JP2023030756A5 - - Google Patents

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Publication number
JP2023030756A5
JP2023030756A5 JP2021136064A JP2021136064A JP2023030756A5 JP 2023030756 A5 JP2023030756 A5 JP 2023030756A5 JP 2021136064 A JP2021136064 A JP 2021136064A JP 2021136064 A JP2021136064 A JP 2021136064A JP 2023030756 A5 JP2023030756 A5 JP 2023030756A5
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JP
Japan
Prior art keywords
polishing
polishing pad
window member
substrate
radiation thermometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2021136064A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023030756A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021136064A priority Critical patent/JP2023030756A/ja
Priority claimed from JP2021136064A external-priority patent/JP2023030756A/ja
Priority to PCT/JP2022/027983 priority patent/WO2023026723A1/ja
Priority to KR1020247005887A priority patent/KR20240046516A/ko
Priority to US18/684,739 priority patent/US20260115856A1/en
Publication of JP2023030756A publication Critical patent/JP2023030756A/ja
Publication of JP2023030756A5 publication Critical patent/JP2023030756A5/ja
Ceased legal-status Critical Current

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JP2021136064A 2021-08-24 2021-08-24 研磨装置 Ceased JP2023030756A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021136064A JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置
PCT/JP2022/027983 WO2023026723A1 (ja) 2021-08-24 2022-07-19 研磨装置
KR1020247005887A KR20240046516A (ko) 2021-08-24 2022-07-19 연마 장치
US18/684,739 US20260115856A1 (en) 2021-08-24 2022-07-19 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021136064A JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置

Publications (2)

Publication Number Publication Date
JP2023030756A JP2023030756A (ja) 2023-03-08
JP2023030756A5 true JP2023030756A5 (https=) 2024-07-02

Family

ID=85322987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021136064A Ceased JP2023030756A (ja) 2021-08-24 2021-08-24 研磨装置

Country Status (4)

Country Link
US (1) US20260115856A1 (https=)
JP (1) JP2023030756A (https=)
KR (1) KR20240046516A (https=)
WO (1) WO2023026723A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001009699A (ja) * 1999-07-05 2001-01-16 Nichiden Mach Ltd 平面研磨装置
JP2004106174A (ja) * 2002-08-30 2004-04-08 Toray Ind Inc 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法
JP2008145133A (ja) * 2006-12-06 2008-06-26 Horiba Ltd 放射温度計
JP2009060044A (ja) * 2007-09-03 2009-03-19 Tokyo Seimitsu Co Ltd Cmp装置の研磨モニタ窓
JP2009224384A (ja) * 2008-03-13 2009-10-01 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
KR102626038B1 (ko) * 2016-11-16 2024-01-17 주식회사 케이씨텍 화학 기계적 연마장치
JP6985107B2 (ja) 2017-11-06 2021-12-22 株式会社荏原製作所 研磨方法および研磨装置
JP7041638B2 (ja) * 2019-01-10 2022-03-24 株式会社荏原製作所 研磨装置

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