JP2022512914A5 - - Google Patents
Info
- Publication number
- JP2022512914A5 JP2022512914A5 JP2021524024A JP2021524024A JP2022512914A5 JP 2022512914 A5 JP2022512914 A5 JP 2022512914A5 JP 2021524024 A JP2021524024 A JP 2021524024A JP 2021524024 A JP2021524024 A JP 2021524024A JP 2022512914 A5 JP2022512914 A5 JP 2022512914A5
- Authority
- JP
- Japan
- Prior art keywords
- filter
- inductor
- capacitance
- frequency
- filter stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862758362P | 2018-11-09 | 2018-11-09 | |
| US62/758,362 | 2018-11-09 | ||
| PCT/US2019/055314 WO2020096723A1 (en) | 2018-11-09 | 2019-10-09 | Radio frequency filter system for a processing chamber |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022512914A JP2022512914A (ja) | 2022-02-07 |
| JP2022512914A5 true JP2022512914A5 (https=) | 2022-10-20 |
| JP7455825B2 JP7455825B2 (ja) | 2024-03-26 |
Family
ID=70551835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524024A Active JP7455825B2 (ja) | 2018-11-09 | 2019-10-09 | 処理チャンバ用の高周波フィルタシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10840062B2 (https=) |
| JP (1) | JP7455825B2 (https=) |
| KR (1) | KR102765819B1 (https=) |
| CN (1) | CN112913140B (https=) |
| TW (1) | TWI848999B (https=) |
| WO (1) | WO2020096723A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| KR20240015167A (ko) | 2014-10-17 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| US11361941B2 (en) * | 2020-06-19 | 2022-06-14 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
| CN113921360B (zh) * | 2020-07-10 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置中的加热装置及抗射频干扰方法 |
| KR102603678B1 (ko) * | 2020-10-13 | 2023-11-21 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| US12198908B2 (en) * | 2021-05-11 | 2025-01-14 | Applied Materials, Inc. | Magnetically coupled RF filter for substrate processing chambers |
| KR102770730B1 (ko) * | 2021-12-30 | 2025-02-24 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| CN115979533A (zh) * | 2022-11-17 | 2023-04-18 | 北京北方华创微电子装备有限公司 | 漏率检测方法及半导体工艺设备 |
| KR20250074015A (ko) * | 2023-11-20 | 2025-05-27 | 피에스케이 주식회사 | 기판 처리 장치, 기판 처리 장치의 제어 방법 및 기판 처리 방법 |
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| JPS616914A (ja) * | 1984-06-20 | 1986-01-13 | Yukio Kanbe | 無線局の電波による音声混入障害対策用フイルタ− |
| JPH08130100A (ja) * | 1994-10-27 | 1996-05-21 | Kokusai Electric Co Ltd | プラズマ処理装置の電極構造 |
| US5835990A (en) * | 1995-06-16 | 1998-11-10 | Northern Telecom Limited | Longitudinally coupled double mode surface wave resonators |
| JP4256483B2 (ja) * | 1996-07-19 | 2009-04-22 | アプライド マテリアルズ インコーポレイテッド | 静電チャック、集積回路デバイスを製造するための装置、及び静電チャックの製造方法 |
| US6136388A (en) | 1997-12-01 | 2000-10-24 | Applied Materials, Inc. | Substrate processing chamber with tunable impedance |
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| US7280009B2 (en) * | 2005-04-13 | 2007-10-09 | The Boeing Company | Radio frequency filter systems and methods |
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| JP6027374B2 (ja) * | 2012-09-12 | 2016-11-16 | 東京エレクトロン株式会社 | プラズマ処理装置及びフィルタユニット |
| JP6050722B2 (ja) * | 2013-05-24 | 2016-12-21 | 東京エレクトロン株式会社 | プラズマ処理装置及びフィルタユニット |
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| CN107112615B (zh) * | 2014-12-31 | 2019-11-26 | 深圳市大富科技股份有限公司 | 腔体滤波器、双工器、信号收发装置、射频拉远设备和塔顶放大器 |
| US10298196B2 (en) * | 2015-07-28 | 2019-05-21 | Qorvo Us, Inc. | RF filtering circuitry |
| US9923584B2 (en) * | 2015-09-03 | 2018-03-20 | Qualcomm Incorporated | Rectifiers for wireless power transfer with impedance inverting filters for reduced electromagnetic interference |
| US9741539B2 (en) * | 2015-10-05 | 2017-08-22 | Applied Materials, Inc. | RF power delivery regulation for processing substrates |
| US9966231B2 (en) * | 2016-02-29 | 2018-05-08 | Lam Research Corporation | Direct current pulsing plasma systems |
| CN105978533A (zh) * | 2016-06-18 | 2016-09-28 | 南通尚青医疗科技有限公司 | 一种复合滤波器 |
| JP2018078515A (ja) | 2016-11-11 | 2018-05-17 | 東京エレクトロン株式会社 | フィルタ装置及びプラズマ処理装置 |
| US10435789B2 (en) * | 2016-12-06 | 2019-10-08 | Asm Ip Holding B.V. | Substrate treatment apparatus |
| KR20190133276A (ko) * | 2017-04-21 | 2019-12-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 전극 조립체 |
| JP7029340B2 (ja) | 2017-04-25 | 2022-03-03 | 東京エレクトロン株式会社 | フィルタ装置及びプラズマ処理装置 |
| US11447868B2 (en) * | 2017-05-26 | 2022-09-20 | Applied Materials, Inc. | Method for controlling a plasma process |
| JP6832800B2 (ja) | 2017-06-21 | 2021-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP6865128B2 (ja) | 2017-07-19 | 2021-04-28 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US10715095B2 (en) * | 2017-10-06 | 2020-07-14 | Lam Research Corporation | Radiofrequency (RF) filter for multi-frequency RF bias |
| CN111226393B (zh) * | 2017-10-24 | 2023-10-24 | Rf360新加坡私人有限公司 | Rf滤波器和设计rf滤波器的方法 |
| US11456160B2 (en) | 2018-03-26 | 2022-09-27 | Tokyo Electron Limited | Plasma processing apparatus |
| JP7061511B2 (ja) | 2018-05-10 | 2022-04-28 | 東京エレクトロン株式会社 | フィルタ装置及びプラズマ処理装置 |
-
2019
- 2019-10-09 KR KR1020217017422A patent/KR102765819B1/ko active Active
- 2019-10-09 JP JP2021524024A patent/JP7455825B2/ja active Active
- 2019-10-09 CN CN201980069837.2A patent/CN112913140B/zh active Active
- 2019-10-09 WO PCT/US2019/055314 patent/WO2020096723A1/en not_active Ceased
- 2019-10-14 US US16/601,241 patent/US10840062B2/en active Active
- 2019-11-05 TW TW108140075A patent/TWI848999B/zh active
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