JP2022527399A - 作用面積を増加させたトランジスタ半導体ダイ - Google Patents
作用面積を増加させたトランジスタ半導体ダイ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 164
- 238000002161 passivation Methods 0.000 claims description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 9
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 description 79
- 229910052751 metal Inorganic materials 0.000 description 79
- 230000006872 improvement Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 239000007943 implant Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- -1 Al N Inorganic materials 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
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- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
Description
[0005]本明細書に組み込まれ、その一部を形成する添付図面は、本開示のいくつかの態様を図示し、その説明とともに、本開示の原理を説明する役割を果たす。
Claims (33)
- トランジスタ半導体ダイであって、
ドリフト層と、
前記ドリフト層上の第1の誘電体層と、
前記第1の誘電体層上の第1の金属化層であり、前記第1の金属化層の少なくとも一部が第1のコンタクトパッドを提供する第1の金属化層と、
前記第1の金属化層上の第2の誘電体層と、
前記第2の誘電体層上の第2の金属化層であり、前記第2の金属化層の少なくとも一部が第2のコンタクトパッドを提供するようにする第2の金属化層と、
前記第1の金属化層に電気的に結合され、前記第1の誘電体層によって被覆される第1の複数の電極と、
前記第2の金属化層に電気的に結合される第2の複数の電極であり、前記トランジスタ半導体ダイが前記第2のコンタクトパッドにおいて与えられた信号に基づいて前記第1のコンタクトパッドと第3のコンタクトパッドとの間に選択的に電流を伝導するように構成されるようにする第2の複数の電極と、
を備えるトランジスタ半導体ダイ。 - 前記トランジスタ半導体ダイは、順方向伝導モードの動作時に前記第1のコンタクトパッドと前記第3のコンタクトパッドとの間で0.5Aを上回るものを伝導し、阻止モードの動作時に前記第1のコンタクトパッドと前記第3のコンタクトパッドとの間で100Vを上回るものを阻止するように構成される、請求項1に記載のトランジスタ半導体ダイ。
- 前記ドリフト層は炭化ケイ素を含む、請求項1に記載のトランジスタ半導体ダイ。
- 前記第2の金属化層上にパッシベーション層をさらに備え、前記第1のコンタクトパッドおよび前記第2のコンタクトパッドが前記パッシベーション層を通して露出されるようにする、請求項1に記載のトランジスタ半導体ダイ。
- 前記トランジスタ半導体ダイは、金属-酸化物-半導体電界効果トランジスタ(MOSFET)である、請求項1に記載のトランジスタ半導体ダイ。
- 前記トランジスタ半導体ダイは、絶縁ゲート型バイポーラトランジスタ(IGBT)である、請求項1に記載のトランジスタ半導体ダイ。
- 前記トランジスタ半導体ダイは、バイポーラ接合トランジスタである、請求項1に記載のトランジスタ半導体ダイ。
- 前記第3のコンタクトパッドがドリフト層に対して前記第1のコンタクトパッドおよび前記第2のコンタクトパッドとは反対側に存在するように、前記トランジスタ半導体ダイが垂直トランジスタデバイスを実現する、請求項1に記載のトランジスタ半導体ダイ。
- 前記第3のコンタクトパッドが前記第1のコンタクトパッドに隣り合った前記第1の誘電体層に存在するように、前記トランジスタ半導体ダイは水平トランジスタデバイスを実現する、請求項1に記載のトランジスタ半導体ダイ。
- 縁端領域と、
前記縁端領域内のデバイス領域と、をさらに備え、前記デバイス領域内の合計非作用面積は前記第2のコンタクトパッドの面積より小さい、
請求項1に記載のトランジスタ半導体ダイ。 - 前記第2の金属化層は、前記第1の誘電体層および前記第2の誘電体層を通って1つまたは複数のバイアによって前記第2の複数の電極と結合される、請求項1に記載のトランジスタ半導体ダイ。
