core is determined by measuring the longest axis of the composite core by scanning electron microscopy (SEM).
  • the aspect ratio of the composite core ranges from preferably 1 or more, more preferably 2 or more, and even more preferably 5 or more.
  • the composite core may include two or more types of particles with different aspect ratios.
  • the composite core may be formed into a desired shape by binding one or more kinds of core particles together with an organic binder.
  • the organic binder is a polymer with a weight average molecular weight of at least 300.
  • the weight average molecular weight is preferably less than 1,000,000.
  • the type of organic binder is not specifically limited, but preferably a thermoplastic resin, thermosetting resin, or mixtures of these and more preferably a thermosetting resin.
  • Thermosetting resins include epoxy, novolac, isothiocyanate, melamine, urea, imide, aromatic polycarbodiimide, phenoxy resin, phenols, methacrylates, unsaturated polyesters, vinyl esters, urea urethane, resol, and silicone, and mixtures of these.
  • the thermosetting resin is preferably melamine.
  • the organic binder may be in solution or dispersed in a solvent.
  • the preferred solvent is water; aqueous organic binder solutions are preferred.
  • the composite core may be formed by mixing core particles and an organic binder to bind and mix the core particles to the organic binder.
  • the organic binder fills in the gaps between core particles and increases the mechanical strength of the core particles.
  • Compression shear mixing can be used when blending the core particles and organic binder and conjugating the core particles.
  • Compression shear mixing is a method that the compression force and shear force are exerted on a plurality of particles of different materials (the mixture of core particles and organic binder), causing the particles to bind to one another.
  • a Mechanofusion System Hosokawa Micron Ltd.
  • Theta Composer System
  • Mechanofusion System is used, rotating blades inside the compression vessel press core particles and organic binder against the vessel inner wall and imparting intense
  • the gap between the blades and the vessel wall ranges from 1 to 3 mm and the rotational speed of the blades ranges preferably from 1,000 rpm to 6,000 rpm, and more preferably from 1,800 rpm to 4,500 rpm.
  • Theta Composer System THC model Theta Composer, available from Tokuju Corp
  • the vessel of the system rotates in one direction while elliptical rotors inside the vessel rotate in the opposite direction, so that compression and shear are exerted in the gap between the vessel wall and the rotors to bind and the core particles with the organic binder.
  • the rotational speed of the blades ranges preferably from 1,000 rpm to 6,000 rpm, and more preferably from 1,800 rpm to 4,500 rpm.
  • the organic binder may also be thinned in advance with a solvent before mixing with core particles. By thinning the organic binder with a solvent, it is possible to bind the carbon particles with less binder.
  • the solvent may be any type as long as the solvent dissolves the organic binder. Solvents include water, isopropyl alcohol (IPA), methanol, ethanol, methylethyl ketone (MEK), methyl isobutyl ketone (MIBK), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), monoethanolamine (MEA), dipropylene glycol diacrylate (DPGDA), or mixtures of these. It is preferable that the solvent is a solution in which the organic binder will be uniformly dispersed. If the organic binder is water soluble, the solvent is preferably water.
  • the temperature of the mixing of the core particles and organic binder is not specifically limited, but depends on the type and viscosity of the organic binder.
  • the mixture temperature ranges preferably from io°C to less than 8o°C, and more preferably from 25°C to less than 50°C to avoid evaporation of the water.
  • the viscosity of the organic binder or mixture of organic binder and solvent ranges preferably from 0.5 to 1,000 mPa ⁇ s at 2o°C.
  • the composite core may achieve a desired shape by adjusting the viscosity of the organic binder and solvent during mixing.
  • the composite core is more or less flat at 0.5 to 100 mPa ⁇ s at 2o°C, and becomes more spherical in shape at 100 to 1,000 mPa ⁇ s.
  • the mixing time may be adjusted so that the core particles and organic binder suitably bind and mix with one another.
  • the mixing time ranges preferably from 1 minute to 30 minutes, and more preferably from 3 minutes to 10 minutes.
  • the insulating material of the thermally conductive particles described herein has a volume resistivity of at least ixio 9 ⁇ - cm at 20°C and preferably ixio 22 ⁇ - cm or less.
  • Suitable insulating material is not specifically limited, may be naturally occurring or synthetic and includes, without limitation, metal oxides, metal carbonates, carbonate minerals, metal nitrides, metal sulfides, phosphate minerals, clay minerals, silicate minerals, glass materials, or mixtures of these.
  • Metal oxides include aluminum oxide (Al 2 0 3 ), zinc oxide (ZnO), titanium oxide (Ti0 2 ), iron oxide (FeO), magnesium oxide (MgO), silicon oxide (Si0 2 ), boehmite ( ⁇ 2 0 3 ⁇ H 2 0), or mixtures of these.
  • Metal carbonates include calcium carbonate (CaC0 3 ), magnesium carbonate (MgC0 3 ), or mixtures of these.
  • Carbonate minerals include calcite (polymorphic CaC0 3 ), aragonite (crystalline CaC0 3 ), dolomite (CaMg(C0 3 ) 2 ), hydrotalcite (Mg 5 AI 2 C0 3 (OH) l5 - (H 2 0)), pyroaurite (Mg 5 Fe 2 (C0 3 )(OH) l5 - 4(H 2 0)), manasseite
  • Metal nitrides include boron nitride (BN), aluminum nitride (AIN), silicon nitride (Si 3 N 4 ), or mixtures of these.
  • Metal sulfides include molybdenum sulfide (MoS 2 ), tungsten sulfide (WS 2 ), zinc sulfide (ZnS), or mixtures of these.
  • Phosphate minerals include apatite (Ca 5 (P0 4 ) 3 (F, CI, OH)), hydroxyapatite (Ca 5 (P0 4 ) 3 (OH)), or mixtures of these.
  • Silicate minerals include monoclinic crystalline clay-like minerals (such as serpentine ((Mg, Fe) 3 Si 2 0 5 (OH) 4 ), pyrophyllite (AI 2 Si 4 O ao (OH) 2 ), kaolin clay, sericite (KAI 2 AISi 3 0 10 (OH) 2 ), montmorillonite ((Na, Ca) 0 . 33 (AI, Mg) 2 Si 4 0 10 (OH) 2 - nH 2 0), chlorite group minerals, talc, verm iculite, and smectite group minerals), mica, diatomite (Si0 2 - nH 2 0), or mixtures of these.
  • serpentine (Mg, Fe) 3 Si 2 0 5 (OH) 4 )
  • kaolin clay such as sericite (KAI 2 AISi 3 0 10 (OH) 2 ), montmorillonite ((Na,
  • any species of insulating material identified by a chemical formula is contemplated in the thermally conductive particles described herein.
  • Suitable insulating material include aluminum oxide (alumina), zinc oxide, talc, magnesium oxide, silicon dioxide, boehmite, boron nitride, mica, aluminum nitride, silicon nitride, zinc sulfide, or mixtures of these. More preferable insulating material include talc, boehmite, serisite, mica, or mixtures of these. Talc is particularly preferable.
  • the average particle size of the insulating material is preferably from 10 nm to 50 ⁇ , more preferably from 100 nm to 30 ⁇ , and more preferably from 300 nm to 15 ⁇ .
  • the volume concentration of the insulating material to thermally conductive core particle ranges from about 4 to about 40 volume percent, preferably from about 5 to about 30 volume percent, more preferably from about 8 to about 30 volume percent, and most preferably from about 10 to about 25 volume percent.
  • the composite core is at least partially coated by insulating material, which preferably has a volume resistivity of ixio 9 to ixio 20 ⁇ - cm.
  • Composer System may be used to coat the composite core with insulating material, which is in essence fused to the surface of the composite core by compression and shear force.
  • insulating material which is in essence fused to the surface of the composite core by compression and shear force.
  • different methods could be used to coat the composite core.
  • a mechanofusion process is used to form and coat the composite core.
  • the temperature at which the composite core is coated with insulating material ranges preferably from less than or equal to the curing temperature of the organic binder, and if solvent is used, less than or equal to the boiling point of the solvent.
  • the coating temperature preferably ranges from io°C to less than 8o°C, and more preferably from 25°C to less than 50°C.
  • the insulating material will at least partially coat the surface of the composite core, thereby resulting in thermally conducting particles described herein.
  • the duration of compressive shear mixing of the composite core with the insulating material may be adjusted so that the insulating material fuses to surface of the composite and ranges preferably from 5 seconds to 5 minutes, and more preferably, from 10 seconds to 120 seconds.
  • the insulating material preferably covers or coats the entire surface of the composite core.
  • the insulating material may cover or coat a sufficient part of the surface of the composite core to maintain a volume resistivity of the thermally conductive particles of at least ixio 4 ⁇ - cm.
  • compositions described herein include the thermally conductive particles described herein dispersed in a thermoplastic resin, thermosetting resin, aramid resin, rubber, or mixtures of these. Compositions described herein exhibit both sufficient thermal conductivity and volume resistivity for use in molded products, films, sheets, adhesives and the like. For instance, as the compositions described herein may be prepared as an insulating film and applied to the surface of an electronic part, or may be injection molded and used as the housing for heat-generating electronic parts, such as LED bulb components, and the like.
  • thermoplastic resins any suitable resin may be used in the compositions described herein and may include polyolefin resins such as polyethylene and polypropylene, polyamide resins such as nylon 6, nylon 66, nylon 610, nylon 12, and aromatic polyamides, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polycyclohexylmethylene terephthalate, cyclic polyester oligomers, ABS resin,
  • polycarbonate resin denatured polyphenylene ether resin, polyacetal resin, polyphenylene sulfide resin, wholly aromatic polyester resin, polyether etherketone resin, polyether sulfone resin, polysulfone resin, and polyamide-imide resin. Copolymers obtained by selectively combining constituents that constitute these resins may also be used.
  • thermoplastic resins may be combined.
  • the thermoplastic resin is selected from the group consisting of polyamide resin, polyester resin, polyphenylene sulfide resin and wholly aromatic polyester resin.
  • thermosetting resins any suitable resin may be used in the compositions described herein and may include epoxy resin, novolac resin, isothiocyanate resin, melamine resin, urea resin, imide resin, aromatic polycarbodiimide resin, phenoxy resin, phenol resin, methacrylate resin, unsaturated polyester resin, vinylester resin, urea urethane resin, and resol resin.
  • the thermosetting resin contains melamine resin, epoxy resin, or unsaturated polyester resin.
