KR20250016469A - 밀봉 조성물 및 반도체 장치 - Google Patents

밀봉 조성물 및 반도체 장치 Download PDF

Info

Publication number
KR20250016469A
KR20250016469A KR1020257001450A KR20257001450A KR20250016469A KR 20250016469 A KR20250016469 A KR 20250016469A KR 1020257001450 A KR1020257001450 A KR 1020257001450A KR 20257001450 A KR20257001450 A KR 20257001450A KR 20250016469 A KR20250016469 A KR 20250016469A
Authority
KR
South Korea
Prior art keywords
inorganic filler
particle diameter
sealing composition
mass
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257001450A
Other languages
English (en)
Korean (ko)
Inventor
겐타 이시바시
마사시 야마우라
다쿠야 고다마
미카 다나카
게이치 호리
동철 강
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250016469A publication Critical patent/KR20250016469A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020257001450A 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치 Pending KR20250016469A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2017-254883 2017-12-28
JP2017254883 2017-12-28
PCT/JP2018/047642 WO2019131669A1 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置
KR1020207018215A KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207018215A Division KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Publications (1)

Publication Number Publication Date
KR20250016469A true KR20250016469A (ko) 2025-02-03

Family

ID=67067545

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257001450A Pending KR20250016469A (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치
KR1020207018215A Active KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207018215A Active KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Country Status (5)

Country Link
JP (2) JP7238791B2 (enExample)
KR (2) KR20250016469A (enExample)
CN (1) CN111566163B (enExample)
TW (1) TWI797222B (enExample)
WO (1) WO2019131669A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7238791B2 (ja) * 2017-12-28 2023-03-14 株式会社レゾナック 封止組成物及び半導体装置
KR20230164858A (ko) 2022-05-26 2023-12-05 동우 화인켐 주식회사 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273920A (ja) 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874089B2 (ja) * 1994-04-13 1999-03-24 信越化学工業株式会社 半導体封止用樹脂組成物及び半導体装置
JP4112396B2 (ja) * 2003-02-13 2008-07-02 電気化学工業株式会社 樹脂用充填材および用途
JP4525139B2 (ja) 2004-03-31 2010-08-18 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物の製造方法。
KR101398732B1 (ko) * 2006-10-06 2014-05-27 스미토모 베이클리트 컴퍼니 리미티드 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치
JP4973322B2 (ja) * 2007-06-04 2012-07-11 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
SG190615A1 (en) * 2008-04-30 2013-06-28 Denki Kagaku Kogyo Kk Alumina powder, process for production of the same, and resin compositions containing the same
JP5407767B2 (ja) * 2009-11-04 2014-02-05 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
CN102382422B (zh) * 2010-09-01 2013-01-02 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
JP6282390B2 (ja) * 2010-12-16 2018-02-21 日立化成株式会社 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
SG11201405097QA (en) * 2012-03-29 2014-10-30 Sumitomo Bakelite Co Resin composition and semiconductor device
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
KR20160024917A (ko) * 2013-06-27 2016-03-07 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 구조체, 수지 시트 구조체 경화물, 수지 시트 구조체 경화물의 제조 방법, 반도체 장치 및 led 장치
EP3064521B1 (en) * 2014-01-08 2018-07-11 Shin-Etsu Chemical Co., Ltd Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
JP5905917B2 (ja) * 2014-03-20 2016-04-20 住友ベークライト株式会社 表面処理粒子の製造方法
JP6347653B2 (ja) * 2014-04-21 2018-06-27 新日鉄住金マテリアルズ株式会社 球状粒子の製造方法
US10294341B2 (en) * 2016-01-13 2019-05-21 Lg Chem, Ltd. Thermosetting resin composition for semiconductor package and prepreg using the same
JP7238791B2 (ja) * 2017-12-28 2023-03-14 株式会社レゾナック 封止組成物及び半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273920A (ja) 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
KR102815688B1 (ko) 2025-06-04
KR20200103682A (ko) 2020-09-02
JP7571810B2 (ja) 2024-10-23
CN111566163A (zh) 2020-08-21
TWI797222B (zh) 2023-04-01
WO2019131669A1 (ja) 2019-07-04
CN111566163B (zh) 2024-02-13
TW201934650A (zh) 2019-09-01
JP2023067951A (ja) 2023-05-16
JP7238791B2 (ja) 2023-03-14
JPWO2019131669A1 (ja) 2020-12-24

Similar Documents

Publication Publication Date Title
JP7571815B2 (ja) 封止組成物及び半導体装置
JP7571810B2 (ja) 封止組成物及び半導体装置
JP6717376B2 (ja) 封止組成物及び半導体装置
JP2008121003A (ja) 封止用エポキシ樹脂成形材料及びこれを用いた電子部品装置
JP2025032016A (ja) 封止組成物及び半導体装置
KR20220025804A (ko) 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
KR102668756B1 (ko) 밀봉 조성물 및 그의 제조 방법 그리고 반도체 장치
JP7582179B2 (ja) 封止組成物及び半導体装置
JP2019065224A (ja) 硬化性樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7263765B2 (ja) 封止組成物及び半導体装置
JP3994511B2 (ja) 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
TWI791075B (zh) 密封組成物及半導體裝置
JP7415950B2 (ja) 封止組成物及び半導体装置
JP6953973B2 (ja) 硬化性樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2024055627A (ja) 成形用樹脂組成物及び電子部品装置
CN116761833A (zh) 密封组合物及半导体装置
JP2019065225A (ja) 硬化性樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2007308690A (ja) エポキシ樹脂組成物、電子部品装置用パッケージ及び電子部品装置

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000