JP2025061943A5 - - Google Patents
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- Publication number
- JP2025061943A5 JP2025061943A5 JP2025013136A JP2025013136A JP2025061943A5 JP 2025061943 A5 JP2025061943 A5 JP 2025061943A5 JP 2025013136 A JP2025013136 A JP 2025013136A JP 2025013136 A JP2025013136 A JP 2025013136A JP 2025061943 A5 JP2025061943 A5 JP 2025061943A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- polishing composition
- unsubstituted
- salt
- organic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020054516 | 2020-03-25 | ||
| JP2020054516 | 2020-03-25 | ||
| JP2020198712A JP7697781B2 (ja) | 2020-03-25 | 2020-11-30 | 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020198712A Division JP7697781B2 (ja) | 2020-03-25 | 2020-11-30 | 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025061943A JP2025061943A (ja) | 2025-04-11 |
| JP2025061943A5 true JP2025061943A5 (https=) | 2025-05-12 |
Family
ID=77809307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025013136A Pending JP2025061943A (ja) | 2020-03-25 | 2025-01-29 | 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11339312B2 (https=) |
| JP (1) | JP2025061943A (https=) |
| CN (1) | CN113444489B (https=) |
| TW (1) | TWI883133B (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023026778A1 (ja) * | 2021-08-24 | 2023-03-02 | Jsr株式会社 | 化学機械研磨用組成物および研磨方法 |
| KR20230114480A (ko) | 2022-01-25 | 2023-08-01 | 삼성전자주식회사 | 슬러리 조성물 및 이를 이용하는 집적회로 소자의 제조 방법 |
| JP2024037248A (ja) * | 2022-09-07 | 2024-03-19 | 株式会社ディスコ | 化合物半導体基板研磨用の研磨液 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050065227A1 (en) * | 2003-09-22 | 2005-03-24 | Condon John R. | Visible-light sensitive macro-initiator |
| KR100796418B1 (ko) * | 2003-11-27 | 2008-01-21 | 주고꾸 도료 가부시키가이샤 | 환식 카르복실산 화합물 및 그의 용도 |
| US7988878B2 (en) * | 2004-09-29 | 2011-08-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Selective barrier slurry for chemical mechanical polishing |
| US8697576B2 (en) | 2009-09-16 | 2014-04-15 | Cabot Microelectronics Corporation | Composition and method for polishing polysilicon |
| TWI561620B (en) * | 2014-06-20 | 2016-12-11 | Cabot Microelectronics Corp | Cmp slurry compositions and methods for aluminum polishing |
| US10941318B2 (en) * | 2016-09-30 | 2021-03-09 | Fujimi Incorporated | Method for producing cationically modified silica, cationically modified silica dispersion, method for producing polishing composition using cationically modified silica, and polishing composition using cationically modified silica |
| CN110431209B (zh) * | 2017-03-14 | 2022-06-28 | 福吉米株式会社 | 研磨用组合物、其制造方法以及使用其的研磨方法及基板的制造方法 |
| KR102258316B1 (ko) * | 2018-06-25 | 2021-06-01 | 주식회사 이엔에프테크놀로지 | 실리콘 질화막 식각 조성물 |
| KR20200025542A (ko) * | 2018-08-30 | 2020-03-10 | 삼성전자주식회사 | 화학적 기계적 연마용 슬러리 조성물 |
-
2021
- 2021-03-04 TW TW110107667A patent/TWI883133B/zh active
- 2021-03-22 US US17/208,803 patent/US11339312B2/en active Active
- 2021-03-25 CN CN202110318990.3A patent/CN113444489B/zh active Active
-
2025
- 2025-01-29 JP JP2025013136A patent/JP2025061943A/ja active Pending
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