TWI850264B - 環氧樹脂組成物 - Google Patents
環氧樹脂組成物 Download PDFInfo
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- TWI850264B TWI850264B TW108135190A TW108135190A TWI850264B TW I850264 B TWI850264 B TW I850264B TW 108135190 A TW108135190 A TW 108135190A TW 108135190 A TW108135190 A TW 108135190A TW I850264 B TWI850264 B TW I850264B
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 54
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
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- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 5
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- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18197295 | 2018-09-27 | ||
| EP18197295.1 | 2018-09-27 |
Publications (2)
| Publication Number | Publication Date |
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| TW202014447A TW202014447A (zh) | 2020-04-16 |
| TWI850264B true TWI850264B (zh) | 2024-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108135190A TWI850264B (zh) | 2018-09-27 | 2019-09-27 | 環氧樹脂組成物 |
Country Status (9)
| Country | Link |
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| US (1) | US20210395513A1 (https=) |
| EP (1) | EP3856840B1 (https=) |
| JP (1) | JP7467431B2 (https=) |
| KR (1) | KR20210064206A (https=) |
| CN (1) | CN112839995A (https=) |
| IL (1) | IL281713A (https=) |
| SG (1) | SG11202101938QA (https=) |
| TW (1) | TWI850264B (https=) |
| WO (1) | WO2020064916A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4177293A1 (en) * | 2019-03-22 | 2023-05-10 | Mitsubishi Gas Chemical Company, Inc. | Methods for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded body |
| EP4127018A1 (en) | 2020-03-26 | 2023-02-08 | Basf Se | Epoxy resin composition |
| CN111333673A (zh) * | 2020-04-26 | 2020-06-26 | 扬州天启新材料股份有限公司 | 一种嵌段链接的改性六氟双酚a型氰酸酯 |
| CN114874159B (zh) * | 2022-04-15 | 2023-09-29 | 西安瑞联新材料股份有限公司 | 脂肪族环氧化合物及其组合物与应用 |
| EP4534608A1 (en) * | 2022-05-31 | 2025-04-09 | Sumitomo Bakelite Co., Ltd. | Easily detachable thermosetting resin composition and detaching method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004307655A (ja) * | 2003-04-08 | 2004-11-04 | Air Water Chemical Inc | エポキシ樹脂の硬化剤、その組成物及びその用途 |
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| JP2620290B2 (ja) * | 1988-03-11 | 1997-06-11 | 旭電化工業株式会社 | シリルオキシ基を有するアリールエーテル化合物の製造法 |
| US5041514A (en) * | 1989-05-18 | 1991-08-20 | General Electric Company | Polymeric reaction products of biphenols and organosilicon materials and method for making |
| JPH0386716A (ja) | 1989-08-31 | 1991-04-11 | Toray Dow Corning Silicone Co Ltd | シリコーン樹脂で変性されたフェノール樹脂の製造方法 |
| DE4129000A1 (de) * | 1991-08-31 | 1993-03-04 | Hoechst Ag | Haertbare pulverfoermige mischungen auf basis von polyarylensiloxanen |
| JP3596630B2 (ja) * | 1995-02-28 | 2004-12-02 | 大日本インキ化学工業株式会社 | 硬化性エポキシ樹脂組成物 |
| KR100591698B1 (ko) | 1999-01-29 | 2006-06-20 | 아라까와 가가꾸 고교 가부시끼가이샤 | 에폭시 수지용 경화제, 에폭시 수지 조성물 및 실란변성페놀 수지의 제조법 |
| JP4463908B2 (ja) | 1999-09-17 | 2010-05-19 | 日本曹達株式会社 | 新規ｏ−シリル化フェノール誘導体を成分化合物とするエポキシ樹脂硬化組成物 |
| JP2002105284A (ja) * | 2000-10-02 | 2002-04-10 | Teijin Chem Ltd | 難燃性エポキシ樹脂組成物およびこれを用いた積層板 |
| JP4821059B2 (ja) | 2001-06-29 | 2011-11-24 | 日立化成工業株式会社 | 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板 |
| JP2006096838A (ja) * | 2004-09-29 | 2006-04-13 | Air Water Chemical Inc | エポキシ樹脂の硬化剤、その組成物及びその用途 |
| TWI506082B (zh) | 2009-11-26 | 2015-11-01 | Ajinomoto Kk | Epoxy resin composition |
| US8669333B2 (en) * | 2010-07-02 | 2014-03-11 | Dic Corporation | Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film |
| KR101433556B1 (ko) | 2011-05-27 | 2014-08-22 | 아지노모토 가부시키가이샤 | 수지 조성물 |
| KR101664948B1 (ko) | 2014-01-09 | 2016-10-13 | 한국생산기술연구원 | 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도 |
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2019
- 2019-09-26 JP JP2021517594A patent/JP7467431B2/ja active Active
- 2019-09-26 CN CN201980063568.9A patent/CN112839995A/zh active Pending
- 2019-09-26 SG SG11202101938QA patent/SG11202101938QA/en unknown
- 2019-09-26 WO PCT/EP2019/076010 patent/WO2020064916A1/en not_active Ceased
- 2019-09-26 KR KR1020217008057A patent/KR20210064206A/ko not_active Ceased
- 2019-09-26 EP EP19773109.4A patent/EP3856840B1/en active Active
- 2019-09-26 US US17/281,230 patent/US20210395513A1/en not_active Abandoned
- 2019-09-27 TW TW108135190A patent/TWI850264B/zh active
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2021
- 2021-03-22 IL IL281713A patent/IL281713A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004307655A (ja) * | 2003-04-08 | 2004-11-04 | Air Water Chemical Inc | エポキシ樹脂の硬化剤、その組成物及びその用途 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7467431B2 (ja) | 2024-04-15 |
| CN112839995A (zh) | 2021-05-25 |
| JP2022512567A (ja) | 2022-02-07 |
| EP3856840A1 (en) | 2021-08-04 |
| KR20210064206A (ko) | 2021-06-02 |
| SG11202101938QA (en) | 2021-04-29 |
| EP3856840B1 (en) | 2024-08-21 |
| WO2020064916A1 (en) | 2020-04-02 |
| IL281713A (en) | 2021-05-31 |
| US20210395513A1 (en) | 2021-12-23 |
| TW202014447A (zh) | 2020-04-16 |
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