JP5795168B2 - 熱伝導性樹脂組成物及び半導体パッケージ - Google Patents

熱伝導性樹脂組成物及び半導体パッケージ Download PDF

Info

Publication number
JP5795168B2
JP5795168B2 JP2011024149A JP2011024149A JP5795168B2 JP 5795168 B2 JP5795168 B2 JP 5795168B2 JP 2011024149 A JP2011024149 A JP 2011024149A JP 2011024149 A JP2011024149 A JP 2011024149A JP 5795168 B2 JP5795168 B2 JP 5795168B2
Authority
JP
Japan
Prior art keywords
resin composition
group
conductive resin
thermally conductive
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011024149A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012162650A (ja
JP2012162650A5 (enExample
Inventor
敏充 河目
敏充 河目
誠治 山口
誠治 山口
勝 中江
勝 中江
日向子 花房
日向子 花房
秀男 白石
秀男 白石
和彦 椋木
和彦 椋木
龍央 米田
龍央 米田
直人 西田
直人 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiwa Plastic Industries Ltd
Ube Material Industries Ltd
Original Assignee
Meiwa Plastic Industries Ltd
Ube Material Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiwa Plastic Industries Ltd, Ube Material Industries Ltd filed Critical Meiwa Plastic Industries Ltd
Priority to JP2011024149A priority Critical patent/JP5795168B2/ja
Publication of JP2012162650A publication Critical patent/JP2012162650A/ja
Publication of JP2012162650A5 publication Critical patent/JP2012162650A5/ja
Application granted granted Critical
Publication of JP5795168B2 publication Critical patent/JP5795168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2011024149A 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ Active JP5795168B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011024149A JP5795168B2 (ja) 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011024149A JP5795168B2 (ja) 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2012162650A JP2012162650A (ja) 2012-08-30
JP2012162650A5 JP2012162650A5 (enExample) 2013-11-07
JP5795168B2 true JP5795168B2 (ja) 2015-10-14

Family

ID=46842362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011024149A Active JP5795168B2 (ja) 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ

Country Status (1)

Country Link
JP (1) JP5795168B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015059130A (ja) 2013-09-17 2015-03-30 明和化成株式会社 エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材
JP6156061B2 (ja) * 2013-10-29 2017-07-05 株式会社デンソー 送風装置
JP6879690B2 (ja) 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
JP6335374B2 (ja) * 2017-07-25 2018-05-30 明和化成株式会社 エポキシ樹脂組成物及びその用途
WO2022181429A1 (ja) * 2021-02-25 2022-09-01 三菱瓦斯化学株式会社 脱酸素剤粉体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185474A (ja) * 1984-10-03 1986-05-01 Daicel Chem Ind Ltd 熱伝導性樹脂組成物
JPH0710939B2 (ja) * 1985-07-17 1995-02-08 宇部興産株式会社 電子部品封止用樹脂組成物
JPS62135516A (ja) * 1985-12-09 1987-06-18 Polyplastics Co 電気部品封止剤
JPH01236270A (ja) * 1988-03-17 1989-09-21 Showa Denko Kk 樹脂組成物
JPH08143781A (ja) * 1994-11-22 1996-06-04 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JPH08157693A (ja) * 1994-12-06 1996-06-18 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH11260839A (ja) * 1998-03-16 1999-09-24 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2002038010A (ja) * 2000-07-26 2002-02-06 Idemitsu Petrochem Co Ltd 電気絶縁・放熱部品用成形材料及びそれを用いた画像形成装置用部品
JP3995421B2 (ja) * 2001-01-19 2007-10-24 株式会社ルネサステクノロジ 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JP5507477B2 (ja) * 2011-01-20 2014-05-28 パナソニック株式会社 半導体封止用エポキシ樹脂組成物および半導体装置

Also Published As

Publication number Publication date
JP2012162650A (ja) 2012-08-30

Similar Documents

Publication Publication Date Title
JP7355241B2 (ja) 半導体封止用樹脂組成物および半導体装置
JP4279521B2 (ja) 半導体封止用エポキシ樹脂組成物用金属酸化物粉体、その製造方法及び半導体封止用エポキシ樹脂組成物
JP5795168B2 (ja) 熱伝導性樹脂組成物及び半導体パッケージ
JP7155929B2 (ja) モールドアンダーフィル材料および電子装置
JP3468996B2 (ja) エポキシ樹脂組成物及び樹脂封止型半導体装置
KR20130064000A (ko) 전자 부품 밀봉용 에폭시 수지 조성물 및 그것을 사용하는 전자 부품이 장착된 장치
JP2023067951A (ja) 封止組成物及び半導体装置
JPH0418445A (ja) エポキシ樹脂組成物及びその硬化物
JP3603483B2 (ja) 半導体素子用封止材及びそれを用いた半導体装置
JP2015059130A (ja) エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材
JP4950010B2 (ja) 半導体封止用エポキシ樹脂組成物の製造方法および半導体装置の製造方法
JP5029063B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2021138864A (ja) 封止用樹脂組成物および電子装置
JP2018044079A (ja) 半導体封止用樹脂組成物および樹脂封止型半導体装置
JP2024073100A (ja) 半導体封止用の樹脂組成物およびその製造方法
JP6249332B2 (ja) 半導体封止用樹脂組成物及び半導体装置
JP7760231B2 (ja) 封止組成物及びその製造方法並びに半導体装置
JP7263765B2 (ja) 封止組成物及び半導体装置
JP5938741B2 (ja) 封止用エポキシ樹脂組成物及びその製造方法並びに半導体装置
JP2004115747A (ja) ヒートシンク形成用樹脂組成物および電子部品封止装置
JP5347979B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP7732282B2 (ja) 封止用樹脂組成物および電子装置
JP2006257309A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5592174B2 (ja) 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置
WO2019106953A1 (ja) 樹脂シート、半導体装置及び半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130917

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130917

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140428

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140523

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140722

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150209

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150731

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150812

R150 Certificate of patent or registration of utility model

Ref document number: 5795168

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250