SG11202101938QA - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
SG11202101938QA
SG11202101938QA SG11202101938QA SG11202101938QA SG11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Application number
SG11202101938QA
Inventor
Jean-Pierre Berkan Lindner
Szilard Csihony
Daniel Loeffler
Yeni Burk
Birgit Gerke
Frank Pirrung
Lucas Benjamin Henderson
Volodymyr Boyko
Oliveira Rui De
Ingolf Hennig
Miran Yu
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG11202101938QA publication Critical patent/SG11202101938QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
SG11202101938QA 2018-09-27 2019-09-26 Epoxy resin composition SG11202101938QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18197295 2018-09-27
PCT/EP2019/076010 WO2020064916A1 (en) 2018-09-27 2019-09-26 Epoxy resin composition

Publications (1)

Publication Number Publication Date
SG11202101938QA true SG11202101938QA (en) 2021-04-29

Family

ID=63896026

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202101938QA SG11202101938QA (en) 2018-09-27 2019-09-26 Epoxy resin composition

Country Status (9)

Country Link
US (1) US20210395513A1 (en)
EP (1) EP3856840A1 (en)
JP (1) JP7467431B2 (en)
KR (1) KR20210064206A (en)
CN (1) CN112839995A (en)
IL (1) IL281713A (en)
SG (1) SG11202101938QA (en)
TW (1) TW202014447A (en)
WO (1) WO2020064916A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220169788A1 (en) * 2019-03-22 2022-06-02 Mitsubishi Gas Chemical Company, Inc. Methods for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded body
CN111333673A (en) * 2020-04-26 2020-06-26 扬州天启新材料股份有限公司 Block-linked modified hexafluorobisphenol A cyanate
CN114874159B (en) * 2022-04-15 2023-09-29 西安瑞联新材料股份有限公司 Aliphatic epoxy compound, composition and application thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041514A (en) * 1989-05-18 1991-08-20 General Electric Company Polymeric reaction products of biphenols and organosilicon materials and method for making
JPH0386716A (en) 1989-08-31 1991-04-11 Toray Dow Corning Silicone Co Ltd Production of phenolic resin modified with silicone resin
DE4129000A1 (en) * 1991-08-31 1993-03-04 Hoechst Ag CURABLE POWDER-MIXED MIXTURES BASED ON POLYARYLENSILOXANES
JP3596630B2 (en) * 1995-02-28 2004-12-02 大日本インキ化学工業株式会社 Curable epoxy resin composition
DE60019046T2 (en) 1999-01-29 2006-02-02 Arakawa Chemical Industries, Ltd. HARDENERS FOR EPOXY RESINS, EPOXY RESIN COMPOSITION AND METHOD FOR THE PRODUCTION OF SILANE-MODIFIED PHENOL RESIN
JP4463908B2 (en) 1999-09-17 2010-05-19 日本曹達株式会社 Epoxy resin cured composition comprising a novel O-silylated phenol derivative as a component compound
JP2002105284A (en) * 2000-10-02 2002-04-10 Teijin Chem Ltd Flame-retardant epoxy resin composition and laminated plate using the same
JP4821059B2 (en) 2001-06-29 2011-11-24 日立化成工業株式会社 Resin composition and flame-retardant laminate and printed wiring board using the same
JP4407885B2 (en) 2003-04-08 2010-02-03 エア・ウォーター株式会社 Phenoxysilane compound, process for producing the same, epoxy resin composition containing the same, and cured product thereof
JP2006096838A (en) 2004-09-29 2006-04-13 Air Water Chemical Inc Curing agent for epoxy resin, composition containing the same and use
TWI506082B (en) 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
EP2589625B1 (en) 2010-07-02 2016-10-26 DIC Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film
KR101433556B1 (en) 2011-05-27 2014-08-22 아지노모토 가부시키가이샤 Resin composition
KR101664948B1 (en) 2014-01-09 2016-10-13 한국생산기술연구원 New novolac curing agent having alkoxysilyl group, preparing method thereof, composition comprising thereof, cured product thereof, and uses thereof

Also Published As

Publication number Publication date
CN112839995A (en) 2021-05-25
EP3856840A1 (en) 2021-08-04
TW202014447A (en) 2020-04-16
WO2020064916A1 (en) 2020-04-02
JP2022512567A (en) 2022-02-07
IL281713A (en) 2021-05-31
US20210395513A1 (en) 2021-12-23
KR20210064206A (en) 2021-06-02
JP7467431B2 (en) 2024-04-15

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