JP2021535627A - 三次元メモリデバイスおよびその製作方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title description 17
- 239000010410 layer Substances 0.000 claims abstract description 441
- 238000003860 storage Methods 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 65
- 239000002346 layers by function Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 230000004888 barrier function Effects 0.000 claims description 55
- 238000005530 etching Methods 0.000 claims description 18
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 16
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 230000005641 tunneling Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 description 14
- 238000001039 wet etching Methods 0.000 description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 11
- 238000001312 dry etching Methods 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823462—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823487—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7926—Vertical transistors, i.e. transistors having source and drain not in the same horizontal plane
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
- H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
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- Computer Hardware Design (AREA)
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Abstract
Description
200 交互層スタック
210 導電層
212 上面
214 下面
220 誘電層
230 水平トレンチ
250 空隙
300 チャネルホール
310 機能層
315 リセス
400 機能層
410 障壁層
412 Al2O3副層
414 SiO2副層
415 第1の角
420 記憶層
421 第1のSiN副層
423 第1のSiON副層
425 第2のSiN副層
427 第2のSiON副層
429 第3のSiN副層
425 第2の角
430 トンネル層
431 第1のSiO副層
433 第1のSiON副層
435 第2のSiON副層
437 第3のSiON副層
439 第2のSiO副層
435 突起
500 チャネル層
700 スリット
D1 第1の内径
Claims (20)
- 三次元(3D)NANDメモリデバイスを形成するための方法であって、
基板に交互層スタックを形成するステップと、
前記交互層スタックに、前記交互層スタックを各々が鉛直に貫通する複数のチャネルホールを形成するステップと、
不均一な表面を有する記憶層を各々のチャネルホールの側壁に含む機能層を形成するステップと、
各々のチャネルホールにおいて前記機能層を覆うためにチャネル層を形成するステップと、
前記チャネル層を覆い、各々のチャネルホールを満たすために、充填構造を形成するステップと
を含む方法。 - 前記記憶層を複数の区分へと分割するステップをさらに含む、請求項1に記載の方法。
- 前記交互層スタックを形成することは、
導電層および誘電層を各々が備える導電層/誘電層の複数の対を前記基板に形成することを含む、請求項1に記載の方法。 - 各々のチャネルホールの前記側壁に複数のリセスを形成するために、前記機能層を形成する前に、前記チャネルホールによって露出させられた前記誘電層の一部分をエッチングするステップをさらに含む、請求項3に記載の方法。
- 前記交互層スタックを鉛直に貫通し、水平方向に延びるスリットを形成するステップと、
複数の水平トレンチを形成するために、前記交互層スタックにおいて、前記スリットを貫いて前記誘電層を除去するステップと、
前記導電層および前記機能層の露出された表面を覆うために絶縁層を形成するステップと
をさらに含む、請求項4に記載の方法。 - 前記記憶層を複数の区分へと分割するために、前記絶縁層を形成する前に、前記複数の水平トレンチによって露出された前記機能層の一部分を除去するステップをさらに含む、請求項4に記載の方法。
- 前記スリットを形成した後、前記基板において前記スリットの下にドープ領域を形成するステップと、
前記絶縁層を形成した後、前記ドープ領域を露出させるために前記スリットの底において前記絶縁層の一部分を除去するステップと、
前記スリットに導電性壁を前記ドープ領域と電気的に接触させるように形成するステップと