  • Suitable solvent include water, isopropyl alcohol (IPA), methanol, ethanol, methylethyl ketone (MEK), methyl isobutyl ketone (MIBK), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), monoethanolamine (MEA), dipropylene glycol diacrylate (DPGDA), or mixtures of these.
  • IPA isopropyl alcohol
  • MEK methylethyl ketone
  • MIBK methyl isobutyl ketone
  • PGME propylene glycol monomethyl ether
  • PGMEA propylene glycol monomethyl ether acetate
  • MEA monoethanolamine
  • DPGDA dipropylene glycol diacrylate
  • the volume of the thermally conductive particles described herein relative to the total volume of the compositions described herein ranges preferably from lo to 70% by volume, more preferably from 15 to 50% by volume, and even more preferably from 20 to 38% by volume. Sufficient thermal conductivity and volume resistivity will be obtained when the volume percent of the thermally conductive particles relative to the total volume of the compositions falls within these ranges
  • compositions described herein may contain additives, such as antioxidants, glass fibers, and lubricants.
  • the volume resistivity of articles made of the compositions described herein when measured at 500 V applied voltage, ranges preferably from ⁇ . ⁇ 10 to 1.0x1 ⁇ 18 ⁇ - cm, and more preferably from 1.0x1 ⁇ 13 to 1.0x1 ⁇ 15 ⁇ ⁇ cm.
  • the thermal conductivity of the surface of a 1 mm-thick molded product made of the compositions described herein, as estimated by the laser flash method, preferably ranges from 0.5 W/mK to 10.0 W/mK and more preferably from 1.0 W/mK to 5.0 W/mK or less.
  • thermally conductive particles described herein exhibit the recited volume resistivity because of the way they are made, that is, because of a two-step process in which: first, a composite core is made by binding together thermally conductive core particles and organic binder, as shown in Fig. 1, and then subsequently the composite core is coated at least partially by insulating material. Both steps-of preparing composite cores and of coating the composite cores— are done by compression shear mixing.
  • thermally conductive particles described herein are made by:
  • the first compression shear mixing duration may range from about 30 seconds to about 90 minutes; and the organic binder may be dissolved or suspended in a solvent, preferably water, to make an organic binder solution or suspension.
  • the second shear mixing time may range from less than 30 seconds to about 10 minutes.
  • these particles may then be heat treated for three hours at i2o°C to eliminate moisture.
  • the organic binder was a thermosetting resin, such as methylol melamine, the heating treatment may cause that resin to further crosslink.
  • the thermally conductive particles may then be added to any suitable resin or polymer as described herein to be prepared into thermally conductive resin compositions.
  • the present invention is illustrated by, but not limited to, the following examples (E) and comparative examples (C).
  • Methyol Melamine (MM) - organic binder available as Nikaresin S-i76 from Nippon Carbide Industries Co. Inc.
  • SPS Polystrene Sulfonate
  • polystyrene sulfonates available as PS-50 from Tosoh Organic Chemical.
  • BN Boron Nitride having average D50 particle size of 12 ⁇ available as SGP from Denki Kagaku.
  • PBT Polybutylene terephthalate
  • Comparative Examples was measured by the two-terminal method using the device 20 in FIG. 2.
  • a transparent cylinder 22 having a 10 mm inside diameter connected to terminal electrodes 21 in two locations on both sides was filled with graphite particles 23 to a height of 3.0 mm.
  • the filled amount was 0.2 g.
  • the surface area of the surface of one of the terminal electrodes 21 in contact with the transparent cylinder 22 was 0.785 cm 2 .
  • the volume resistivity was obtained by applying a 500 V voltage on the cylinder between the two terminals.
  • thermally conductive particles set forth in the Tables below were made using Method A. Comparative example, Ci, was made using Method B; Comparative example, C2, was made using Method B.
  • Method A 2 compression shear mixing steps to produce thermally conductive particle
  • the first step was compression shear mixing graphite and organic binder to produce the composite core; followed by a second step of compression shear mixing the composite core and insulating material.
  • Natural graphite particles and organic binder were added into a dry particle compounding apparatus (NOB-130®, available from Hosokawa Micron Ltd.) and
  • the organic binders in the Tables were obtained by dissolving or suspending the specific binder in a quantity of water used as solvent to result in an organic binder solution or suspension.
  • Insulating material which included talc, boehmite, sericite, and mica, was then added to a dry particle compounding apparatus containing the composite core, and subjected to a second compression shear mixing for 30 seconds at a rotational speed of 3,000 rpm to cause an insulating layer to partially form on the surface of the composite core, thereby to result in thermally conductive particles.
  • the thermally conductive particles were heat treated for 3 hours at i20°C to remove remaining solvent.
  • heating step caused the methylol melamine to further crosslink.
  • Method B Single compression shear mixing step: Pre-mixing organic binder and insulating material, followed by adding thermally conductive core particles and then compression shear mixing all elements
  • Talc and aqueous solution of methylolmelamine were pre-m ixed together to form a talc/methylol amine mixture. This pre-mixing was not a compression shearing step. The pre-mixture was then added to a dry particle compounding apparatus as described in Method A along with natural graphite particles and compression shear mixed for 5 minutes to form thermally conductive particles. The thermally conductive particles were heat treated for 3 hours at i2o°C to eliminate solvent, resulting in thermally conductive particles having a volume resistivity of 8xio 2 ⁇ - cm at 500V applied voltage.
  • Method B NO composite cores were first produced.
  • Method C Single compression shear mixing step: Compression shear mixing organic binder, thermally conductive core particles and insulating material together This method has no pre-mixture step and all elements were added together and compression shear mixed. Natural graphite particles, organic binder (melamine aqueous solution) and insulating material (talc) were added together to a dry particle compounding apparatus as described in Method A and compression shear mixed for 5 minutes to form thermally conductive particles.
  • thermally conductive particles were then heat treated for 3 hours at i2o°C to eliminate solvent, resulting in thermally conductive particles having a volume resistivity of 8xio 3 ⁇ - cm at 500V applied voltage.
  • Method C also relies on ONLY one compression shear step and does NOT produce com posite cores.
  • Table 1 compares the volume resistivity of thermally conductive particles prepared by mechanofusion processes A, B, and C, having the same rotating speed, curing temperature and duration .
  • Ei was prepared by mechanofusion process A and
  • mechanofusion process A achieved thermally conductive particles of the recited volume resistivity
  • mechanofusion process B or C achieved C2 and C3, which did exhibit the recited volume resistivity
  • Table 2 also shows a thermally conductive particle with two types of graphite in the composite core, E6, formed in the same manner as in E2, except that 20 parts by volume of the 100 parts by volume natural were substituted with expanded graphite.
  • the volume resistivity of E6 was 5.5x1 ⁇ 5 ⁇ cm, an improvement of almost five times over that of E2.
  • Table 3 shows that: the volume resistivity of E7 through E10 increases as the amount of talc increase.
  • the thermally conductive particles in Table 4 were formed in the same manner as for Examples 2 through 10, except that the average particle size of the talc insulating material was varied.
  • E11 had talc particles of about the same average size as in Eg.
  • E11, E12, and E13 had talc of average particle size of 650 nm, 2.4 ⁇ , and 5.05.0 ⁇ , respectively.
  • the average talc particle size for E12 was about 4 times greaterthan that for E11 (Eg).
  • the average talc particular size for E13 was about twice that for E12 and about 8 times larger than that for E11 (E8).
  • the volume resistivity of E11 (Eg) and of E12, regardless of the 4 fold difference in average insulating particle size, was substantially similar.
  • Calcium fluoride has a Mohs hardness of 4.0; boron nitride has a particle size of about 12 ⁇ ; and the titanium oxide in C5 had a spherical shape with an aspect ratio of about 1.
  • Table 5 shows that E14, E15, and E16, having as their insulating material sericite, mica, and boehmite, respectively, achieved thermally conductive particles, each having a volume resistivity of at least the recited value of ⁇ . ⁇ 4 .
  • Boehmite, sericite, and mica all have Mohs hardness values below 3.5 and particle sizes of about 5 ⁇ or less.
  • Table 6 shows the volume resistivity of thermally conductive particles having different organic binders. Each organic binder used in Table 6 produced thermally conductive particles that exhibited a volume resistivity of at least the recited value, ixio 4 ⁇ -cm at 500V applied voltage. Using methylol melamine or aqueous polyesters as the organic binder gave thermally conductive particles with the best volume resistivities.
  • Table 7 shows a resin composition in which thermally conductive particles had been dispersed in a resin and the resin composition injection molded to form an article.
  • a resin composition as described herein was prepared as follows:
  • the resin composition was injection molded at a i25°C mold temperature to produce a 21 mm long, 16 mm wide, and 1 mm thick molded article (FIG. 3).
  • Volume resistivity at the surface of the molded article of at least 1.0x1 ⁇ 14 ⁇ - cm was measured with an ohmmeter (Hiresta-UP, manufactured by Mitsubishi Chemical Corp.).
  • thermal diffusivity in the injection direction of the molded article was measured by the laser flash method in a 15 mmxi5 mm area using a Bruker AXS model LFA 447 NanoFlash ® and found to be 1.4 W/mK, when thermal diffusivity was calculated by the specific heat and density of the molded article.
  • thermally conductive particles containing a graphite-containing composite 41 and insulative layer 42 coating the surface thereof were observed as shown in FIG. 4.
  • the thermally conductive particles were aligned nearly parallel in resin 43.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A thermally conductive particle comprising (a) a composite core prepared by compression shear mixing a plurality of thermally conductive core particles and an organic binder, and (b) an insulating material that coats at least partially the composite core, wherein the volume resistivity of the thermally conductive particle ranges from at least 1x104 Ω•cm to 1x1010 Ω•cm.

