JP2022103256A5 - - Google Patents
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- Publication number
- JP2022103256A5 JP2022103256A5 JP2022076224A JP2022076224A JP2022103256A5 JP 2022103256 A5 JP2022103256 A5 JP 2022103256A5 JP 2022076224 A JP2022076224 A JP 2022076224A JP 2022076224 A JP2022076224 A JP 2022076224A JP 2022103256 A5 JP2022103256 A5 JP 2022103256A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- electric circuit
- heat
- ceramic
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims 6
- 230000017525 heat dissipation Effects 0.000 claims 5
- 239000000805 composite resin Substances 0.000 claims 2
- 239000011164 primary particle Substances 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016152205 | 2016-08-02 | ||
| JP2016152205 | 2016-08-02 | ||
| PCT/JP2017/028133 WO2018025933A1 (ja) | 2016-08-02 | 2017-08-02 | 電気回路装置の放熱構造 |
| JP2018531962A JPWO2018025933A1 (ja) | 2016-08-02 | 2017-08-02 | 電気回路装置の放熱構造 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018531962A Division JPWO2018025933A1 (ja) | 2016-08-02 | 2017-08-02 | 電気回路装置の放熱構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022103256A JP2022103256A (ja) | 2022-07-07 |
| JP2022103256A5 true JP2022103256A5 (https=) | 2023-03-31 |
| JP7282950B2 JP7282950B2 (ja) | 2023-05-29 |
Family
ID=61074093
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018531962A Pending JPWO2018025933A1 (ja) | 2016-08-02 | 2017-08-02 | 電気回路装置の放熱構造 |
| JP2022076224A Active JP7282950B2 (ja) | 2016-08-02 | 2022-05-02 | 電気回路装置の放熱構造 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018531962A Pending JPWO2018025933A1 (ja) | 2016-08-02 | 2017-08-02 | 電気回路装置の放熱構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10615096B2 (https=) |
| EP (1) | EP3496139B1 (https=) |
| JP (2) | JPWO2018025933A1 (https=) |
| KR (1) | KR102382407B1 (https=) |
| CN (1) | CN109791918B (https=) |
| WO (1) | WO2018025933A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10487013B2 (en) * | 2016-03-10 | 2019-11-26 | Denka Company Limited | Ceramic resin composite body |
| WO2021200724A1 (ja) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | 窒化ホウ素焼結体、複合体及びこれらの製造方法、並びに放熱部材 |
| WO2021201012A1 (ja) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | 複合体の製造方法 |
| JPWO2021200973A1 (https=) * | 2020-03-31 | 2021-10-07 | ||
| CN115298150B (zh) * | 2020-03-31 | 2024-02-09 | 电化株式会社 | 氮化硼烧结体及其制造方法、以及复合体及其制造方法 |
| WO2022080078A1 (ja) * | 2020-10-16 | 2022-04-21 | 富士フイルム株式会社 | 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス |
| US11647612B2 (en) * | 2020-11-23 | 2023-05-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | High-density integrated power electronic assembly including double-sided cooling structure |
| JP2023112739A (ja) * | 2022-02-02 | 2023-08-15 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2025078893A (ja) * | 2022-03-30 | 2025-05-21 | デンカ株式会社 | 放熱構造体 |
| JP7594335B1 (ja) | 2024-06-07 | 2024-12-04 | アドバンスコンポジット株式会社 | ヘキサゴナル窒化ホウ素粒子分散樹脂複合体及びヘキサゴナル窒化ホウ素粒子分散樹脂複合体の製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100939A (ja) | 2001-09-27 | 2003-04-04 | Tokuyama Corp | 放熱基板及びその製造方法 |
| JP3644428B2 (ja) | 2001-11-30 | 2005-04-27 | 株式会社デンソー | パワーモジュールの実装構造 |
| JP2005150420A (ja) * | 2003-11-17 | 2005-06-09 | Nippon Soken Inc | 半導体装置の冷却構造 |
| US20050252177A1 (en) * | 2004-05-12 | 2005-11-17 | Shiro Ishikawa | Ceramic filter and smoke treatment device |
| JP2010192717A (ja) * | 2009-02-19 | 2010-09-02 | Sumitomo Electric Ind Ltd | 冷却構造 |
| JP5838065B2 (ja) | 2011-09-29 | 2015-12-24 | 新光電気工業株式会社 | 熱伝導部材及び熱伝導部材を用いた接合構造 |
| KR101928005B1 (ko) * | 2011-12-01 | 2019-03-13 | 삼성전자주식회사 | 열전 냉각 패키지 및 이의 열관리 방법 |
| US10351728B2 (en) * | 2013-06-14 | 2019-07-16 | Mitsubishi Electric Corporation | Thermosetting resin composition, method of producing thermal conductive sheet, and power module |
| EP3035778B1 (en) | 2013-08-14 | 2018-10-03 | Denka Company Limited | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
| JP6285155B2 (ja) * | 2013-11-15 | 2018-02-28 | デンカ株式会社 | 放熱部材およびその用途 |
| JP6262522B2 (ja) * | 2013-12-26 | 2018-01-17 | デンカ株式会社 | 樹脂含浸窒化ホウ素焼結体およびその用途 |
| JP6189822B2 (ja) | 2014-11-28 | 2017-08-30 | デンカ株式会社 | 窒化ホウ素樹脂複合体回路基板 |
| JP6170486B2 (ja) | 2014-12-05 | 2017-07-26 | デンカ株式会社 | セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール |
-
2017
- 2017-08-02 CN CN201780048563.XA patent/CN109791918B/zh active Active
- 2017-08-02 KR KR1020197006260A patent/KR102382407B1/ko active Active
- 2017-08-02 US US16/322,570 patent/US10615096B2/en active Active
- 2017-08-02 JP JP2018531962A patent/JPWO2018025933A1/ja active Pending
- 2017-08-02 EP EP17837035.9A patent/EP3496139B1/en active Active
- 2017-08-02 WO PCT/JP2017/028133 patent/WO2018025933A1/ja not_active Ceased
-
2022
- 2022-05-02 JP JP2022076224A patent/JP7282950B2/ja active Active
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