TWI618456B - 電漿處理系統及在多個電極間均勻分佈射頻功率之方法 - Google Patents
電漿處理系統及在多個電極間均勻分佈射頻功率之方法 Download PDFInfo
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- TWI618456B TWI618456B TW101116058A TW101116058A TWI618456B TW I618456 B TWI618456 B TW I618456B TW 101116058 A TW101116058 A TW 101116058A TW 101116058 A TW101116058 A TW 101116058A TW I618456 B TWI618456 B TW I618456B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/100,605 US8333166B2 (en) | 2011-05-04 | 2011-05-04 | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
| US13/100,605 | 2011-05-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201251520A TW201251520A (en) | 2012-12-16 |
| TWI618456B true TWI618456B (zh) | 2018-03-11 |
Family
ID=47089447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101116058A TWI618456B (zh) | 2011-05-04 | 2012-05-04 | 電漿處理系統及在多個電極間均勻分佈射頻功率之方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8333166B2 (https=) |
| JP (1) | JP6068825B2 (https=) |
| KR (1) | KR101935766B1 (https=) |
| CN (1) | CN102766857B (https=) |
| TW (1) | TWI618456B (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8372238B2 (en) * | 2008-05-20 | 2013-02-12 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
| US8547085B2 (en) * | 2008-07-07 | 2013-10-01 | Lam Research Corporation | Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber |
| US8179152B2 (en) | 2008-07-07 | 2012-05-15 | Lam Research Corporation | Passive capacitively-coupled electrostatic (CCE) probe arrangement for detecting plasma instabilities in a plasma processing chamber |
| KR101136728B1 (ko) * | 2010-10-18 | 2012-04-20 | 주성엔지니어링(주) | 기판처리장치와 그의 분해 및 조립방법 |
| US8333166B2 (en) * | 2011-05-04 | 2012-12-18 | Nordson Corporation | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
| TWI473382B (zh) * | 2012-09-28 | 2015-02-11 | Au Optronics Corp | 無線電力傳輸裝置 |
| WO2015049781A1 (ja) | 2013-10-04 | 2015-04-09 | 東芝三菱電機産業システム株式会社 | 電源装置 |
| JP5857207B2 (ja) * | 2013-11-18 | 2016-02-10 | パナソニックＩｐマネジメント株式会社 | プラズマ処理装置及び方法 |
| JP6726865B2 (ja) * | 2015-06-05 | 2020-07-22 | パナソニックＩｐマネジメント株式会社 | プラズマ生成装置 |
| CN105142324A (zh) * | 2015-08-17 | 2015-12-09 | 深圳市华鼎星科技有限公司 | 一种线性等离子发生器 |
| KR101881535B1 (ko) * | 2017-02-24 | 2018-07-24 | 주식회사 뉴파워 프라즈마 | 수동소자를 구비한 전력공급장치 및 이를 이용한 플라즈마 점화를 위한 전력제공방법 |
| KR101881536B1 (ko) * | 2017-02-24 | 2018-07-24 | 주식회사 뉴파워 프라즈마 | 출력전류 제어가 가능한 전력공급장치 및 이를 이용한 전력공급방법 |
| EP3367419B1 (de) * | 2017-02-28 | 2019-08-14 | Meyer Burger (Germany) AG | Elektrodeneinheit mit einem internen elektrischen netzwerk zur zuführung von hochfrequenter spannung und trägeranordnung für eine plasmabehandlungsanlage |
| KR102038276B1 (ko) * | 2017-04-12 | 2019-10-30 | (주)아이작리서치 | 배치 타입의 플라즈마 원자층 증착 장치 |
| US11143618B2 (en) * | 2018-04-09 | 2021-10-12 | Roche Sequencing Solutions, Inc. | Fabrication of tunneling junctions with nanopores for molecular recognition |
| CN108787634A (zh) * | 2018-07-19 | 2018-11-13 | 深圳市神州天柱科技有限公司 | 一种等离子清洗机 |
| CN110042348A (zh) * | 2019-03-12 | 2019-07-23 | 深圳奥拦科技有限责任公司 | 等离子表面处理装置及方法 |
| CN110911262B (zh) * | 2019-11-12 | 2022-07-22 | 北京北方华创微电子装备有限公司 | 电感耦合等离子体系统 |
| WO2022011581A1 (en) * | 2020-07-15 | 2022-01-20 | Nordson Corporation | Plasma treatment with isolated cooling paths |