Description

THERMALLY CONDUCTIVE ELECTRICALLY INSULATING PARTICLES AN D COMPOSITIONS
CROSS REFERENCE TO RELATED APPLICATIONS
This application claims the benefit of priority from Japanese Pat. App. No. 2013- 209304, filed 4 October 2013, and currently pending.
OVERVIEW
Described herein are thermally conductive particles that are also electrically
insulating, resin compositions comprising these particles, and methods for making them.
In recent years, electronic devices, like LED modules and hand helds, have become not only more miniaturized and integrated but also of greater power, which has demanded greater heat dissipation and electrical insulation of the components in these devices.
Consequently, a thermally conductive particle with excellent electrical insulating properties has been sought as a building block for materials used in electronics devices.
Int. Pat. App. Pub. No. WO2011/027757 discloses ceramic coated carbon particles, which are thermally conductive, and formed by adding a slurry of carbon particles to a slurry of ceramic particles, whereby the ceram ic particles adhere to the carbon particles. U.S. Pat. No. 5,246,897 discloses coated graphite particles formed by a mechanical impact method in which graphite particles and coating particles are collided using high speed gas flow. U.S. Pat. No. 7,588,826 discloses coated graphite particles formed by mechanical melting in the presence of an interactive functional agent.
Described herein are thermally conductive particles that comprise a composite core and insulating material that at least partially coats the composite core, wherein the
composite core contains thermally conductive core particles bound together by an organic binder via mechanofusion processing, and the volume resistivity of the thermally
conductive particle ranges from at least ixio4 Ω · cm to ixio10 Ω - cm. Also described herein are resin compositions comprising thermoplastic resin, thermosetting resin, aramid resin, rubber, or mixtures of these, and 10 to 70% by volume of these particles. Also described herein are methods of making these particles.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional drawing of thermally conductive particles recited in the claims.
FIG. 2 is a schematic of an apparatus that measure volume resistivity of thermally conductive particles.
FIG. 3 is a top-view photograph of a molded product comprising thermally
conductive particles recited in the claims.
FIG. 4 is a cross-sectional photograph of a molded product comprising thermally conductive particles recited in the claims.
DETAILED DESCRIPTION
The following definitions and abbreviations are to be used to interpret the meaning of the terms discussed in the description and recited in the claims.
Definitions
As used herein, the term "volume resistivity" refers to electrical resistivity of a material and determines the electrical insulating capacity of a material. Volume resistivity is measured by placing the sample carbon particles in a transparent cylinder between two electrodes with terminals. In the examples herein, a voltage of 500 V was applied through the terminals to measure the resistivity of the particles described herein.
As used herein, the term "aspect ratio" of a particle refers to the ratio of the particle's greatest length divided by its width, that is, its greatest thickness.
As used herein, the term "composite core" refers to thermally conductive core particles bound to an organic binder by the process of mechanofusion.
As used herein, the term "thermally conductive" or "thermal conductivity" (often denoted k, λ, or κ) refer to the property of a material to conduct or transfer heat. Heat transfer occurs at a higher rate across materials of high thermal conductivity than across materials of low thermal conductivity. Correspondingly materials of high thermal conductivity are widely used in heat sink applications and materials of low thermal conductivity are used as thermal insulation. Thermal conductivity is typically measured as thermal conductance, which refers to the quantity of heat that passes in unit time through a plate of particular area and thickness when its opposite faces differ in temperature by one kelvin. For a plate of thermal conductivity k, area A and thickness L, the conductance calculated is kA/L, measured in W/m-K and equivalent to: W/°C.
As used herein, the term "thermal diffusivity" refers to the thermal conductivity of an article divided by the density and specific heat capacity of the article at constant pressure, and measures the ability of the article to conduct thermal energy relative to its ability to store thermal energy. It has the SI unit of m2/s. Thermal diffusivity is usually denoted a. The formula is: ot = k , where
p cP,
k is thermal conductivity (W/(m K));
p is density (kg/m3); and
cp is specific heat capacity (J/(kg K)).
Abbreviations
As used herein, "%" refers to percent. As used herein, "wt %" refers to weight percent
As used herein, "vol %" refers to volume percent.
As used herein, "hrs" refers to hours; "m" refers to minute; "s" refers to seconds
As used herein, "g" refers to grams.
As used herein, "μιη" refers to microns.
As used herein, "nm" refers to nanometers.
As used herein, "rpm" refers to revolutions per minute.
As used herein, "mm" refers to millimeters.
As used herein, "cm" refers to centimeters
As used herein, "ml" refers to milliliters
As used herein, "V" refers to volts
As used herein, "Ω - cm" refers to ohms - centimeters.
As used herein, "W" refers to watts.
As used herein, "m" refers to meter
As used herein, "K" refers to Kelvin
As used herein, "mPa - s" refers to millipascal second
Ranges
Any range set forth herein expressly includes its endpoints unless explicitly stated otherwise. Setting forth an amount, concentration, or other value or parameter as a range specifically discloses all ranges formed from any pair of any upper range limit and any lower range lim it, regardless of whether such pairs are separately disclosed herein. The processes and articles described herein are not limited to the specific values disclosed in defining a range in the description.
Preferred Variants
The disclosure herein of any variants in terms of materials, methods, steps, values, and/or ranges, etc.— whether identified as preferred variants or not— of the processes, compositions and articles described herein is specifically intended to disclose any process and article that includes ANY combination of such materials, methods, steps, values, ranges, etc. For the purposes of providing photographic and sufficient support for the claims, any such disclosed combination is specifically intended to be a preferred variant of the processes, compositions, and articles described herein.
Generally
Described herein are thermally conductive particles, one of which is shown as element 10 in FIG. l, which comprise a composite core made up of core particles n bonded together with an organic binder 12; and insulating material 13, which at least partially coats the composite core.
Also described herein are resin compositions that comprise the thermally conductive particles described herein and a thermoplastic resin, thermosetting resin, aramid resin, rubber, or mixtures of these.
Also described herein are methods of coating at least partially a composite core with insulating material, wherein:
the composite core comprises a plurality of core particles and an organic binder binding the core particles together,
the core particles are thermally conductive and selected from the group consisting of metal particles, ceramic particles, carbon-based particles, and mixtures of these,
the insulating material is selected from the group consisting of sericite, boehmite, talc, and mixtures of these, and
the thermally conductive particle exhibits a volume resistivity, when measured on a cylinder of said thermally conductive particles having a 10 mm diameter and a height of 3.0 mm at 500V applied voltage, which ranges from at least ixio4 Ω - cm to 1 x 1010 Ω - cm.
Thermally Conductive Particles
Binding a plurality of core particles with an organic binder using a compression shear mixing method results in a composite core, which can be prepared to have a desired particle size or shape. The volume of organic binder per ioo parts by volume core particles ranges from l to 30 parts by volume, preferably from 2 to 26 parts by volume, and more preferably from 4 to 22 parts by volume.
The composite cores are coated, either partially or entirely, with an insulating layer, the thickness of which ranges from 0.1 to 10 μιη, and preferably from 0.5 to 6 μιη. The volume of insulating material per 100 parts by volume of the composite core ranges from 3 to 48 parts, preferably from 5 to 35 parts, and more preferably from 10 to 32 parts. Such volume concentrations of the insulating material and thicknesses of the insulating coating impart to the thermally conductive particle sufficient thermal conductivity and the desired volume resistivity as recited in the claims.
The average particle size of the thermally conductive particles described herein ranges from 0.5 to 300 μιη, preferably from 20 to 250 μιη, and more preferably from go to 190 μιη. Average particle size may be determined by measuring its longest axis 14 via scanning electron microscopy (SEM).
Aspect ratio of the thermally conductive particles described herein ranges from 1 to 100, preferably from 2 to 50, more preferably from 3 to 35, and still more preferably from 4 to 15. FIG. 1 shows aspect ratio as the particle length (along long axis 14) divided by particle thickness 15. The aspect ratio of the thermally conductive particles described herein is preferably greater than 2 and preferably ranges from 3 to about 7 When the thermally conductive particles have a flat shape, molding them with a resin into an article can give the molded article anisotropic thermal conductivity.
The volume resistivity of the thermally conductive particles described herein ranges from at least 1x10 Ω - cm Ω - cm and ranges preferably from i.oxio4 to i.oxio18 Ω - cm, more preferably from i.oxio4 to i.oxio10 Ω - cm.
In any of the thermally conductive particles, compositions or methods described herein, any or all of the following elements may be combined to result in a wide ranging number of variants, each of which is contemplated as a recited invention:
the core particles may be carbon-based particles; and/or
- the carbon-based particles are graphite; and/or
the core particles are naturally occurring graphite and flaky carbon-based particles in a ratio of 3:2 to 99:1; and/or
