KR20210064206A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR20210064206A
KR20210064206A KR1020217008057A KR20217008057A KR20210064206A KR 20210064206 A KR20210064206 A KR 20210064206A KR 1020217008057 A KR1020217008057 A KR 1020217008057A KR 20217008057 A KR20217008057 A KR 20217008057A KR 20210064206 A KR20210064206 A KR 20210064206A
Authority
KR
South Korea
Prior art keywords
group
methyl
alkyl
ethyl
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020217008057A
Other languages
English (en)
Korean (ko)
Inventor
장-피에르 베르칸 린드너
스칠라르트 크지호니
다니엘 뢰플러
예니 부르크
비르기트 게르케
프랑크 피룽
루카스 벤자민 헨더슨
보로디미르 보이코
올리베이라 루이 드
잉골프 헨니히
미란 유
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20210064206A publication Critical patent/KR20210064206A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020217008057A 2018-09-27 2019-09-26 에폭시 수지 조성물 Ceased KR20210064206A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18197295 2018-09-27
EP18197295.1 2018-09-27
PCT/EP2019/076010 WO2020064916A1 (en) 2018-09-27 2019-09-26 Epoxy resin composition

Publications (1)

Publication Number Publication Date
KR20210064206A true KR20210064206A (ko) 2021-06-02

Family

ID=63896026

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217008057A Ceased KR20210064206A (ko) 2018-09-27 2019-09-26 에폭시 수지 조성물

Country Status (9)

Country Link
US (1) US20210395513A1 (https=)
EP (1) EP3856840B1 (https=)
JP (1) JP7467431B2 (https=)
KR (1) KR20210064206A (https=)
CN (1) CN112839995A (https=)
IL (1) IL281713A (https=)
SG (1) SG11202101938QA (https=)
TW (1) TWI850264B (https=)
WO (1) WO2020064916A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4177293A1 (en) * 2019-03-22 2023-05-10 Mitsubishi Gas Chemical Company, Inc. Methods for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded body
EP4127018A1 (en) 2020-03-26 2023-02-08 Basf Se Epoxy resin composition
CN111333673A (zh) * 2020-04-26 2020-06-26 扬州天启新材料股份有限公司 一种嵌段链接的改性六氟双酚a型氰酸酯
CN114874159B (zh) * 2022-04-15 2023-09-29 西安瑞联新材料股份有限公司 脂肪族环氧化合物及其组合物与应用
EP4534608A1 (en) * 2022-05-31 2025-04-09 Sumitomo Bakelite Co., Ltd. Easily detachable thermosetting resin composition and detaching method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2620290B2 (ja) * 1988-03-11 1997-06-11 旭電化工業株式会社 シリルオキシ基を有するアリールエーテル化合物の製造法
US5041514A (en) * 1989-05-18 1991-08-20 General Electric Company Polymeric reaction products of biphenols and organosilicon materials and method for making
JPH0386716A (ja) 1989-08-31 1991-04-11 Toray Dow Corning Silicone Co Ltd シリコーン樹脂で変性されたフェノール樹脂の製造方法
DE4129000A1 (de) * 1991-08-31 1993-03-04 Hoechst Ag Haertbare pulverfoermige mischungen auf basis von polyarylensiloxanen
JP3596630B2 (ja) * 1995-02-28 2004-12-02 大日本インキ化学工業株式会社 硬化性エポキシ樹脂組成物
KR100591698B1 (ko) 1999-01-29 2006-06-20 아라까와 가가꾸 고교 가부시끼가이샤 에폭시 수지용 경화제, 에폭시 수지 조성물 및 실란변성페놀 수지의 제조법
JP4463908B2 (ja) 1999-09-17 2010-05-19 日本曹達株式会社 新規ｏ−シリル化フェノール誘導体を成分化合物とするエポキシ樹脂硬化組成物
JP2002105284A (ja) * 2000-10-02 2002-04-10 Teijin Chem Ltd 難燃性エポキシ樹脂組成物およびこれを用いた積層板
JP4821059B2 (ja) 2001-06-29 2011-11-24 日立化成工業株式会社 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板
JP4407885B2 (ja) * 2003-04-08 2010-02-03 エア・ウォーター株式会社 フェノキシシラン化合物、その製法、並びにそれを含むエポキシ樹脂組成物及びその硬化物
JP2006096838A (ja) * 2004-09-29 2006-04-13 Air Water Chemical Inc エポキシ樹脂の硬化剤、その組成物及びその用途
TWI506082B (zh) 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
US8669333B2 (en) * 2010-07-02 2014-03-11 Dic Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
KR101433556B1 (ko) 2011-05-27 2014-08-22 아지노모토 가부시키가이샤 수지 조성물
KR101664948B1 (ko) 2014-01-09 2016-10-13 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도

Also Published As

Publication number Publication date
JP7467431B2 (ja) 2024-04-15
CN112839995A (zh) 2021-05-25
JP2022512567A (ja) 2022-02-07
EP3856840A1 (en) 2021-08-04
SG11202101938QA (en) 2021-04-29
EP3856840B1 (en) 2024-08-21
WO2020064916A1 (en) 2020-04-02
TWI850264B (zh) 2024-08-01
IL281713A (en) 2021-05-31
US20210395513A1 (en) 2021-12-23
TW202014447A (zh) 2020-04-16

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