JP2022537656A - 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板 - Google Patents

印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板 Download PDF

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Publication number
JP2022537656A
JP2022537656A JP2021572092A JP2021572092A JP2022537656A JP 2022537656 A JP2022537656 A JP 2022537656A JP 2021572092 A JP2021572092 A JP 2021572092A JP 2021572092 A JP2021572092 A JP 2021572092A JP 2022537656 A JP2022537656 A JP 2022537656A
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Japan
Prior art keywords
metal layer
cover metal
substrate side
substrate
groove
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Pending
Application number
JP2021572092A
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English (en)
Japanese (ja)
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JP2022537656A5 (cg-RX-API-DMAC10.html
Inventor
クリスティアン シュミット，
Original Assignee
ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング
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Application filed by ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2022537656A publication Critical patent/JP2022537656A/ja
Publication of JP2022537656A5 publication Critical patent/JP2022537656A5/ja
Priority to JP2026060193A priority Critical patent/JP2026117007A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0585—Second resist used as mask for selective stripping of first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021572092A 2019-07-04 2020-06-18 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板 Pending JP2022537656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2026060193A JP2026117007A (ja) 2019-07-04 2026-04-01 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019209889.4A DE102019209889A1 (de) 2019-07-04 2019-07-04 Verfahren zur Leiterplattenherstellung sowie gemäß dem Verfahren hergestellte Leiterplatten
DE102019209889.4 2019-07-04
PCT/EP2020/067042 WO2021001167A1 (de) 2019-07-04 2020-06-18 VERFAHREN ZUR LEITERPLATTENHERSTELLUNG SOWIE GEMÄß DEM VERFAHREN HERGESTELLTE LEITERPLATTEN

Related Child Applications (1)

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JP2026060193A Division JP2026117007A (ja) 2019-07-04 2026-04-01 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板

Publications (2)

Publication Number Publication Date
JP2022537656A true JP2022537656A (ja) 2022-08-29
JP2022537656A5 JP2022537656A5 (cg-RX-API-DMAC10.html) 2023-04-26

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JP2021572092A Pending JP2022537656A (ja) 2019-07-04 2020-06-18 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板
JP2026060193A Pending JP2026117007A (ja) 2019-07-04 2026-04-01 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板

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JP2026060193A Pending JP2026117007A (ja) 2019-07-04 2026-04-01 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板

Country Status (7)

Country Link
US (1) US20220361341A1 (cg-RX-API-DMAC10.html)
EP (1) EP3994963A1 (cg-RX-API-DMAC10.html)
JP (2) JP2022537656A (cg-RX-API-DMAC10.html)
CN (1) CN114009154A (cg-RX-API-DMAC10.html)
DE (1) DE102019209889A1 (cg-RX-API-DMAC10.html)
TW (1) TWI873155B (cg-RX-API-DMAC10.html)
WO (1) WO2021001167A1 (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021209939A1 (de) 2021-09-08 2023-03-09 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung und Leiterplatte
CN115884494A (zh) * 2021-09-28 2023-03-31 深南电路股份有限公司 一种线路内埋方法及线路内埋pcb板
CN114725026A (zh) * 2022-03-04 2022-07-08 苏州链芯半导体科技有限公司 一种叠加先进塑料的柔性无芯3d印刷集成电路模压工艺
CN114745845B (zh) * 2022-04-30 2023-08-08 苏州浪潮智能科技有限公司 一种印刷电路板及制造方法
DE102023116529B4 (de) * 2023-06-23 2026-05-21 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung
DE102024125859A1 (de) 2024-09-09 2026-03-12 Gebr. Schmid Gmbh Verfahren zur Herstellung mehrschichtiger Substrate mit einer integrierten Leiterstruktur und gemäss dem Verfahren herstellbare mehrschichtige Substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335585A (ja) * 1989-07-03 1991-02-15 Polyplastics Co 精密細線回路用成形品の製造方法
JPH07240568A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 回路基板およびその製造方法
JPH11103171A (ja) * 1997-07-28 1999-04-13 Hitachi Ltd 配線板及びその製造方法並びに無電解めっき方法
JP2005332928A (ja) * 2004-05-19 2005-12-02 Sumitomo Heavy Ind Ltd プリント配線板の製造方法
WO2012132325A1 (ja) * 2011-03-25 2012-10-04 住友ベークライト株式会社 プリント配線基板、プリント配線基板の製造方法および半導体装置

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DE3373256D1 (en) * 1983-05-19 1987-10-01 Ibm Deutschland Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
US5173442A (en) * 1990-07-23 1992-12-22 Microelectronics And Computer Technology Corporation Methods of forming channels and vias in insulating layers
US5244538A (en) * 1991-07-26 1993-09-14 Microelectronics And Computer Technology Corporation Method of patterning metal on a substrate using direct-write deposition of a mask
JP3361556B2 (ja) * 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
US6518160B1 (en) * 1998-02-05 2003-02-11 Tessera, Inc. Method of manufacturing connection components using a plasma patterned mask
GB2420912B (en) * 2002-12-11 2006-07-26 Dainippon Printing Co Ltd Multilayer wiring board and manufacture method thereof
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
TWI253714B (en) * 2004-12-21 2006-04-21 Phoenix Prec Technology Corp Method for fabricating a multi-layer circuit board with fine pitch
KR101022914B1 (ko) * 2008-11-04 2011-03-16 삼성전기주식회사 인쇄회로기판의 제조방법
KR101267277B1 (ko) * 2011-05-19 2013-05-24 한국기계연구원 유연기판의 금속배선 형성방법
CN102315163A (zh) * 2011-09-28 2012-01-11 上海华力微电子有限公司 超低介电常数薄膜铜互连的制作方法
US20140027163A1 (en) * 2012-07-30 2014-01-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
JP6044592B2 (ja) * 2014-05-29 2016-12-14 トヨタ自動車株式会社 多層配線基板及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335585A (ja) * 1989-07-03 1991-02-15 Polyplastics Co 精密細線回路用成形品の製造方法
JPH07240568A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 回路基板およびその製造方法
JPH11103171A (ja) * 1997-07-28 1999-04-13 Hitachi Ltd 配線板及びその製造方法並びに無電解めっき方法
JP2005332928A (ja) * 2004-05-19 2005-12-02 Sumitomo Heavy Ind Ltd プリント配線板の製造方法
WO2012132325A1 (ja) * 2011-03-25 2012-10-04 住友ベークライト株式会社 プリント配線基板、プリント配線基板の製造方法および半導体装置

Also Published As

Publication number Publication date
DE102019209889A1 (de) 2021-01-07
CN114009154A (zh) 2022-02-01
TWI873155B (zh) 2025-02-21
WO2021001167A1 (de) 2021-01-07
JP2026117007A (ja) 2026-07-14
KR20220030279A (ko) 2022-03-10
TW202109622A (zh) 2021-03-01
EP3994963A1 (de) 2022-05-11
US20220361341A1 (en) 2022-11-10

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