JP2024013569A5 - - Google Patents

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Publication number
JP2024013569A5
JP2024013569A5 JP2022115748A JP2022115748A JP2024013569A5 JP 2024013569 A5 JP2024013569 A5 JP 2024013569A5 JP 2022115748 A JP2022115748 A JP 2022115748A JP 2022115748 A JP2022115748 A JP 2022115748A JP 2024013569 A5 JP2024013569 A5 JP 2024013569A5
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JP
Japan
Prior art keywords
mounting
mounting step
note
preparing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022115748A
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English (en)
Japanese (ja)
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JP2024013569A (ja
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Publication date
Application filed filed Critical
Priority to JP2022115748A priority Critical patent/JP2024013569A/ja
Priority claimed from JP2022115748A external-priority patent/JP2024013569A/ja
Priority to US18/331,385 priority patent/US20240030087A1/en
Priority to DE102023118237.4A priority patent/DE102023118237B4/de
Priority to CN202310865586.7A priority patent/CN117438404A/zh
Publication of JP2024013569A publication Critical patent/JP2024013569A/ja
Publication of JP2024013569A5 publication Critical patent/JP2024013569A5/ja
Pending legal-status Critical Current

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JP2022115748A 2022-07-20 2022-07-20 半導体装置、半導体装置の製造方法および電力変換装置 Pending JP2024013569A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022115748A JP2024013569A (ja) 2022-07-20 2022-07-20 半導体装置、半導体装置の製造方法および電力変換装置
US18/331,385 US20240030087A1 (en) 2022-07-20 2023-06-08 Semiconductor device, method of manufacturing semiconductor device, and power conversion device
DE102023118237.4A DE102023118237B4 (de) 2022-07-20 2023-07-11 Halbleitervorrichtung, Verfahren zum Herstellen einer Halbleitervorrichtung und Leistungsumwandlungsvorrichtung
CN202310865586.7A CN117438404A (zh) 2022-07-20 2023-07-14 半导体装置、半导体装置的制造方法以及电力变换装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022115748A JP2024013569A (ja) 2022-07-20 2022-07-20 半導体装置、半導体装置の製造方法および電力変換装置

Publications (2)

Publication Number Publication Date
JP2024013569A JP2024013569A (ja) 2024-02-01
JP2024013569A5 true JP2024013569A5 (https=) 2024-08-16

Family

ID=89429808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022115748A Pending JP2024013569A (ja) 2022-07-20 2022-07-20 半導体装置、半導体装置の製造方法および電力変換装置

Country Status (4)

Country Link
US (1) US20240030087A1 (https=)
JP (1) JP2024013569A (https=)
CN (1) CN117438404A (https=)
DE (1) DE102023118237B4 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250029232A1 (en) * 2023-07-17 2025-01-23 Diodes Incorporated Semiconductor Molding System and Foreign Object Detection Method
JP2025139450A (ja) * 2024-03-12 2025-09-26 ミネベアパワーデバイス株式会社 半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080029888A1 (en) 1999-11-01 2008-02-07 International Business Machines Corporation Solder Interconnect Joints For A Semiconductor Package
JP4281050B2 (ja) * 2003-03-31 2009-06-17 株式会社デンソー 半導体装置
JP4968195B2 (ja) * 2008-06-24 2012-07-04 株式会社デンソー 電子装置の製造方法
JP2011204886A (ja) * 2010-03-25 2011-10-13 Panasonic Corp 半導体装置及びその製造方法
JP2015106682A (ja) * 2013-12-02 2015-06-08 株式会社デンソー モールドパッケージ
JP2017069381A (ja) 2015-09-30 2017-04-06 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
JP6628031B2 (ja) 2015-11-04 2020-01-08 ローム株式会社 電子部品
JP6721329B2 (ja) 2015-12-21 2020-07-15 三菱電機株式会社 パワー半導体装置およびその製造方法
JP7138720B2 (ja) * 2018-11-29 2022-09-16 三菱電機株式会社 半導体装置、電力用半導体モジュール、電力変換装置および電力用半導体モジュールの製造方法
JP7196815B2 (ja) 2019-10-23 2022-12-27 三菱電機株式会社 半導体モジュール及び電力変換装置

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