|
US7758794B2
(en)
|
2001-10-29 |
2010-07-20 |
Princeton University |
Method of making an article comprising nanoscale patterns with reduced edge roughness
|
|
US7250371B2
(en)
|
2003-08-26 |
2007-07-31 |
Lam Research Corporation |
Reduction of feature critical dimensions
|
|
US8123968B2
(en)
|
2005-08-25 |
2012-02-28 |
Round Rock Research, Llc |
Multiple deposition for integration of spacers in pitch multiplication process
|
|
US7459363B2
(en)
|
2006-02-22 |
2008-12-02 |
Micron Technology, Inc. |
Line edge roughness reduction
|
|
KR101605005B1
(ko)
|
2007-12-21 |
2016-03-21 |
램 리써치 코포레이션 |
Arc 층 오프닝을 이용한 cd 바이어스 로딩 제어
|
|
US7998872B2
(en)
|
2008-02-06 |
2011-08-16 |
Tokyo Electron Limited |
Method for etching a silicon-containing ARC layer to reduce roughness and CD
|
|
JP5223364B2
(ja)
|
2008-02-07 |
2013-06-26 |
東京エレクトロン株式会社 |
プラズマエッチング方法及び記憶媒体
|
|
US8866254B2
(en)
|
2008-02-19 |
2014-10-21 |
Micron Technology, Inc. |
Devices including fin transistors robust to gate shorts and methods of making the same
|
|
JP4972594B2
(ja)
|
2008-03-26 |
2012-07-11 |
東京エレクトロン株式会社 |
エッチング方法及び半導体デバイスの製造方法
|
|
US8252194B2
(en)
|
2008-05-02 |
2012-08-28 |
Micron Technology, Inc. |
Methods of removing silicon oxide
|
|
US8298949B2
(en)
|
2009-01-07 |
2012-10-30 |
Lam Research Corporation |
Profile and CD uniformity control by plasma oxidation treatment
|
|
US9390909B2
(en)
*
|
2013-11-07 |
2016-07-12 |
Novellus Systems, Inc. |
Soft landing nanolaminates for advanced patterning
|
|
US9892917B2
(en)
|
2010-04-15 |
2018-02-13 |
Lam Research Corporation |
Plasma assisted atomic layer deposition of multi-layer films for patterning applications
|
|
US9685320B2
(en)
*
|
2010-09-23 |
2017-06-20 |
Lam Research Corporation |
Methods for depositing silicon oxide
|
|
US8901016B2
(en)
*
|
2010-12-28 |
2014-12-02 |
Asm Japan K.K. |
Method of forming metal oxide hardmask
|
|
US8334083B2
(en)
|
2011-03-22 |
2012-12-18 |
Tokyo Electron Limited |
Etch process for controlling pattern CD and integrity in multi-layer masks
|
|
KR101819721B1
(ko)
|
2011-04-07 |
2018-02-28 |
피코순 오와이 |
플라즈마 소오스를 갖는 원자층 퇴적
|
|
US8298951B1
(en)
*
|
2011-04-13 |
2012-10-30 |
Asm Japan K.K. |
Footing reduction using etch-selective layer
|
|
US20130189845A1
(en)
*
|
2012-01-19 |
2013-07-25 |
Applied Materials, Inc. |
Conformal amorphous carbon for spacer and spacer protection applications
|
|
US8716149B2
(en)
*
|
2012-05-29 |
2014-05-06 |
GlobalFoundries, Inc. |
Methods for fabricating integrated circuits having improved spacers
|
|
US9034770B2
(en)
|
2012-09-17 |
2015-05-19 |
Applied Materials, Inc. |
Differential silicon oxide etch
|
|
US8815685B2
(en)
|
2013-01-31 |
2014-08-26 |
GlobalFoundries, Inc. |
Methods for fabricating integrated circuits having confined epitaxial growth regions
|
|
US9184233B2
(en)
|
2013-02-27 |
2015-11-10 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Structure and method for defect passivation to reduce junction leakage for finFET device
|
|
US9412871B2
(en)
|
2013-03-08 |
2016-08-09 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
FinFET with channel backside passivation layer device and method
|
|
US9287262B2
(en)
|
2013-10-10 |
