JP2023030756A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP2023030756A
JP2023030756A JP2021136064A JP2021136064A JP2023030756A JP 2023030756 A JP2023030756 A JP 2023030756A JP 2021136064 A JP2021136064 A JP 2021136064A JP 2021136064 A JP2021136064 A JP 2021136064A JP 2023030756 A JP2023030756 A JP 2023030756A
Authority
JP
Japan
Prior art keywords
polishing
substrate
infrared radiation
polishing pad
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2021136064A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023030756A5 (https=
Inventor
尚典 松尾
Naonori Matsuo
恵友 鈴木
Yoshitomo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Kyushu Institute of Technology NUC
Original Assignee
Ebara Corp
Kyushu Institute of Technology NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Kyushu Institute of Technology NUC filed Critical Ebara Corp
Priority to JP2021136064A priority Critical patent/JP2023030756A/ja
Priority to PCT/JP2022/027983 priority patent/WO2023026723A1/ja
Priority to KR1020247005887A priority patent/KR20240046516A/ko
Priority to US18/684,739 priority patent/US20260115856A1/en
Publication of JP2023030756A publication Critical patent/JP2023030756A/ja
Publication of JP2023030756A5 publication Critical patent/JP2023030756A5/ja
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2021136064A 2021-08-24 2021-08-24 研磨装置 Ceased JP2023030756A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021136064A JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置
PCT/JP2022/027983 WO2023026723A1 (ja) 2021-08-24 2022-07-19 研磨装置
KR1020247005887A KR20240046516A (ko) 2021-08-24 2022-07-19 연마 장치
US18/684,739 US20260115856A1 (en) 2021-08-24 2022-07-19 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021136064A JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置

Publications (2)

Publication Number Publication Date
JP2023030756A true JP2023030756A (ja) 2023-03-08
JP2023030756A5 JP2023030756A5 (https=) 2024-07-02

Family

ID=85322987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021136064A Ceased JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置

Country Status (4)

Country Link
US (1) US20260115856A1 (https=)
JP (1) JP2023030756A (https=)
KR (1) KR20240046516A (https=)
WO (1) WO2023026723A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001009699A (ja) * 1999-07-05 2001-01-16 Nichiden Mach Ltd 平面研磨装置
JP2004106174A (ja) * 2002-08-30 2004-04-08 Toray Ind Inc 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法
JP2008145133A (ja) * 2006-12-06 2008-06-26 Horiba Ltd 放射温度計
JP2009060044A (ja) * 2007-09-03 2009-03-19 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨モニタ窓
JP2009224384A (ja) * 2008-03-13 2009-10-01 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
KR20180055113A (ko) * 2016-11-16 2018-05-25 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
JP2020110859A (ja) * 2019-01-10 2020-07-27 株式会社荏原製作所 研磨装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985107B2 (ja) 2017-11-06 2021-12-22 株式会社荏原製作所 研磨方法および研磨装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001009699A (ja) * 1999-07-05 2001-01-16 Nichiden Mach Ltd 平面研磨装置
JP2004106174A (ja) * 2002-08-30 2004-04-08 Toray Ind Inc 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法
JP2008145133A (ja) * 2006-12-06 2008-06-26 Horiba Ltd 放射温度計
JP2009060044A (ja) * 2007-09-03 2009-03-19 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨モニタ窓
JP2009224384A (ja) * 2008-03-13 2009-10-01 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
KR20180055113A (ko) * 2016-11-16 2018-05-25 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
JP2020110859A (ja) * 2019-01-10 2020-07-27 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
US20260115856A1 (en) 2026-04-30
KR20240046516A (ko) 2024-04-09
WO2023026723A1 (ja) 2023-03-02

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