when a mixture of graphite and flaky carbon-based particles are used, the flaky carbon-based particles have an average thickness less than that of the naturally occurring graphite; and/or
the core particles are 100 parts by volume of the thermally conductive particles described herein; and/or
the organic binder ranges from 3 to 25 parts by volume of the volume of the core particles; and/or
- the insulating material ranges from 4 to 48 parts by volume of the core particles; and/or the organic binder is a thermosetting resin; and/or
average particle size of the thermally conductive particles described herein ranges from 0.5 μιη to 300 μιη; and/or
the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures of these; and/or
in the thermally conductive resin compositions described herein, the thermally conductive particles range from 10 to 70% by volume of the total volume of the
composition; and/or
the thermally conductive resin compositions may comprise thermoplastic resin, thermosetting resin, aramid resin, rubber, or mixtures of these. a) Composite Cores
The composite cores exhibit sufficient thermal conductivity of at least loo W- m" K"1 and preferably less than or equal to 800 W - m"1 - K"1. The maximum value occurs with composite cores having anisotropic thermal conductivity.
Core Particles
Composite cores may comprise core particles of metal, ceramic, or carbon or mixtures of these. Metal particles include, copper, silver, nickel, aluminum, of alloys of these. Ceramic particles include alum inum nitride, silicon carbide, and alumina. Carbon- based particles include graphite, carbon nanotubes, fullerene, graphene, carbon black, glass carbon, carbon fibers, amorphous carbon, boron carbide, or mixtures of these.
Preferably, the composite cores include carbon-based particles. Carbon-based particles preferably contain graphite, which may be natural or synthetic, with natural being preferred because of its thermal conductivity and cost.
In particular, the carbon-based particles comprise a mixture of graphite that is more of less spherical as well as platy shaped, aka as flaky, in a volume ratio of 3:2 to 99:1 and preferably in a volume ratio of 1:1 to 6:1 of spherical to flaky. Flaky carbon-based particles that are thinner than natural graphite include expanded graphite, graphene, and mixtures of these. Expanded graphite is a flaky natural graphite in which the interlaminar space is expanded by chemical and heat treatment to expand and separate graphite in the direction in which the lamina are stacked. Graphene is a flaky particle in which the carbon atoms are aligned into a hexagonal lattice. T, natural graphite is several μιη thick, while expanded graphite and graphene are less than 1 μιη thick.
Mixing natural graphite that is relatively thick, with flaky carbon-based particles forms a more or less flat thermally conductive composite core. Molded articles formed with resin compositions comprising more or less flat thermally conductive particles impart anisotropic paths of thermal conduction, which increases the thermal conductivity of the molded article.
The average particle size of the composite core ranges from 1 to 150 μιη, preferably from 15 to 100 μιη, and more preferably from 30 to 90 μιη. The average particle size of the composite core is determined by measuring the longest axis of the composite core by scanning electron microscopy (SEM).
The aspect ratio of the composite core ranges from preferably 1 or more, more preferably 2 or more, and even more preferably 5 or more. The composite core may include two or more types of particles with different aspect ratios. Organic binder
The composite core may be formed into a desired shape by binding one or more kinds of core particles together with an organic binder. The organic binder is a polymer with a weight average molecular weight of at least 300. The weight average molecular weight is preferably less than 1,000,000.
The type of organic binder is not specifically limited, but preferably a thermoplastic resin, thermosetting resin, or mixtures of these and more preferably a thermosetting resin. Thermosetting resins include epoxy, novolac, isothiocyanate, melamine, urea, imide, aromatic polycarbodiimide, phenoxy resin, phenols, methacrylates, unsaturated polyesters, vinyl esters, urea urethane, resol, and silicone, and mixtures of these. The thermosetting resin is preferably melamine.
The organic binder may be in solution or dispersed in a solvent. The preferred solvent is water; aqueous organic binder solutions are preferred.
Preparing Composite Cores
The composite core may be formed by mixing core particles and an organic binder to bind and mix the core particles to the organic binder. The organic binder fills in the gaps between core particles and increases the mechanical strength of the core particles.
Compression shear mixing can be used when blending the core particles and organic binder and conjugating the core particles. Compression shear mixing is a method that the compression force and shear force are exerted on a plurality of particles of different materials (the mixture of core particles and organic binder), causing the particles to bind to one another.
A Mechanofusion System (Hosokawa Micron Ltd.) or Theta Composer System
(Tokuju Corp.) may be used to provide compression shear mixing. When the
Mechanofusion System is used, rotating blades inside the compression vessel press core particles and organic binder against the vessel inner wall and imparting intense
compression and shear force to bind and mix the core particles with the organic binder.
When a dry particle composing machine, such as NOB-130® (available from
Hosokawa Micron Ltd.), is used for conjugation, the gap between the blades and the vessel wall ranges from 1 to 3 mm and the rotational speed of the blades ranges preferably from 1,000 rpm to 6,000 rpm, and more preferably from 1,800 rpm to 4,500 rpm.
When the Theta Composer System (THC model Theta Composer, available from Tokuju Corp) is used, the vessel of the system rotates in one direction while elliptical rotors inside the vessel rotate in the opposite direction, so that compression and shear are exerted in the gap between the vessel wall and the rotors to bind and the core particles with the organic binder. When the gap between the rotors and the vessel wall ranges from 1 to 3 mm, the rotational speed of the blades ranges preferably from 1,000 rpm to 6,000 rpm, and more preferably from 1,800 rpm to 4,500 rpm.
The organic binder may also be thinned in advance with a solvent before mixing with core particles. By thinning the organic binder with a solvent, it is possible to bind the carbon particles with less binder. The solvent may be any type as long as the solvent dissolves the organic binder. Solvents include water, isopropyl alcohol (IPA), methanol, ethanol, methylethyl ketone (MEK), methyl isobutyl ketone (MIBK), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), monoethanolamine (MEA), dipropylene glycol diacrylate (DPGDA), or mixtures of these. It is preferable that the solvent is a solution in which the organic binder will be uniformly dispersed. If the organic binder is water soluble, the solvent is preferably water.
The temperature of the mixing of the core particles and organic binder is not specifically limited, but depends on the type and viscosity of the organic binder. In particular, if the organic binder is an aqueous solution, the mixture temperature ranges preferably from io°C to less than 8o°C, and more preferably from 25°C to less than 50°C to avoid evaporation of the water.
The viscosity of the organic binder or mixture of organic binder and solvent ranges preferably from 0.5 to 1,000 mPa · s at 2o°C. The composite core may achieve a desired shape by adjusting the viscosity of the organic binder and solvent during mixing. The composite core is more or less flat at 0.5 to 100 mPa · s at 2o°C, and becomes more spherical in shape at 100 to 1,000 mPa · s.
The mixing time may be adjusted so that the core particles and organic binder suitably bind and mix with one another. The mixing time ranges preferably from 1 minute to 30 minutes, and more preferably from 3 minutes to 10 minutes. b) Insulating material
The insulating material of the thermally conductive particles described herein has a volume resistivity of at least ixio9 Ω - cm at 20°C and preferably ixio22 Ω - cm or less.
Suitable insulating material is not specifically limited, may be naturally occurring or synthetic and includes, without limitation, metal oxides, metal carbonates, carbonate minerals, metal nitrides, metal sulfides, phosphate minerals, clay minerals, silicate minerals, glass materials, or mixtures of these.
Metal oxides include aluminum oxide (Al203), zinc oxide (ZnO), titanium oxide (Ti02), iron oxide (FeO), magnesium oxide (MgO), silicon oxide (Si02), boehmite (ΑΙ203 · H20), or mixtures of these. Metal carbonates include calcium carbonate (CaC03), magnesium carbonate (MgC03), or mixtures of these. Carbonate minerals include calcite (polymorphic CaC03), aragonite (crystalline CaC03), dolomite (CaMg(C03)2), hydrotalcite (Mg5AI2C03(OH)l5 - (H20)), pyroaurite (Mg5Fe2(C03)(OH)l5 - 4(H20)), manasseite
(Mg5AI2(C03)(OH)l5 - H20), or mixtures of these. Metal nitrides include boron nitride (BN), aluminum nitride (AIN), silicon nitride (Si3N4), or mixtures of these. Metal sulfides include molybdenum sulfide (MoS2), tungsten sulfide (WS2), zinc sulfide (ZnS), or mixtures of these. Phosphate minerals include apatite (Ca5(P04)3(F, CI, OH)), hydroxyapatite (Ca5(P04)3(OH)), or mixtures of these. Silicate minerals include monoclinic crystalline clay-like minerals (such as serpentine ((Mg, Fe)3Si205(OH)4), pyrophyllite (AI2Si4Oao(OH)2), kaolin clay, sericite (KAI2AISi3010(OH)2), montmorillonite ((Na, Ca)0.33(AI, Mg)2Si4010(OH)2 - nH20), chlorite group minerals, talc, verm iculite, and smectite group minerals), mica, diatomite (Si02 - nH20), or mixtures of these.
Since chemical formulas of the insulating materials listed above may apply to classes of insulating material, any species of insulating material identified by a chemical formula is contemplated in the thermally conductive particles described herein.
Suitable insulating material include aluminum oxide (alumina), zinc oxide, talc, magnesium oxide, silicon dioxide, boehmite, boron nitride, mica, aluminum nitride, silicon nitride, zinc sulfide, or mixtures of these. More preferable insulating material include talc, boehmite, serisite, mica, or mixtures of these. Talc is particularly preferable.
The average particle size of the insulating material is preferably from 10 nm to 50 μιη, more preferably from 100 nm to 30 μιη, and more preferably from 300 nm to 15 μιη.
