JP2022073129A5 - - Google Patents

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JP2022073129A5
JP2022073129A5 JP2020182918A JP2020182918A JP2022073129A5 JP 2022073129 A5 JP2022073129 A5 JP 2022073129A5 JP 2020182918 A JP2020182918 A JP 2020182918A JP 2020182918 A JP2020182918 A JP 2020182918A JP 2022073129 A5 JP2022073129 A5 JP 2022073129A5
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Japan
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pitch
spacing
processes
housing
terminal
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JP2020182918A
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Japanese (ja)
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JP7353255B2 (ja
JP2022073129A (ja
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Priority to JP2020182918A priority Critical patent/JP7353255B2/ja
Priority claimed from JP2020182918A external-priority patent/JP7353255B2/ja
Priority to US17/391,720 priority patent/US11806903B2/en
Priority to DE102021126117.1A priority patent/DE102021126117B4/de
Priority to CN202111240502.8A priority patent/CN114434729B/zh
Publication of JP2022073129A publication Critical patent/JP2022073129A/ja
Publication of JP2022073129A5 publication Critical patent/JP2022073129A5/ja
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JP2020182918A 2020-10-30 2020-10-30 半導体装置用の筐体の製造方法 Active JP7353255B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020182918A JP7353255B2 (ja) 2020-10-30 2020-10-30 半導体装置用の筐体の製造方法
US17/391,720 US11806903B2 (en) 2020-10-30 2021-08-02 Manufacturing method of housing for semiconductor device
DE102021126117.1A DE102021126117B4 (de) 2020-10-30 2021-10-08 Herstellungsverfahren eines Gehäuses für eine Halbleitervorrichtung
CN202111240502.8A CN114434729B (zh) 2020-10-30 2021-10-25 半导体装置用的框体的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020182918A JP7353255B2 (ja) 2020-10-30 2020-10-30 半導体装置用の筐体の製造方法

Publications (3)

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JP2022073129A JP2022073129A (ja) 2022-05-17
JP2022073129A5 true JP2022073129A5 (https=) 2022-11-21
JP7353255B2 JP7353255B2 (ja) 2023-09-29

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JP2020182918A Active JP7353255B2 (ja) 2020-10-30 2020-10-30 半導体装置用の筐体の製造方法

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US (1) US11806903B2 (https=)
JP (1) JP7353255B2 (https=)
CN (1) CN114434729B (https=)
DE (1) DE102021126117B4 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024201532A1 (en) 2023-03-30 2024-10-03 Carborundum Universal Limited High entropy oxides and method of preparation by electric arc fusion

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335362A (ja) * 1992-05-29 1993-12-17 Nec Kansai Ltd 樹脂モールド装置
JP3654564B2 (ja) * 1999-03-02 2005-06-02 矢崎総業株式会社 成形コネクタの製造方法
DE102004046807B4 (de) 2004-09-27 2010-08-12 Infineon Technologies Ag Verfahren zur Herstellung eines Kunststoff-Gehäuseteils für ein Leistungshalbleitermodul
JP4242401B2 (ja) 2006-06-29 2009-03-25 三菱電機株式会社 半導体装置
JP4985012B2 (ja) * 2007-03-22 2012-07-25 富士電機株式会社 半導体装置およびその製造方法
JP5569442B2 (ja) * 2011-03-15 2014-08-13 住友電装株式会社 機器用コネクタ
JP5986488B2 (ja) 2012-11-21 2016-09-06 日本インター株式会社 パワー半導体モジュールおよびその製造方法
TWI478479B (zh) * 2013-01-17 2015-03-21 台達電子工業股份有限公司 整合功率模組封裝結構
JP6107362B2 (ja) * 2013-04-18 2017-04-05 富士電機株式会社 半導体装置の製造方法及び半導体装置
CN105190876B (zh) * 2013-06-10 2018-04-13 富士电机株式会社 半导体装置及其制造方法
US9443789B2 (en) * 2013-09-11 2016-09-13 Harris Corporation Embedded electronic packaging and associated methods
JP6413709B2 (ja) * 2014-12-02 2018-10-31 富士電機株式会社 半導体装置およびその製造方法
KR102514340B1 (ko) * 2015-02-16 2023-03-27 주식회사 솔루엠 파워 모듈 패키지용 하우징 및 이의 제조 방법
DE102017106772A1 (de) * 2017-03-29 2018-10-04 Te Connectivity Germany Gmbh Kontakteinrichtung und Verfahren zur Herstellung solch einer Kontakteinrichtung
CN116632579A (zh) * 2019-01-16 2023-08-22 泰科电子(上海)有限公司 插头组件、电连接器、连接器组件和制作插头组件的方法

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