2016-03-15 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Passivated and faceted for fin field effect transistor
|
|
KR101674972B1
(ko)
*
|
2013-12-26 |
2016-11-10 |
한국과학기술원 |
나노 스케일 패터닝 방법 및 이로부터 제조된 전자기기용 집적소자
|
|
US9269590B2
(en)
|
2014-04-07 |
2016-02-23 |
Applied Materials, Inc. |
Spacer formation
|
|
CN105470132B
(zh)
|
2014-09-03 |
2018-08-10 |
中芯国际集成电路制造(上海)有限公司 |
鳍式场效应管的形成方法
|
|
KR102412517B1
(ko)
*
|
2014-10-08 |
2022-06-22 |
어플라이드 머티어리얼스, 인코포레이티드 |
이중층 ald를 사용한 정확한 임계 치수 제어
|
|
US9818633B2
(en)
|
2014-10-17 |
2017-11-14 |
Lam Research Corporation |
Equipment front end module for transferring wafers and method of transferring wafers
|
|
US9659929B2
(en)
|
2014-10-31 |
2017-05-23 |
Infineon Technologies Dresden Gmbh |
Semiconductor device with enhancement and depletion FinFET cells
|
|
US9576811B2
(en)
|
2015-01-12 |
2017-02-21 |
Lam Research Corporation |
Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)
|
|
US9991132B2
(en)
*
|
2015-04-17 |
2018-06-05 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lithographic technique incorporating varied pattern materials
|
|
US9806252B2
(en)
|
2015-04-20 |
2017-10-31 |
Lam Research Corporation |
Dry plasma etch method to pattern MRAM stack
|
|
US9870899B2
(en)
|
2015-04-24 |
2018-01-16 |
Lam Research Corporation |
Cobalt etch back
|
|
US9653571B2
(en)
*
|
2015-06-15 |
2017-05-16 |
International Business Machines Corporation |
Freestanding spacer having sub-lithographic lateral dimension and method of forming same
|
|
US9922839B2
(en)
|
2015-06-23 |
2018-03-20 |
Lam Research Corporation |
Low roughness EUV lithography
|
|
US20170053793A1
(en)
*
|
2015-08-17 |
2017-02-23 |
Tokyo Electron Limited |
Method and system for sculpting spacer sidewall mask
|
|
US10692974B2
(en)
|
2015-09-18 |
2020-06-23 |
Intel Corporation |
Deuterium-based passivation of non-planar transistor interfaces
|
|
US10727073B2
(en)
|
2016-02-04 |
2020-07-28 |
Lam Research Corporation |
Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces
|
|
US10483109B2
(en)
|
2016-04-12 |
2019-11-19 |
Tokyo Electron Limited |
Self-aligned spacer formation
|
|
US9997631B2
(en)
|
2016-06-03 |
2018-06-12 |
Taiwan Semiconductor Manufacturing Company |
Methods for reducing contact resistance in semiconductors manufacturing process
|
|
US10074543B2
(en)
*
|
2016-08-31 |
2018-09-11 |
Lam Research Corporation |
High dry etch rate materials for semiconductor patterning applications
|
|
US10546748B2
(en)
*
|
2017-02-17 |
2020-01-28 |
Lam Research Corporation |
Tin oxide films in semiconductor device manufacturing
|
|
US10559461B2
(en)
|
2017-04-19 |
2020-02-11 |
Lam Research Corporation |
Selective deposition with atomic layer etch reset
|
|
US9997371B1
(en)
|
2017-04-24 |
2018-06-12 |
Lam Research Corporation |
Atomic layer etch methods and hardware for patterning applications
|
|
US10515815B2
(en)
|
2017-11-21 |
2019-12-24 |
Lam Research Corporation |
Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation
|
|
US10734238B2
(en)
|
2017-11-21 |
2020-08-04 |
Lam Research Corporation |
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
|
|
US10658174B2
(en)
|
2017-11-21 |
2020-05-19 |
Lam Research Corporation |
Atomic layer deposition and etch for reducing roughness
|