The volume concentration of the insulating material to thermally conductive core particle ranges from about 4 to about 40 volume percent, preferably from about 5 to about 30 volume percent, more preferably from about 8 to about 30 volume percent, and most preferably from about 10 to about 25 volume percent.
Coating the Composite Core with Insulating Material
The composite core is at least partially coated by insulating material, which preferably has a volume resistivity of ixio9 to ixio20 Ω - cm.
Similar to forming the composite core, a Mechanofusion System or Theta
Composer System may be used to coat the composite core with insulating material, which is in essence fused to the surface of the composite core by compression and shear force. Alternatively, different methods could be used to coat the composite core. However, to maximize manufacturing efficiency, it is preferable to use the same system to form the composite core and coat it with insulating material. Preferably, a mechanofusion process is used to form and coat the composite core.
It is preferable to engage in a two-step process whereby the core particle and organic binder first undergo compression shear mixing to form the composite core, to which is added the insulating material, which again undergoes compression shear mixing to result in the thermally conductive particles described herein. The temperature at which the composite core is coated with insulating material ranges preferably from less than or equal to the curing temperature of the organic binder, and if solvent is used, less than or equal to the boiling point of the solvent. The coating temperature preferably ranges from io°C to less than 8o°C, and more preferably from 25°C to less than 50°C. The insulating material will at least partially coat the surface of the composite core, thereby resulting in thermally conducting particles described herein.
Additionally, the duration of compressive shear mixing of the composite core with the insulating material may be adjusted so that the insulating material fuses to surface of the composite and ranges preferably from 5 seconds to 5 minutes, and more preferably, from 10 seconds to 120 seconds.
The insulating material preferably covers or coats the entire surface of the composite core. Alternatively, the insulating material may cover or coat a sufficient part of the surface of the composite core to maintain a volume resistivity of the thermally conductive particles of at least ixio4 Ω - cm. Resin compositions
Compositions described herein include the thermally conductive particles described herein dispersed in a thermoplastic resin, thermosetting resin, aramid resin, rubber, or mixtures of these. Compositions described herein exhibit both sufficient thermal conductivity and volume resistivity for use in molded products, films, sheets, adhesives and the like. For instance, as the compositions described herein may be prepared as an insulating film and applied to the surface of an electronic part, or may be injection molded and used as the housing for heat-generating electronic parts, such as LED bulb components, and the like.
As for thermoplastic resins, any suitable resin may be used in the compositions described herein and may include polyolefin resins such as polyethylene and polypropylene, polyamide resins such as nylon 6, nylon 66, nylon 610, nylon 12, and aromatic polyamides, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polycyclohexylmethylene terephthalate, cyclic polyester oligomers, ABS resin,
polycarbonate resin, denatured polyphenylene ether resin, polyacetal resin, polyphenylene sulfide resin, wholly aromatic polyester resin, polyether etherketone resin, polyether sulfone resin, polysulfone resin, and polyamide-imide resin. Copolymers obtained by selectively combining constituents that constitute these resins may also be used.
Thermoplastic resins may be combined. Preferably, the thermoplastic resin is selected from the group consisting of polyamide resin, polyester resin, polyphenylene sulfide resin and wholly aromatic polyester resin.
As for thermosetting resins, any suitable resin may be used in the compositions described herein and may include epoxy resin, novolac resin, isothiocyanate resin, melamine resin, urea resin, imide resin, aromatic polycarbodiimide resin, phenoxy resin, phenol resin, methacrylate resin, unsaturated polyester resin, vinylester resin, urea urethane resin, and resol resin. Preferably, the thermosetting resin contains melamine resin, epoxy resin, or unsaturated polyester resin.
Any suitable solvent may be added to the compositions described herein so long as it dissolves the resin or rubber or adjusts its viscosity. It is expected that most of the solvent will evaporate in a drying step. Suitable solvents include water, isopropyl alcohol (IPA), methanol, ethanol, methylethyl ketone (MEK), methyl isobutyl ketone (MIBK), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), monoethanolamine (MEA), dipropylene glycol diacrylate (DPGDA), or mixtures of these. The volume of the thermally conductive particles described herein relative to the total volume of the compositions described herein ranges preferably from lo to 70% by volume, more preferably from 15 to 50% by volume, and even more preferably from 20 to 38% by volume. Sufficient thermal conductivity and volume resistivity will be obtained when the volume percent of the thermally conductive particles relative to the total volume of the compositions falls within these ranges
Compositions described herein may contain additives, such as antioxidants, glass fibers, and lubricants.
The volume resistivity of articles made of the compositions described herein, when measured at 500 V applied voltage, ranges preferably from ι.οχιο10 to 1.0x1ο18 Ω - cm, and more preferably from 1.0x1ο13 to 1.0x1ο15 Ω · cm. The thermal conductivity of the surface of a 1 mm-thick molded product made of the compositions described herein, as estimated by the laser flash method, preferably ranges from 0.5 W/mK to 10.0 W/mK and more preferably from 1.0 W/mK to 5.0 W/mK or less.
Methods of Making the Thermally Conductive Particles Herein
The thermally conductive particles described herein exhibit the recited volume resistivity because of the way they are made, that is, because of a two-step process in which: first, a composite core is made by binding together thermally conductive core particles and organic binder, as shown in Fig. 1, and then subsequently the composite core is coated at least partially by insulating material. Both steps-of preparing composite cores and of coating the composite cores— are done by compression shear mixing.
In particular, the thermally conductive particles described herein are made by:
first, compression shear mixing in a dry particle compounding apparatus, such as NOB-130® (available from Hosokawa Micron Ltd.) thermally conductive core particles and an organic binder, both as described herein, for 5 minutes at a rotational speed of 3,000 rpm to form a composite core; and
then, compression shear mixing in the dry particle compounding apparatus the composite core and insulating material so that the surface of the composite core becomes at least partially coated by the insulating material, thereby to form the thermally conductive particles.
The first compression shear mixing duration may range from about 30 seconds to about 90 minutes; and the organic binder may be dissolved or suspended in a solvent, preferably water, to make an organic binder solution or suspension. The second shear mixing time may range from less than 30 seconds to about 10 minutes.
Preferably, these particles may then be heat treated for three hours at i2o°C to eliminate moisture. If the organic binder was a thermosetting resin, such as methylol melamine, the heating treatment may cause that resin to further crosslink. The thermally conductive particles may then be added to any suitable resin or polymer as described herein to be prepared into thermally conductive resin compositions.
EXAMPLES
The present invention is illustrated by, but not limited to, the following examples (E) and comparative examples (C).
Materials
Natural Graphite Particles - flake graphite having an average particle size of 60 μιη available as graphite X-100 fromJTO Graphite Co. Ltd.
Methyol Melamine (MM) - organic binder available as Nikaresin S-i76 from Nippon Carbide Industries Co. Inc.
Aqueous Polyester (PE) - a water soluble polyester available as Z730 from Goo Chemical. Polyamide (PA) - a polyamide suspension in water available as PA200 from
Sumitomo Seika Chemicals.
Sodium Polystrene Sulfonate (SPS) - a 20% aqueous solution of sodium
polystyrene sulfonates, available as PS-50 from Tosoh Organic Chemical.
Talc 1 - having average D50 particle size of 0.65 μιη, available as HTP Ultra 5 from IMI FABI Co., Ltd.
- Talc 2 - having average D50 particle size of 2.4 μιη, available as HTP 2C from IMI
FABI Co., Ltd.
Talc 3 - having average D50 particle size of 5 μιη, available as LMS200 from Fuji Talc Industrial.
Sericite - fine grained mica, having average D50 particle size of 1.6 μιη, available as Sericite J from Kinsei Matic, Co. Ltd.
Mica - having average D50 particle size of 5 μιη, available from Yamaguchi Mica.
Boehmite - having average D50 particle size of 3-5 μιη, available as BMF from
Kawai Line Industry.
Titanium Dioxide (Ti02) - having average D50 particle size of greater than 0.5 μιη, available as Tipure® R108 from E.I. du Pont de Nemours and Company [DuPont],
Wilmington, DE.
Boron Nitride (BN) - having average D50 particle size of 12 μιη available as SGP from Denki Kagaku.
Calcium difluoride (CaF2) - having average D50 particle size of 6 μιη available as
HO#ioo from Sankyo Seifun.
Expanded graphite - obtained from Ito Kokuen Co., Ltd. as EC300.
Polybutylene terephthalate (PBT) - available as Crastin® from DuPont. Methods
Measurement of Volume Resistivity
The volume resistivity of thermally conductive particles in the Examples and
Comparative Examples was measured by the two-terminal method using the device 20 in FIG. 2. A transparent cylinder 22 having a 10 mm inside diameter connected to terminal electrodes 21 in two locations on both sides was filled with graphite particles 23 to a height of 3.0 mm. The filled amount was 0.2 g. The surface area of the surface of one of the terminal electrodes 21 in contact with the transparent cylinder 22 was 0.785 cm2. The volume resistivity was obtained by applying a 500 V voltage on the cylinder between the two terminals.
Methods of Preparing Thermally Conductive Particles Described Herein
