JPWO2023182193A5 - - Google Patents
Info
- Publication number
- JPWO2023182193A5 JPWO2023182193A5 JP2024510119A JP2024510119A JPWO2023182193A5 JP WO2023182193 A5 JPWO2023182193 A5 JP WO2023182193A5 JP 2024510119 A JP2024510119 A JP 2024510119A JP 2024510119 A JP2024510119 A JP 2024510119A JP WO2023182193 A5 JPWO2023182193 A5 JP WO2023182193A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper surface
- surface protection
- containing layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048769 | 2022-03-24 | ||
| PCT/JP2023/010511 WO2023182193A1 (ja) | 2022-03-24 | 2023-03-17 | 銅表面保護用組成物、並びにこれを用いた半導体中間体および半導体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023182193A1 JPWO2023182193A1 (https=) | 2023-09-28 |
| JPWO2023182193A5 true JPWO2023182193A5 (https=) | 2026-02-03 |
Family
ID=88100812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024510119A Pending JPWO2023182193A1 (https=) | 2022-03-24 | 2023-03-17 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250207265A1 (https=) |
| EP (1) | EP4502232A4 (https=) |
| JP (1) | JPWO2023182193A1 (https=) |
| KR (1) | KR20240165937A (https=) |
| CN (1) | CN118900935A (https=) |
| TW (1) | TW202402773A (https=) |
| WO (1) | WO2023182193A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240271062A1 (en) * | 2023-02-14 | 2024-08-15 | Tokyo Ohka Kogyo Co., Ltd. | Aqueous cleaning liquid |
| DE102024208880A1 (de) * | 2024-09-17 | 2026-03-19 | Volkswagen Aktiengesellschaft | Fügeverfahren zur Herstellung einer Verbindung zweier Oberflächen |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442449C (zh) * | 2003-05-02 | 2008-12-10 | Ekc技术公司 | 半导体工艺中后蚀刻残留物的去除 |
| US10017863B2 (en) * | 2007-06-21 | 2018-07-10 | Joseph A. Abys | Corrosion protection of bronzes |
| ES2574561T3 (es) * | 2007-07-10 | 2016-06-20 | Atotech Deutschland Gmbh | Solución y proceso para incrementar la capacidad de soldadura y la resistencia a la corrosión de la superficie de un metal o de una aleación metálica |
| US20110045203A1 (en) * | 2009-08-21 | 2011-02-24 | E. I. Du Pont De Nemours And Company | Process for inhibiting oxide formation on copper surfaces |
| JP5852303B2 (ja) * | 2010-06-30 | 2016-02-03 | 富士フイルム株式会社 | 金属膜表面の酸化防止方法及び酸化防止液 |
| EP3033929A1 (en) * | 2013-08-16 | 2016-06-22 | Enthone, Inc. | Adhesion promotion in printed circuit boards |
| JP6214576B2 (ja) * | 2015-01-08 | 2017-10-18 | 三菱電機株式会社 | 半導体デバイスの製造方法 |
| US10593638B2 (en) | 2017-03-29 | 2020-03-17 | Xilinx, Inc. | Methods of interconnect for high density 2.5D and 3D integration |
-
2023
- 2023-03-17 WO PCT/JP2023/010511 patent/WO2023182193A1/ja not_active Ceased
- 2023-03-17 JP JP2024510119A patent/JPWO2023182193A1/ja active Pending
- 2023-03-17 CN CN202380027859.9A patent/CN118900935A/zh active Pending
- 2023-03-17 US US18/847,732 patent/US20250207265A1/en active Pending
- 2023-03-17 TW TW112109936A patent/TW202402773A/zh unknown
- 2023-03-17 KR KR1020247029489A patent/KR20240165937A/ko active Pending
- 2023-03-17 EP EP23774788.6A patent/EP4502232A4/en active Pending
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