- 前記第2の誘電体層に1つまたは複数のセンサコンタクトパッドをさらに備える、請求項1に記載のトランジスタ半導体ダイ。
- 前記1つまたは複数のセンサコンタクトパッドは前記第2の誘電体層上のセンサに結合される、請求項12に記載のトランジスタ半導体ダイ。
- 前記センサは、温度センサ、歪みセンサ、および電流センサのうちの1つまたは複数である、請求項13に記載のトランジスタ半導体ダイ。
- 前記1つまたは複数のセンサコンタクトパッドは、前記第1の誘電体層および前記第2の誘電体層を介して、1つまたは複数のバイアによってドリフト層中のセンサに結合される、請求項12に記載のトランジスタ半導体ダイ。
- 前記センサは、温度センサ、歪みセンサ、および電流センサのうちの1つまたは複数である、請求項15に記載のトランジスタ半導体ダイ。
- 前記1つまたは複数のセンサコンタクトパッドの少なくとも一部は、前記第1の金属化層に重なる、請求項12に記載のトランジスタ半導体ダイ。
- 前記第1のコンタクトパッドの面積は少なくとも0.4mm2である、請求項12に記載のトランジスタ半導体ダイ。
- 前記第2の金属化層の少なくとも一部は前記第1の金属化層に重なる、請求項1に記載のトランジスタ半導体ダイ。
- 前記第1の誘電体層および前記第2の誘電体層は、SiO2、Al2O3、およびSi3N4のうちの1つまたは複数を含む、請求項1に記載のトランジスタ半導体ダイ。
- 前記第1の誘電体層は、前記第2の誘電体層とは異なる組成を有する、請求項20に記載のトランジスタ半導体ダイ。
- 前記第1の誘電体層と前記第2の誘電体層との間に介在層をさらに備え、前記介在層が前記第1の金属化層と前記第2の金属化層との間にあるようにする、請求項1に記載のトランジスタ半導体ダイ。
- 前記第1の誘電体層、前記第2の誘電体層、および前記介在層は、SiO2、Al2O3、およびSi3N4のうちの1つまたは複数を含み、
前記介在層は、前記第1の誘電体層および前記第2の誘電体層とは異なる組成を有する、
請求項22に記載のトランジスタ半導体ダイ。 - 前記第2の誘電体層と前記第2の金属化層との間に追加介在層をさらに備える、請求項22に記載のトランジスタ半導体ダイ。
- 前記第1の誘電体層、前記第2の誘電体層、前記介在層、および前記追加介在層は、SiO2、Al2O3、およびSi3N4のうちの1つまたは複数を含み、
前記介在層および前記追加介在層は、前記第1の誘電体層および前記第2の誘電体層とは異なる組成を有する、
請求項24に記載のトランジスタ半導体ダイ。 - 前記トランジスタ半導体ダイは垂直トランジスタデバイスである、請求項1に記載のトランジスタ半導体ダイ。
- トランジスタ半導体ダイであって、
第1のコンタクトパッド、第2のコンタクトパッド、および第3のコンタクトパッドと、
前記トランジスタ半導体ダイが、前記第2のコンタクトパッドにおいて与えられた信号に基づいて前記第1のコンタクトパッドと前記第3のコンタクトパッドとの間で電流を選択的に伝導するように構成されるように、前記第1のコンタクトパッド、前記第2のコンタクトパッド、および前記第3のコンタクトパッドのうちの1つまたは複数に結合された1つまたは複数の領域を含むデバイス領域と、を備え
前記第1のコンタクトパッドおよび前記第2のコンタクトパッドは、前記トランジスタ半導体ダイの同一の側に配置され、
前記デバイス領域内の合計非作用面積は前記第2のコンタクトパッドの面積より小さい、
トランジスタ半導体ダイ。 - 前記第1のコンタクトパッドの面積は少なくとも0.4mm2である、請求項27に記載のトランジスタ半導体ダイ。
- 前記トランジスタ半導体ダイは、順方向伝導モードの動作時に前記第1のコンタクトパッドと前記第3のコンタクトパッドとの間で0.5Aを上回るものを伝導し、阻止モードの動作時に前記第1のコンタクトパッドと前記第3のコンタクトパッドとの間で100Vを上回るものを阻止するように構成される、請求項27に記載のトランジスタ半導体ダイ。
- 前記トランジスタ半導体ダイは垂直半導体デバイスである、請求項27に記載のトランジスタ半導体ダイ。
- 縁端領域をさらに含み、前記デバイス領域は前記縁端領域内にある、請求項27に記載のトランジスタ半導体ダイ。
- トランジスタ半導体ダイであって、
基板と、
前記基板上のドリフト層と、
垂直トランジスタデバイスが形成されるように、デバイス領域内の前記ドリフト層中の1つまたは複数の注入領域と、
前記トランジスタ半導体ダイと一体化したセンサと、
前記センサに電気的に結合されたセンサコンタクトパッドと、を備え、前記デバイス領域内の合計非作用面積は前記センサコンタクトパッドの面積より小さい、
トランジスタ半導体ダイ。 - 前記センサは、温度センサ、歪みセンサ、および電流センサのうちの1つである、請求項32に記載のトランジスタ半導体ダイ。
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