All examples of thermally conductive particles set forth in the Tables below were made using Method A. Comparative example, Ci, was made using Method B; Comparative example, C2, was made using Method B.
Method A: 2 compression shear mixing steps to produce thermally conductive particle
The first step was compression shear mixing graphite and organic binder to produce the composite core; followed by a second step of compression shear mixing the composite core and insulating material.
Natural graphite particles and organic binder were added into a dry particle compounding apparatus (NOB-130®, available from Hosokawa Micron Ltd.) and
compression shear mixed for 5 minutes at a rotational speed of 3,000 rpm to form a composite core. The organic binders in the Tables were obtained by dissolving or suspending the specific binder in a quantity of water used as solvent to result in an organic binder solution or suspension.
Insulating material, which included talc, boehmite, sericite, and mica, was then added to a dry particle compounding apparatus containing the composite core, and subjected to a second compression shear mixing for 30 seconds at a rotational speed of 3,000 rpm to cause an insulating layer to partially form on the surface of the composite core, thereby to result in thermally conductive particles. The thermally conductive particles were heat treated for 3 hours at i20°C to remove remaining solvent. When methylol melamine was used as the organic binder, heating step caused the methylol melamine to further crosslink.
Method B: Single compression shear mixing step: Pre-mixing organic binder and insulating material, followed by adding thermally conductive core particles and then compression shear mixing all elements
Talc and aqueous solution of methylolmelamine were pre-m ixed together to form a talc/methylol amine mixture. This pre-mixing was not a compression shearing step. The pre-mixture was then added to a dry particle compounding apparatus as described in Method A along with natural graphite particles and compression shear mixed for 5 minutes to form thermally conductive particles. The thermally conductive particles were heat treated for 3 hours at i2o°C to eliminate solvent, resulting in thermally conductive particles having a volume resistivity of 8xio2 Ω - cm at 500V applied voltage.
This method relies on ONLY one compression shear mixing step. Therefore, in Method B, NO composite cores were first produced. Method C: Single compression shear mixing step: Compression shear mixing organic binder, thermally conductive core particles and insulating material together This method has no pre-mixture step and all elements were added together and compression shear mixed. Natural graphite particles, organic binder (melamine aqueous solution) and insulating material (talc) were added together to a dry particle compounding apparatus as described in Method A and compression shear mixed for 5 minutes to form thermally conductive particles. The thermally conductive particles were then heat treated for 3 hours at i2o°C to eliminate solvent, resulting in thermally conductive particles having a volume resistivity of 8xio3 Ω - cm at 500V applied voltage. Like Method B, Method C also relies on ONLY one compression shear step and does NOT produce com posite cores.
Results
Table 1: Comparison of Mechanofusion Process and Conditions
Figure imgf000015_0001
Table 1 compares the volume resistivity of thermally conductive particles prepared by mechanofusion processes A, B, and C, having the same rotating speed, curing temperature and duration . Ei was prepared by mechanofusion process A and
demonstrates that mechanofusion process A achieved thermally conductive particles of the recited volume resistivity, while mechanofusion process B or C achieved C2 and C3, which did exhibit the recited volume resistivity.
Table 2: Effect of Varying Organic Binder Amount; Using Two Kinds of Graphite
Figure imgf000016_0001
All examples and the comparative example in Table 2 were prepared by method A and had an average length along the long axis of 131.7 μιη and average thickness of 22.5 μιη, giving an aspect ratio of 5.85. Each of E2 through E5 had a different quantity of organic binder in the composite core. C3 lacked an organic binder and exhibited a volume resistivity 5 Ω - cm. This contrasts with the minimum volume resistivity of E2 through E5, which was 1.5x1ο7 Ω· cm. Table 2 shows that, when the volume percent of the organic binder relative to the amount of thermally conductive core particles, ranges from 3 to 20, the recited volume resistivity of at least ixio4 Ω - cm is obtained.
Table 2 also shows a thermally conductive particle with two types of graphite in the composite core, E6, formed in the same manner as in E2, except that 20 parts by volume of the 100 parts by volume natural were substituted with expanded graphite. The volume resistivity of E6 was 5.5x1ο5 Ω· cm, an improvement of almost five times over that of E2.
Table 3: Effect of Varying Amount of Insulating Material
Figure imgf000016_0002
IM: Talc (parts by volume) 0 4.8 9.6 1 29
Preparation Method A A A A A
Volume Resistivity (n* cm) 20 2.2X105 6.9x1ο7 >i.7xio9 >i.7xio9
The examples in Table 3 were formed in the same manner as the examples in Table 2, except for varying the amount of insulating material. Each of E7 through E10 had differing amounts of insulating material, that is, talc. C4 lacked talc. The volume resistivity of C4 and of E7 through E10 was measured as for Examples 2 through 6.
Table 3 shows that: the volume resistivity of E7 through E10 increases as the amount of talc increase. The volume resistivity of E10, containing double the amount of talc as in Eg, was the same as that of Eg. These results show that the relatively more effective amount of insulating material ranges from about 10 to about 20 parts by volume of the total volume of the thermally conductive particles.
Table : Effect of Varying Particle Size of Talc Used as Insulating Material
Figure imgf000017_0001
The thermally conductive particles in Table 4 were formed in the same manner as for Examples 2 through 10, except that the average particle size of the talc insulating material was varied. E11 had talc particles of about the same average size as in Eg. E11, E12, and E13 had talc of average particle size of 650 nm, 2.4 μιτη, and 5.05.0 μηη, respectively. Thus, the average talc particle size for E12 was about 4 times greaterthan that for E11 (Eg). The average talc particular size for E13 was about twice that for E12 and about 8 times larger than that for E11 (E8). The volume resistivity of E11 (Eg) and of E12, regardless of the 4 fold difference in average insulating particle size, was substantially similar. However, the decrease in volume resistivity of E13 relative to that of E12 implies that, when talc is the insulating material, optimum results are achieved when the average talc particle size for ranges between 600 nm and about 3.0 μηη. Nonetheless, in all three examples, E11 through E13, the volume resistivity of the thermally conductive particles was greater than ι.οχιο8 Ω - cm, a 10,000 fold increase over the minimum recited value. Table 5: Effect of Varying Insulating Material
Figure imgf000018_0001
In Table 5, C5, C6, and C7, having as their insulating material titanium dioxide, boron nitride, and calcium fluoride, respectively, did not achieve thermally conductive particles with the recited volume resistivity. Calcium fluoride has a Mohs hardness of 4.0; boron nitride has a particle size of about 12 μιη; and the titanium oxide in C5 had a spherical shape with an aspect ratio of about 1.
By contrast, Table 5 shows that E14, E15, and E16, having as their insulating material sericite, mica, and boehmite, respectively, achieved thermally conductive particles, each having a volume resistivity of at least the recited value of ι.οχιο4. Boehmite, sericite, and mica all have Mohs hardness values below 3.5 and particle sizes of about 5 μιη or less.
Table 6: Effect of Varying Organic Binder
Figure imgf000018_0002
Solvent: Water (ml) 10 10 10 10 10
IM:Talc g(vol%) 25 (21) 25(21) 25 (21) 25 (21) 25 (19)
Preparation Method A A A A A
Rotating speed (rpm) 3000 3000 3000 3000 3000
1st Compression Shear Mixing
5imin 5 min 5imin 5 min Duration 5 min
2nd Compression Shear Mixing
1 min 30 sec 30 sec 30 sec Duration 30 sec
Curing temperature (°C) 120 120 120 120 120
Heat treatment duration (hr) 3 3 3 3 3
Volume Resistivity (Ω cm) 8.OX100 2.5x1ο9 5.0x1ο6 2.OX109 3.5x1ο4
Table 6 shows the volume resistivity of thermally conductive particles having different organic binders. Each organic binder used in Table 6 produced thermally conductive particles that exhibited a volume resistivity of at least the recited value, ixio4 Ω-cm at 500V applied voltage. Using methylol melamine or aqueous polyesters as the organic binder gave thermally conductive particles with the best volume resistivities.
Table 7: Thermal Conductivity; Volume Resistivity of Article Described Herein
Figure imgf000019_0001
Table 7 shows a resin composition in which thermally conductive particles had been dispersed in a resin and the resin composition injection molded to form an article.
A resin composition as described herein was prepared as follows:
67 parts by volume of polybutylene terephthalate resin and 7 parts by volume of polyester elastomer (of the total volume of the resin composition) were mixed for 2 minutes at 2go°C using an MC15 micromixer, manufactured by DSM Xplore. 26 parts by volume of thermally conductive particles from E10 (of the total volume of the resin composition) were added and stirred for another 30 seconds at 2go°C to produce a resin composition.
The resin composition was injection molded at a i25°C mold temperature to produce a 21 mm long, 16 mm wide, and 1 mm thick molded article (FIG. 3). Volume resistivity at the surface of the molded article of at least 1.0x1ο14 Ω - cm was measured with an ohmmeter (Hiresta-UP, manufactured by Mitsubishi Chemical Corp.). In addition, thermal diffusivity in the injection direction of the molded article was measured by the laser flash method in a 15 mmxi5 mm area using a Bruker AXS model LFA 447 NanoFlash® and found to be 1.4 W/mK, when thermal diffusivity was calculated by the specific heat and density of the molded article.
When a cross section of this molded article was observed with an electron microscope, thermally conductive particles containing a graphite-containing composite 41 and insulative layer 42 coating the surface thereof were observed as shown in FIG. 4. In addition, the thermally conductive particles were aligned nearly parallel in resin 43.

