JP2017092464A5 - - Google Patents

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JP2017092464A5
JP2017092464A5 JP2016214727A JP2016214727A JP2017092464A5 JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5 JP 2016214727 A JP2016214727 A JP 2016214727A JP 2016214727 A JP2016214727 A JP 2016214727A JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5
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JP6971012B2 (ja
JP2017092464A (ja
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JP2016214727A 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 Active JP6971012B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US62/250,745 2015-11-04
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods
US15/234,563 2016-08-11

Publications (3)

Publication Number Publication Date
JP2017092464A JP2017092464A (ja) 2017-05-25
JP2017092464A5 true JP2017092464A5 (https=) 2019-11-21
JP6971012B2 JP6971012B2 (ja) 2021-11-24

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JP2016214727A Active JP6971012B2 (ja) 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法

Country Status (6)

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US (2) US10121759B2 (https=)
JP (1) JP6971012B2 (https=)
KR (1) KR102593242B1 (https=)
CN (2) CN110695575B (https=)
SG (2) SG10201907000QA (https=)
TW (2) TWI731734B (https=)

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CN109560024B (zh) * 2018-11-06 2020-11-06 武汉新芯集成电路制造有限公司 一种晶圆键合装置及其校正方法
US11581285B2 (en) 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
KR20220160553A (ko) * 2020-03-29 2022-12-06 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩 머신 상의 지지 구조에 대한 반도체 소자의 클램핑 최적화 방법, 및 관련된 방법
US11515284B2 (en) * 2020-07-14 2022-11-29 Semiconductor Components Industries, Llc Multi-segment wire-bond
JP7794821B2 (ja) 2020-11-05 2026-01-06 クリック アンド ソッファ インダストリーズ、インク． ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法
CN117337485A (zh) * 2021-05-20 2024-01-02 库利克和索夫工业公司 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机
KR102891276B1 (ko) * 2021-05-25 2025-12-03 야마하 로보틱스 가부시키가이샤 와이어 본딩 시스템, 검사 장치, 와이어 본딩 방법, 및 기록 매체
CN121464751A (zh) * 2023-07-11 2026-02-03 库利克和索夫工业公司 检测半导体元件中的裂纹的方法以及相关的焊线系统

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JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
JPH07183321A (ja) * 1993-12-24 1995-07-21 Kaijo Corp ワイヤボンディング装置
JP2001267352A (ja) * 2000-03-16 2001-09-28 Mitsubishi Electric Corp ワイヤボンディング装置およびその制御方法
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
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KR102776049B1 (ko) * 2013-05-29 2025-03-04 에베 그룹 에. 탈너 게엠베하 기판을 결합하기 위한 방법 및 장치
US10510576B2 (en) * 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
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JP2016092192A (ja) * 2014-11-04 2016-05-23 株式会社デンソー 電子装置の製造方法

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