JP2022512567A5 - - Google Patents

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Publication number
JP2022512567A5
JP2022512567A5 JP2021517594A JP2021517594A JP2022512567A5 JP 2022512567 A5 JP2022512567 A5 JP 2022512567A5 JP 2021517594 A JP2021517594 A JP 2021517594A JP 2021517594 A JP2021517594 A JP 2021517594A JP 2022512567 A5 JP2022512567 A5 JP 2022512567A5
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JP
Japan
Prior art keywords
methyl
resin composition
ethyl
groups
formula
Prior art date
Application number
JP2021517594A
Other languages
English (en)
Japanese (ja)
Other versions
JP7467431B2 (ja
JP2022512567A (ja
JPWO2020064916A5 (https=
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Priority claimed from PCT/EP2019/076010 external-priority patent/WO2020064916A1/en
Publication of JP2022512567A publication Critical patent/JP2022512567A/ja
Publication of JP2022512567A5 publication Critical patent/JP2022512567A5/ja
Publication of JPWO2020064916A5 publication Critical patent/JPWO2020064916A5/ja
Application granted granted Critical
Publication of JP7467431B2 publication Critical patent/JP7467431B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021517594A 2018-09-27 2019-09-26 エポキシ樹脂組成物 Active JP7467431B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18197295 2018-09-27
EP18197295.1 2018-09-27
PCT/EP2019/076010 WO2020064916A1 (en) 2018-09-27 2019-09-26 Epoxy resin composition

Publications (4)

Publication Number Publication Date
JP2022512567A JP2022512567A (ja) 2022-02-07
JP2022512567A5 true JP2022512567A5 (https=) 2022-09-06
JPWO2020064916A5 JPWO2020064916A5 (https=) 2022-09-06
JP7467431B2 JP7467431B2 (ja) 2024-04-15

Family

ID=63896026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021517594A Active JP7467431B2 (ja) 2018-09-27 2019-09-26 エポキシ樹脂組成物

Country Status (9)

Country Link
US (1) US20210395513A1 (https=)
EP (1) EP3856840B1 (https=)
JP (1) JP7467431B2 (https=)
KR (1) KR20210064206A (https=)
CN (1) CN112839995A (https=)
IL (1) IL281713A (https=)
SG (1) SG11202101938QA (https=)
TW (1) TWI850264B (https=)
WO (1) WO2020064916A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4177293A1 (en) * 2019-03-22 2023-05-10 Mitsubishi Gas Chemical Company, Inc. Methods for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded body
EP4127018A1 (en) 2020-03-26 2023-02-08 Basf Se Epoxy resin composition
CN111333673A (zh) * 2020-04-26 2020-06-26 扬州天启新材料股份有限公司 一种嵌段链接的改性六氟双酚a型氰酸酯
CN114874159B (zh) * 2022-04-15 2023-09-29 西安瑞联新材料股份有限公司 脂肪族环氧化合物及其组合物与应用
EP4534608A1 (en) * 2022-05-31 2025-04-09 Sumitomo Bakelite Co., Ltd. Easily detachable thermosetting resin composition and detaching method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2620290B2 (ja) * 1988-03-11 1997-06-11 旭電化工業株式会社 シリルオキシ基を有するアリールエーテル化合物の製造法
US5041514A (en) * 1989-05-18 1991-08-20 General Electric Company Polymeric reaction products of biphenols and organosilicon materials and method for making
JPH0386716A (ja) 1989-08-31 1991-04-11 Toray Dow Corning Silicone Co Ltd シリコーン樹脂で変性されたフェノール樹脂の製造方法
DE4129000A1 (de) * 1991-08-31 1993-03-04 Hoechst Ag Haertbare pulverfoermige mischungen auf basis von polyarylensiloxanen
JP3596630B2 (ja) * 1995-02-28 2004-12-02 大日本インキ化学工業株式会社 硬化性エポキシ樹脂組成物
KR100591698B1 (ko) 1999-01-29 2006-06-20 아라까와 가가꾸 고교 가부시끼가이샤 에폭시 수지용 경화제, 에폭시 수지 조성물 및 실란변성페놀 수지의 제조법
JP4463908B2 (ja) 1999-09-17 2010-05-19 日本曹達株式会社 新規o−シリル化フェノール誘導体を成分化合物とするエポキシ樹脂硬化組成物
JP2002105284A (ja) * 2000-10-02 2002-04-10 Teijin Chem Ltd 難燃性エポキシ樹脂組成物およびこれを用いた積層板
JP4821059B2 (ja) 2001-06-29 2011-11-24 日立化成工業株式会社 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板
JP4407885B2 (ja) * 2003-04-08 2010-02-03 エア・ウォーター株式会社 フェノキシシラン化合物、その製法、並びにそれを含むエポキシ樹脂組成物及びその硬化物
JP2006096838A (ja) * 2004-09-29 2006-04-13 Air Water Chemical Inc エポキシ樹脂の硬化剤、その組成物及びその用途
TWI506082B (zh) 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
US8669333B2 (en) * 2010-07-02 2014-03-11 Dic Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
KR101433556B1 (ko) 2011-05-27 2014-08-22 아지노모토 가부시키가이샤 수지 조성물
KR101664948B1 (ko) 2014-01-09 2016-10-13 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도

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