Claims

CLAIMS What is claimed is:
1. A thermally conductive particle comprising:
a composite core ; and,
an insulating layer, wherein:
the composite core comprises a plurality of core particles and an organic binder binding the core particles together,
the core particles are thermally conductive and selected from the group consisting of metal particles, ceram ic particles, carbon-based particles, and mixtures of these;
the insulating material coats at least part of the composite core, and
the thermally conductive particle exhibits a volume resistivity, when measured on a cylinder of said thermally conductive particles having a 10 mm diameter and a height of
3.0 mm at 500V applied voltage, which ranges from at least ixio4 Ω - cm to 1 x 1010 Ω - cm.
2. The thermally conductive particle of claim 1, wherein the core particles are carbon-based particles.
3. The thermally conductive particle of claim 1, wherein the carbon-based particles are graphite.
4. The thermally conductive particle of claim 1 or 2, wherein:
the core particles are naturally occurring graphite and flaky carbon-based particles in a ratio of 3:2 to 99:1, and
the flaky carbon-based particles have an average thickness less than that of the naturally occurring graphite.
5. The thermally conductive particle of claim 1 or 2, wherein:
the core particles are 100 parts by volume,
the organic binder ranges from 3 to 25 parts by volume of the volume of the core particles, and the insulating material ranges from 4 to 48 parts by volume of the core particles.
6. The thermally conductive particle according to claim 5, wherein:
the core particles are naturally occurring graphite and flaky carbon-based particles in a ratio of 3:2 to 99:1, and the flaky carbon-based particles have an average thickness less than that of the naturally occurring graphite.
7. The thermally conductive particle according to claim 1 or 2, wherein:
the organic binder is a thermosetting resin.
8. The thermally conductive particle of claim 6, wherein:
the organic binder is a thermosetting resin.
9. The thermally conductive particle according to claim 1 or 2, wherein:
average particle size of the thermally conductive particle ranges from 0.5 μιη to 300 μιη.
10. The thermally conductive particle of claim 8, wherein:
average particle size of the thermally conductive particle ranges from 0.5 μιη to 300 μιη.
11. The thermally conductive particle of claim 1 or 2, wherein:
the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures of these.
12. The thermally conductive particle of claim 10, wherein: the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures of these.
13. A method of making thermally conductive particles, comprising:
coating at least partially a composite core with insulating material,
wherein:
the composite core comprises a plurality of core particles and an organic binder binding the core particles together,
the core particles are thermally conductive and selected from the group consisting of metal particles, ceram ic particles, carbon-based particles, and mixtures of these, the insulating material is selected from the group consisting of sericite, boehmite, talc, mica, and mixtures of these, and
the thermally conductive particle exhibits a volume resistivity, when measured on a cylinder of said thermally conductive particles having a 10 mm diameter and a height of 3.0 mm at 500V applied voltage, which ranges from at least ixio4 Ω - cm to 1 x 1010 Ω - cm.
14. The method of claim 13, wherein:
the composite core was formed by applying compression force and shear force, causing the core particles to mix with the organic binder.
15. A resin composition comprising:
thermally conductive particles and
a resin selected from the group consisting of: wherein:
the thermally conductive particles comprise a composite core and an insulating layer, the composite core comprises a plurality of core particles and an organic binder binding the core particles together,
the core particles are thermally conductive and selected from the group consisting of metal particles, ceram ic particles, carbon-based particles, and mixtures of these;
the insulating material coats at least part of the composite core,
the thermally conductive particles exhibit a volume resistivity, when measured on a cylinder of said thermally conductive particles having a 10 mm diameter and a height of
3.0 mm at 500V applied voltage, that ranges from at least ixio4 Ω - cm to 1 x 1010 Ω - cm; and the thermally conductive particles range from 10 to 70% by volume of the total volume of the resin composition.
PCT/US2014/059239 2013-10-04 2014-10-06 Thermally conductive electrically insulating particles and compositions WO2015051354A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016519996A JP6654562B2 (en) 2013-10-04 2014-10-06 Thermally conductive electrical insulating particles and compositions
CN201480065537.4A CN105764969B (en) 2013-10-04 2014-10-06 Heat-conduction electric insulation particle and composition
KR1020167008836A KR20160068762A (en) 2013-10-04 2014-10-06 Thermally conductive electrically insulating particles and compositions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013209304 2013-10-04
JP2013-209304 2013-10-04

Publications (1)

Publication Number Publication Date
WO2015051354A1 true WO2015051354A1 (en) 2015-04-09

Family

ID=51743572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/059239 WO2015051354A1 (en) 2013-10-04 2014-10-06 Thermally conductive electrically insulating particles and compositions

Country Status (4)

Country Link
JP (1) JP6654562B2 (en)
KR (1) KR20160068762A (en)
CN (1) CN105764969B (en)
WO (1) WO2015051354A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10593482B2 (en) 2016-12-28 2020-03-17 Samsung Electro-Mechanics Co., Ltd. Dielectric powder and multilayer capacitor using the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107445520A (en) * 2017-07-27 2017-12-08 泾县信达工贸有限公司 A kind of electric rice cooker heated disk thermostable heat-conductive insulating materials
JP7236211B2 (en) * 2017-12-15 2023-03-09 株式会社フジミインコーポレーテッド Filler, method for producing filler, and method for producing molded product
CN111725145A (en) * 2020-06-16 2020-09-29 杰群电子科技(东莞)有限公司 Semiconductor packaging structure, packaging method and electronic product
CN111725159A (en) * 2020-06-16 2020-09-29 杰群电子科技(东莞)有限公司 High-heat-dissipation semiconductor product, packaging method and electronic product
CN111725160A (en) * 2020-06-16 2020-09-29 杰群电子科技(东莞)有限公司 High-power semiconductor module, packaging method and electronic product
US20220020511A1 (en) * 2020-07-15 2022-01-20 Ge Aviation Systems Llc Method of making an insulated conductive component
KR102411685B1 (en) * 2020-11-30 2022-06-22 한국과학기술연구원 Filler composite material with high insulation and heat resistance, and the method for manufacturing through dry particle-particle complexation
JP2023047361A (en) * 2021-09-27 2023-04-06 東特塗料株式会社 electric insulated wire

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010048172A1 (en) * 2000-01-11 2001-12-06 Smith Lyle James Polymer composition with boron nitride coated carbon flakes
US20120217434A1 (en) * 2011-02-25 2012-08-30 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US20120228542A1 (en) * 2011-02-25 2012-09-13 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
JP2013122003A (en) * 2011-12-09 2013-06-20 Sato Research Co Ltd Heat conductive filler and manufacturing method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5133338B2 (en) * 2007-04-17 2013-01-30 株式会社日立ハイテクノロジーズ Composite filler for resin mixing
CN101149995A (en) * 2007-10-29 2008-03-26 苏州巨峰绝缘材料有限公司 C-level high-thermal-conductivity flexible composite insulating material
JP2012124449A (en) * 2010-11-19 2012-06-28 Bando Chem Ind Ltd Thermally conductive composite particle, thermally conductive sheet and manufacturing method therefor
JP5660324B2 (en) * 2011-06-20 2015-01-28 株式会社豊田中央研究所 Resin composition and method for producing the same
CN102615873A (en) * 2012-03-07 2012-08-01 华中科技大学 Method for preparing non-porcelain insulating heat conduction materials at low temperature
JP5263429B1 (en) * 2012-05-21 2013-08-14 東洋インキScホールディングス株式会社 Thermally conductive easily deformable aggregate and method for producing the same
JP2014065769A (en) * 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd Elastomer molding and method for producing the same
CN103013411B (en) * 2012-12-26 2013-11-13 赛伦(厦门)新材料科技有限公司 Insulated and heat-conducting film adhesive and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010048172A1 (en) * 2000-01-11 2001-12-06 Smith Lyle James Polymer composition with boron nitride coated carbon flakes
US20120217434A1 (en) * 2011-02-25 2012-08-30 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US20120228542A1 (en) * 2011-02-25 2012-09-13 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
JP2013122003A (en) * 2011-12-09 2013-06-20 Sato Research Co Ltd Heat conductive filler and manufacturing method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
FUKUSHIMA H ET AL: "Thermal conductivity of exfoliated graphite nanocomposites", JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, KLUWER ACADEMIC PUBLISHERS, DORDRECHT, NL, vol. 85, no. 1, 3 July 2006 (2006-07-03), pages 235 - 238, XP019402546, ISSN: 1572-8943, DOI: 10.1007/S10973-005-7344-X *
P.P. MAGAMPA ET AL: "Properties of graphite composites based on natural and synthetic graphite powders and a phenolic novolac binder", JOURNAL OF NUCLEAR MATERIALS, vol. 436, no. 1-3, 4 February 2013 (2013-02-04), pages 76 - 83, XP055157848, ISSN: 0022-3115, DOI: 10.1016/j.jnucmat.2013.01.315 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10593482B2 (en) 2016-12-28 2020-03-17 Samsung Electro-Mechanics Co., Ltd. Dielectric powder and multilayer capacitor using the same
US10903013B2 (en) 2016-12-28 2021-01-26 Samsung Electro-Mechanics Co., Ltd. Dielectric powder and multilayer capacitor using the same
US11574775B2 (en) 2016-12-28 2023-02-07 Samsung Electro-Mechanics Co., Ltd. Dielectric powder and multilayer capacitor using the same

Also Published As

Publication number Publication date
CN105764969B (en) 2018-03-30
JP2017504177A (en) 2017-02-02
JP6654562B2 (en) 2020-02-26
KR20160068762A (en) 2016-06-15
CN105764969A (en) 2016-07-13

Similar Documents

Publication Publication Date Title
WO2015051354A1 (en) Thermally conductive electrically insulating particles and compositions
Nilagiri Balasubramanian et al. Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: a review
Wu et al. Multifunctional cyanate ester nanocomposites reinforced by hexagonal boron nitride after noncovalent biomimetic functionalization
Huang et al. Boron nitride@ graphene oxide hybrids for epoxy composites with enhanced thermal conductivity
JP7069485B2 (en) Hexagonal boron nitride powder and its manufacturing method, as well as compositions and radiating materials using it.
JP7096921B2 (en) Hexagonal boron nitride powder and its manufacturing method, as well as compositions and radiating materials using it.
JP5607928B2 (en) Mixed boron nitride composition and method for producing the same
JP6515030B2 (en) Composition comprising exfoliated boron nitride and method of forming the composition
JP6034876B2 (en) Highly filled high thermal conductivity material, method for producing the same, composition, coating liquid, and molded article
TWI388656B (en) Thermal conductive polymer composite and article using the same
US20170162325A1 (en) High temperature dielectric materials, method of manufacture thereof and articles comprising the same
JP7175586B2 (en) Boron nitride particle aggregate, method for producing the same, composition, and resin sheet
Yang et al. Highly thermally conductive and superior electrical insulation polymer composites via in situ thermal expansion of expanded graphite and in situ oxidation of aluminum nanoflakes
Thakur et al. Polymer nanocomposites: New advanced dielectric materials for energy storage applications
JP2019521061A (en) Alumina product and its use in high thermal conductivity polymer compositions
Shin et al. Recyclable thermoplastic hexagonal boron nitride composites with high thermal conductivity
JP7220150B2 (en) Low dielectric constant thermal conductive heat dissipation material
JP6523079B2 (en) Aluminum nitride composite filler and resin composition containing the same
JP2018030942A (en) Method for producing heat-conductive sheet
JPWO2016140330A1 (en) COMPOSITE OF LAMINATED INORGANIC COMPOUND AND ORGANIC COMPOUND AND PROCESS FOR PRODUCING THE SAME, RELAYED LAMINATED INORGANIC COMPOUND AND PROCESS FOR PRODUCING THE SAME, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATING, RESIN SHEET CURED MATERIAL
Bhat et al. Dielectric and material properties of poly (vinyl alcohol): Based modified red mud polymer nanocomposites
CN112912447A (en) Magnesium oxide, method for producing same, highly thermally conductive magnesium oxide composition, and magnesium oxide ceramic using same
JP6745521B2 (en) Magnesium oxide particles, manufacturing method thereof, and heat dissipation material
Shin et al. Recyclable Polymeric Composite with High Thermal Conductivity
KR102405336B1 (en) manufacturing method for polymer nanocomposite heat dissipation sheet and manufacturing apparatus thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14786417

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016519996

Country of ref document: JP

Kind code of ref document: A

Ref document number: 20167008836

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14786417

Country of ref document: EP

Kind code of ref document: A1