| KR102405333B1 (ko) * | 2020-11-25 | 2022-06-07 | (주)이노플라즈텍 | 평판형 필터 전극을 이용한 분말 표면처리용 플라즈마 장치 |
| WO2022126204A1 (en) * | 2020-12-18 | 2022-06-23 | Xefco Pty Ltd | System for treatment of substrates |
| US12389521B2 (en) | 2022-07-18 | 2025-08-12 | Caps Medical Ltd. | Plasma generating system |
| CN119896039A (zh) * | 2022-07-18 | 2025-04-25 | 卡普斯医疗有限公司 | 等离子体生成系统 |
| US11621587B1 (en) | 2022-07-18 | 2023-04-04 | Caps Medical Ltd. | Configurable plasma generating system |
| US12542256B2 (en) | 2022-11-21 | 2026-02-03 | Applied Materials, Inc. | Batch processing chambers for plasma-enhanced deposition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495963B1 (en) * | 1998-12-17 | 2002-12-17 | Trikon Holdings Limited | Inductive coil assembly having multiple coil segments for plasma processing apparatus |
| US20060219363A1 (en) * | 2005-03-31 | 2006-10-05 | Naoki Matsumoto | Capacitive coupling plasma processing apparatus and method for using the same |
| TW200920192A (en) * | 2007-10-22 | 2009-05-01 | New Power Plasma Co Ltd | Capacitively coupled plasma reactor |
| US20090288773A1 (en) * | 2008-05-20 | 2009-11-26 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2961103B1 (ja) * | 1998-04-28 | 1999-10-12 | 三菱重工業株式会社 | プラズマ化学蒸着装置 |
| CN1875454A (zh) | 2003-10-28 | 2006-12-06 | 诺信公司 | 等离子处理系统和等离子处理工艺 |
| US20090255630A1 (en) * | 2005-04-28 | 2009-10-15 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and electrode member |
| JP5168907B2 (ja) * | 2007-01-15 | 2013-03-27 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法及び記憶媒体 |
| KR100979186B1 (ko) * | 2007-10-22 | 2010-08-31 | 다이나믹솔라디자인 주식회사 | 용량 결합 플라즈마 반응기 |
| JP2011525682A (ja) * | 2008-05-14 | 2011-09-22 | アプライド マテリアルズ インコーポレイテッド | Ｒｆ電力供給のための時間分解チューニングスキームを利用したパルス化プラズマ処理の方法及び装置 |
| US8333166B2 (en) * | 2011-05-04 | 2012-12-18 | Nordson Corporation | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
-
2011
- 2011-05-04 US US13/100,605 patent/US8333166B2/en not_active Expired - Fee Related
-
2012
- 2012-05-02 JP JP2012105137A patent/JP6068825B2/ja not_active Expired - Fee Related
- 2012-05-03 KR KR1020120046880A patent/KR101935766B1/ko not_active Expired - Fee Related
- 2012-05-04 TW TW101116058A patent/TWI618456B/zh not_active IP Right Cessation
- 2012-05-04 CN CN201210137245.XA patent/CN102766857B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495963B1 (en) * | 1998-12-17 | 2002-12-17 | Trikon Holdings Limited | Inductive coil assembly having multiple coil segments for plasma processing apparatus |
| US20060219363A1 (en) * | 2005-03-31 | 2006-10-05 | Naoki Matsumoto | Capacitive coupling plasma processing apparatus and method for using the same |
| TW200920192A (en) * | 2007-10-22 | 2009-05-01 | New Power Plasma Co Ltd | Capacitively coupled plasma reactor |
| US20090288773A1 (en) * | 2008-05-20 | 2009-11-26 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012238593A (ja) | 2012-12-06 |
| TW201251520A (en) | 2012-12-16 |
| CN102766857A (zh) | 2012-11-07 |
| KR20120125177A (ko) | 2012-11-14 |
| US20120279658A1 (en) | 2012-11-08 |
| US8333166B2 (en) | 2012-12-18 |
| KR101935766B1 (ko) | 2019-01-08 |
| CN102766857B (zh) | 2016-04-13 |
| JP6068825B2 (ja) | 2017-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |