JP2023030756A5 - - Google Patents
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- Publication number
- JP2023030756A5 JP2023030756A5 JP2021136064A JP2021136064A JP2023030756A5 JP 2023030756 A5 JP2023030756 A5 JP 2023030756A5 JP 2021136064 A JP2021136064 A JP 2021136064A JP 2021136064 A JP2021136064 A JP 2021136064A JP 2023030756 A5 JP2023030756 A5 JP 2023030756A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- window member
- substrate
- radiation thermometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021136064A JP2023030756A (ja) | 2021-08-24 | 2021-08-24 | 研磨装置 |
| PCT/JP2022/027983 WO2023026723A1 (ja) | 2021-08-24 | 2022-07-19 | 研磨装置 |
| KR1020247005887A KR20240046516A (ko) | 2021-08-24 | 2022-07-19 | 연마 장치 |
| US18/684,739 US20260115856A1 (en) | 2021-08-24 | 2022-07-19 | Polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021136064A JP2023030756A (ja) | 2021-08-24 | 2021-08-24 | 研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023030756A JP2023030756A (ja) | 2023-03-08 |
| JP2023030756A5 true JP2023030756A5 (https=) | 2024-07-02 |
Family
ID=85322987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021136064A Ceased JP2023030756A (ja) | 2021-08-24 | 2021-08-24 | 研磨装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260115856A1 (https=) |
| JP (1) | JP2023030756A (https=) |
| KR (1) | KR20240046516A (https=) |
| WO (1) | WO2023026723A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001009699A (ja) * | 1999-07-05 | 2001-01-16 | Nichiden Mach Ltd | 平面研磨装置 |
| JP2004106174A (ja) * | 2002-08-30 | 2004-04-08 | Toray Ind Inc | 研磨パッド、定盤ホールカバー及び研磨装置並びに研磨方法及び半導体デバイスの製造方法 |
| JP2008145133A (ja) * | 2006-12-06 | 2008-06-26 | Horiba Ltd | 放射温度計 |
| JP2009060044A (ja) * | 2007-09-03 | 2009-03-19 | Tokyo Seimitsu Co Ltd | Cmp装置の研磨モニタ窓 |
| JP2009224384A (ja) * | 2008-03-13 | 2009-10-01 | Toyo Tire & Rubber Co Ltd | 研磨パッド及び半導体デバイスの製造方法 |
| KR102626038B1 (ko) * | 2016-11-16 | 2024-01-17 | 주식회사 케이씨텍 | 화학 기계적 연마장치 |
| JP6985107B2 (ja) | 2017-11-06 | 2021-12-22 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
| JP7041638B2 (ja) * | 2019-01-10 | 2022-03-24 | 株式会社荏原製作所 | 研磨装置 |
-
2021
- 2021-08-24 JP JP2021136064A patent/JP2023030756A/ja not_active Ceased
-
2022
- 2022-07-19 US US18/684,739 patent/US20260115856A1/en active Pending
- 2022-07-19 KR KR1020247005887A patent/KR20240046516A/ko not_active Ceased
- 2022-07-19 WO PCT/JP2022/027983 patent/WO2023026723A1/ja not_active Ceased
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