をさらに含む、請求項4に記載の方法。 - 前記機能層を形成する前に、各々のチャネルホールの前記側壁に複数のリセスを形成するステップをさらに含む、請求項1に記載の方法。
- 前記機能層を形成することは、
動作の間に電荷の流出を遮断するために各々のチャネルホールの前記側壁に障壁層を形成することと、
動作の間に電荷を保存するために前記障壁層の表面に前記記憶層を形成することと、
動作の間に電荷をトンネルさせるために前記記憶層の表面にトンネル層を形成することと
を含む、請求項8に記載の方法。 - 前記障壁層を形成することは、
各々のチャネルホールの前記側壁における前記複数のリセスに対応する複数の第1の角を前記障壁層が備えるように、各々のチャネルホールの前記側壁を覆うために前記障壁層を形成することを含む、請求項9に記載の方法。 - 前記記憶層を形成することは、
前記障壁層の前記複数の第1の角に対応する複数の第2の角を前記記憶層が備えるように、前記障壁層を覆うために前記記憶層を形成することを含む、請求項10に記載の方法。 - 前記トンネル層を形成することは、
各々のチャネルホールの前記側壁におけるリセスに各々が対応する複数の突起を前記トンネル層が備えるように、前記記憶層を覆うために前記トンネル層を形成することを含む、請求項11に記載の方法。 - 基板に配置される交互層スタックと、
前記交互層スタックにおける、前記交互層スタックを各々が鉛直に貫通する複数のチャネルホールと、
各々のチャネルホールの側壁に配置され、不均一な表面を有する記憶層を含む機能層と、
各々のチャネルホールにおいて前記機能層を覆うために配置されるチャネル層と、
前記チャネル層を覆い、各々のチャネルホールを満たすために配置される充填構造と
を備える三次元(3D)NANDメモリデバイス。 - 前記記憶層は複数の分割された区分を含む、請求項13に記載のデバイス。
- 前記交互層スタックは、
導電層および誘電層を各々が備える導電層/誘電層の複数の対を備える、請求項13に記載のデバイス。 - 前記交互層スタックは、
絶縁層によって覆われる複数の導電層と、
隣接する導電層同士の間の複数の空隙と
を備える、請求項13に記載のデバイス。 - 前記交互層スタックを鉛直に貫通し、水平方向に延びるスリットと、
前記スリットに隣接して位置させられる前記基板におけるドープ領域と、
前記スリットにおいて、前記ドープ領域と接触している導電性壁と
をさらに備える、請求項13に記載のデバイス。 - 前記機能層は、
各々のチャネルホールの前記側壁に配置され、動作の間に電荷の流出を遮断するように構成される障壁層と、
前記障壁層の表面に配置され、動作の間に電荷を保存するように構成される前記記憶層と、
前記記憶層の表面に配置され、動作の間に電荷のトンネリングを許容するように構成されるトンネル層と
を備える、請求項13に記載のデバイス。 - 前記障壁層は、各々のチャネルホールの前記側壁における前記複数のリセスに対応する複数の第1の角を備え、
前記記憶層は、前記障壁層の前記複数の第1の角に対応する複数の第2の角を備え、
前記トンネル層は、各々のチャネルホールの前記側壁におけるリセスに各々が対応する複数の突起を備える、請求項18に記載のデバイス。 - 前記障壁層はAl2O3副層とSiO2副層とを備え、
前記記憶層は、第1のSiN副層と、第1のSiON副層と、第2のSiN副層と、第2のSiON副層と、第3のSiN副層とを備え、
前記トンネル層は、第1のSiO副層と、第1のSiON副層と、第2のSiON副層と、第3のSiON副層と、第2のSiO副層とを備える、請求項18に記載のデバイス。
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EP (1) | EP3844806B1 (ja) |
JP (1) | JP2021535627A (ja) |
KR (1) | KR20210022093A (ja) |
CN (1) | CN109643718B (ja) |
TW (1) | TWI693703B (ja) |
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WO2020103082A1 (en) | 2018-11-22 | 2020-05-28 | Yangtze Memory Technologies Co., Ltd. | Three-dimensional memory devices and fabricating methods thereof |
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Also Published As
Publication number | Publication date |
---|---|
EP3844806B1 (en) | 2024-01-17 |
EP3844806A4 (en) | 2022-04-06 |
TW202021098A (zh) | 2020-06-01 |
KR20210022093A (ko) | 2021-03-02 |
WO2020103082A1 (en) | 2020-05-28 |
US11844216B2 (en) | 2023-12-12 |
CN109643718A (zh) | 2019-04-16 |
US11121150B2 (en) | 2021-09-14 |
US20200168627A1 (en) | 2020-05-28 |
CN109643718B (zh) | 2019-10-18 |
EP3844806A1 (en) | 2021-07-07 |
US20210366930A1 (en) | 2021-11-25 |
TWI693703B (zh) | 2020-05-11 |
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