JP2025061943A - 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法 - Google Patents

研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法 Download PDF

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Publication number
JP2025061943A
JP2025061943A JP2025013136A JP2025013136A JP2025061943A JP 2025061943 A JP2025061943 A JP 2025061943A JP 2025013136 A JP2025013136 A JP 2025013136A JP 2025013136 A JP2025013136 A JP 2025013136A JP 2025061943 A JP2025061943 A JP 2025061943A
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JP
Japan
Prior art keywords
group
polishing
polishing composition
unsubstituted
substituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025013136A
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English (en)
Japanese (ja)
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JP2025061943A5 (https=
Inventor
晃子 宗宮
Akiko Somiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020198712A external-priority patent/JP7697781B2/ja
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of JP2025061943A publication Critical patent/JP2025061943A/ja
Publication of JP2025061943A5 publication Critical patent/JP2025061943A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3063—Treatment with low-molecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2025013136A 2020-03-25 2025-01-29 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法 Pending JP2025061943A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020054516 2020-03-25
JP2020054516 2020-03-25
JP2020198712A JP7697781B2 (ja) 2020-03-25 2020-11-30 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020198712A Division JP7697781B2 (ja) 2020-03-25 2020-11-30 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JP2025061943A true JP2025061943A (ja) 2025-04-11
JP2025061943A5 JP2025061943A5 (https=) 2025-05-12

Family

ID=77809307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025013136A Pending JP2025061943A (ja) 2020-03-25 2025-01-29 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法

Country Status (4)

Country Link
US (1) US11339312B2 (https=)
JP (1) JP2025061943A (https=)
CN (1) CN113444489B (https=)
TW (1) TWI883133B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023026778A1 (ja) * 2021-08-24 2023-03-02 Jsr株式会社 化学機械研磨用組成物および研磨方法
KR20230114480A (ko) 2022-01-25 2023-08-01 삼성전자주식회사 슬러리 조성물 및 이를 이용하는 집적회로 소자의 제조 방법
JP2024037248A (ja) * 2022-09-07 2024-03-19 株式会社ディスコ 化合物半導体基板研磨用の研磨液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050065227A1 (en) * 2003-09-22 2005-03-24 Condon John R. Visible-light sensitive macro-initiator
KR100796418B1 (ko) * 2003-11-27 2008-01-21 주고꾸 도료 가부시키가이샤 환식 카르복실산 화합물 및 그의 용도
US7988878B2 (en) * 2004-09-29 2011-08-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Selective barrier slurry for chemical mechanical polishing
US8697576B2 (en) 2009-09-16 2014-04-15 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
TWI561620B (en) * 2014-06-20 2016-12-11 Cabot Microelectronics Corp Cmp slurry compositions and methods for aluminum polishing
US10941318B2 (en) * 2016-09-30 2021-03-09 Fujimi Incorporated Method for producing cationically modified silica, cationically modified silica dispersion, method for producing polishing composition using cationically modified silica, and polishing composition using cationically modified silica
CN110431209B (zh) * 2017-03-14 2022-06-28 福吉米株式会社 研磨用组合物、其制造方法以及使用其的研磨方法及基板的制造方法
KR102258316B1 (ko) * 2018-06-25 2021-06-01 주식회사 이엔에프테크놀로지 실리콘 질화막 식각 조성물
KR20200025542A (ko) * 2018-08-30 2020-03-10 삼성전자주식회사 화학적 기계적 연마용 슬러리 조성물

Also Published As

Publication number Publication date
TWI883133B (zh) 2025-05-11
US11339312B2 (en) 2022-05-24
US20210301176A1 (en) 2021-09-30
CN113444489B (zh) 2024-07-05
CN113444489A (zh) 2021-09-28
TW202138532A (zh) 2021-10-16

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