JP2012238593A5 - - Google Patents

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Publication number
JP2012238593A5
JP2012238593A5 JP2012105137A JP2012105137A JP2012238593A5 JP 2012238593 A5 JP2012238593 A5 JP 2012238593A5 JP 2012105137 A JP2012105137 A JP 2012105137A JP 2012105137 A JP2012105137 A JP 2012105137A JP 2012238593 A5 JP2012238593 A5 JP 2012238593A5
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JP
Japan
Prior art keywords
electrode bus
bus
coupled
processing system
plasma processing
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Granted
Application number
JP2012105137A
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English (en)
Japanese (ja)
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JP2012238593A (ja
JP6068825B2 (ja
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Publication date
Priority claimed from US13/100,605 external-priority patent/US8333166B2/en
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Publication of JP2012238593A publication Critical patent/JP2012238593A/ja
Publication of JP2012238593A5 publication Critical patent/JP2012238593A5/ja
Application granted granted Critical
Publication of JP6068825B2 publication Critical patent/JP6068825B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012105137A 2011-05-04 2012-05-02 複数電極間に高周波電力を均一に分配するプラズマ処理システム及び方法 Expired - Fee Related JP6068825B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/100,605 US8333166B2 (en) 2011-05-04 2011-05-04 Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes
US13/100,605 2011-05-04

Publications (3)

Publication Number Publication Date
JP2012238593A JP2012238593A (ja) 2012-12-06
JP2012238593A5 true JP2012238593A5 (https=) 2015-06-18
JP6068825B2 JP6068825B2 (ja) 2017-01-25

Family

ID=47089447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012105137A Expired - Fee Related JP6068825B2 (ja) 2011-05-04 2012-05-02 複数電極間に高周波電力を均一に分配するプラズマ処理システム及び方法

Country Status (5)

Country Link
US (1) US8333166B2 (https=)
JP (1) JP6068825B2 (https=)
KR (1) KR101935766B1 (https=)
CN (1) CN102766857B (https=)
TW (1) TWI618456B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8372238B2 (en) * 2008-05-20 2013-02-12 Nordson Corporation Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes
US8547085B2 (en) * 2008-07-07 2013-10-01 Lam Research Corporation Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber
US8179152B2 (en) 2008-07-07 2012-05-15 Lam Research Corporation Passive capacitively-coupled electrostatic (CCE) probe arrangement for detecting plasma instabilities in a plasma processing chamber
KR101136728B1 (ko) * 2010-10-18 2012-04-20 주성엔지니어링(주) 기판처리장치와 그의 분해 및 조립방법
US8333166B2 (en) * 2011-05-04 2012-12-18 Nordson Corporation Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes
TWI473382B (zh) * 2012-09-28 2015-02-11 Au Optronics Corp 無線電力傳輸裝置
WO2015049781A1 (ja) 2013-10-04 2015-04-09 東芝三菱電機産業システム株式会社 電源装置
JP5857207B2 (ja) * 2013-11-18 2016-02-10 パナソニックＩｐマネジメント株式会社 プラズマ処理装置及び方法
JP6726865B2 (ja) * 2015-06-05 2020-07-22 パナソニックＩｐマネジメント株式会社 プラズマ生成装置
CN105142324A (zh) * 2015-08-17 2015-12-09 深圳市华鼎星科技有限公司 一种线性等离子发生器
KR101881535B1 (ko) * 2017-02-24 2018-07-24 주식회사 뉴파워 프라즈마 수동소자를 구비한 전력공급장치 및 이를 이용한 플라즈마 점화를 위한 전력제공방법
KR101881536B1 (ko) * 2017-02-24 2018-07-24 주식회사 뉴파워 프라즈마 출력전류 제어가 가능한 전력공급장치 및 이를 이용한 전력공급방법
EP3367419B1 (de) * 2017-02-28 2019-08-14 Meyer Burger (Germany) AG Elektrodeneinheit mit einem internen elektrischen netzwerk zur zuführung von hochfrequenter spannung und trägeranordnung für eine plasmabehandlungsanlage
KR102038276B1 (ko) * 2017-04-12 2019-10-30 (주)아이작리서치 배치 타입의 플라즈마 원자층 증착 장치
US11143618B2 (en) * 2018-04-09 2021-10-12 Roche Sequencing Solutions, Inc. Fabrication of tunneling junctions with nanopores for molecular recognition
CN108787634A (zh) * 2018-07-19 2018-11-13 深圳市神州天柱科技有限公司 一种等离子清洗机
CN110042348A (zh) * 2019-03-12 2019-07-23 深圳奥拦科技有限责任公司 等离子表面处理装置及方法
CN110911262B (zh) * 2019-11-12 2022-07-22 北京北方华创微电子装备有限公司 电感耦合等离子体系统
WO2022011581A1 (en) * 2020-07-15 2022-01-20 Nordson Corporation Plasma treatment with isolated cooling paths
KR102405333B1 (ko) * 2020-11-25 2022-06-07 (주)이노플라즈텍 평판형 필터 전극을 이용한 분말 표면처리용 플라즈마 장치
WO2022126204A1 (en) * 2020-12-18 2022-06-23 Xefco Pty Ltd System for treatment of substrates
US12389521B2 (en) 2022-07-18 2025-08-12 Caps Medical Ltd. Plasma generating system
CN119896039A (zh) * 2022-07-18 2025-04-25 卡普斯医疗有限公司 等离子体生成系统
US11621587B1 (en) 2022-07-18 2023-04-04 Caps Medical Ltd. Configurable plasma generating system
US12542256B2 (en) 2022-11-21 2026-02-03 Applied Materials, Inc. Batch processing chambers for plasma-enhanced deposition

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Publication number Priority date Publication date Assignee Title
JP2961103B1 (ja) * 1998-04-28 1999-10-12 三菱重工業株式会社 プラズマ化学蒸着装置
GB2387023B (en) * 1998-12-17 2003-12-03 Trikon Holdings Ltd Inductive coil assembly
CN1875454A (zh) 2003-10-28 2006-12-06 诺信公司 等离子处理系统和等离子处理工艺
US7993489B2 (en) * 2005-03-31 2011-08-09 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method for using the same
US20090255630A1 (en) * 2005-04-28 2009-10-15 Hitachi Kokusai Electric Inc. Substrate processing apparatus and electrode member
JP5168907B2 (ja) * 2007-01-15 2013-03-27 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法及び記憶媒体
KR100979186B1 (ko) * 2007-10-22 2010-08-31 다이나믹솔라디자인 주식회사 용량 결합 플라즈마 반응기
TWI440405B (zh) * 2007-10-22 2014-06-01 New Power Plasma Co Ltd 電容式耦合電漿反應器
JP2011525682A (ja) * 2008-05-14 2011-09-22 アプライド マテリアルズ インコーポレイテッド Ｒｆ電力供給のための時間分解チューニングスキームを利用したパルス化プラズマ処理の方法及び装置
US8372238B2 (en) 2008-05-20 2013-02-12 Nordson Corporation Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes
US8333166B2 (en) * 2011-05-04 2012-12-18 Nordson Corporation Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes

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