JP2021511532A - 傾斜周期構造を有する計測ターゲット及び方法 - Google Patents

傾斜周期構造を有する計測ターゲット及び方法 Download PDF

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Publication number
JP2021511532A
JP2021511532A JP2020538551A JP2020538551A JP2021511532A JP 2021511532 A JP2021511532 A JP 2021511532A JP 2020538551 A JP2020538551 A JP 2020538551A JP 2020538551 A JP2020538551 A JP 2020538551A JP 2021511532 A JP2021511532 A JP 2021511532A
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Japan
Prior art keywords
measurement
measurement target
target
tilted
periodic structure
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Pending
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JP2020538551A
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English (en)
Japanese (ja)
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JP2021511532A5 (enExample
Inventor
フェラー ヨエル
フェラー ヨエル
マーク ギノブカー
マーク ギノブカー
アレクサンダー スヴィザー
アレクサンダー スヴィザー
ウラジミール レビンスキ
ウラジミール レビンスキ
インナ タルシシュ−シャピア
インナ タルシシュ−シャピア
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KLA Corp
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KLA Corp
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Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2021511532A publication Critical patent/JP2021511532A/ja
Publication of JP2021511532A5 publication Critical patent/JP2021511532A5/ja
Priority to JP2022160693A priority Critical patent/JP7544781B2/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2020538551A 2018-01-12 2018-11-29 傾斜周期構造を有する計測ターゲット及び方法 Pending JP2021511532A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022160693A JP7544781B2 (ja) 2018-01-12 2022-10-05 傾斜周期構造を有する計測ターゲット及び方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862617086P 2018-01-12 2018-01-12
US62/617,086 2018-01-12
PCT/US2018/062931 WO2019139685A1 (en) 2018-01-12 2018-11-29 Metrology targets and methods with oblique periodic structures

Related Child Applications (1)

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JP2022160693A Division JP7544781B2 (ja) 2018-01-12 2022-10-05 傾斜周期構造を有する計測ターゲット及び方法

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JP2021511532A true JP2021511532A (ja) 2021-05-06
JP2021511532A5 JP2021511532A5 (enExample) 2022-01-06

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US (1) US11137692B2 (enExample)
JP (2) JP2021511532A (enExample)
KR (1) KR102408316B1 (enExample)
CN (1) CN111542784B (enExample)
SG (1) SG11201913459RA (enExample)
TW (1) TWI780291B (enExample)
WO (1) WO2019139685A1 (enExample)

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JP2023522847A (ja) * 2020-04-15 2023-06-01 ケーエルエー コーポレイション 半導体デバイスの位置ずれを計測する際役立つデバイス規模フィーチャを有する位置ずれターゲット

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US11256177B2 (en) * 2019-09-11 2022-02-22 Kla Corporation Imaging overlay targets using Moiré elements and rotational symmetry arrangements
KR102494237B1 (ko) * 2019-09-16 2023-01-31 케이엘에이 코포레이션 주기적 반도체 디바이스 오정합 계측 시스템 및 방법
CN112731778B (zh) * 2019-10-28 2022-08-02 长鑫存储技术有限公司 一种半导体套刻精度的控制方法及叠层标记
KR102857305B1 (ko) * 2020-02-07 2025-09-08 케이엘에이 코포레이션 반도체 디바이스의 오정합 측정에서의 비직교 타겟 및 이를 사용하기 위한 방법
CN113539867A (zh) * 2020-04-14 2021-10-22 中国科学院微电子研究所 半导体器件套刻精度的测量方法
US11604149B2 (en) 2020-04-23 2023-03-14 Kla Corporation Metrology methods and optical schemes for measurement of misregistration by using hatched target designs
CN111508932B (zh) * 2020-04-27 2021-12-14 深圳中科飞测科技股份有限公司 套刻标记及套刻误差的测量方法
US11355375B2 (en) * 2020-07-09 2022-06-07 Kla Corporation Device-like overlay metrology targets displaying Moiré effects
WO2022253526A1 (en) * 2021-05-31 2022-12-08 Asml Netherlands B.V. Metrology measurement method and apparatus
EP4137889A1 (en) * 2021-08-20 2023-02-22 ASML Netherlands B.V. Metrology measurement method and apparatus
US11703767B2 (en) * 2021-06-28 2023-07-18 Kla Corporation Overlay mark design for electron beam overlay
CN118119892A (zh) * 2021-10-19 2024-05-31 Asml荷兰有限公司 图案匹配方法
US12242202B2 (en) 2022-01-04 2025-03-04 Nanya Technology Corporation Method for overlay error correction
US20230213872A1 (en) * 2022-01-04 2023-07-06 Nanya Technology Corporation Mark for overlay measurement

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JPH09166866A (ja) * 1995-12-18 1997-06-24 Nec Corp フォトマスクの目合わせマーク及び半導体装置
JP2000012445A (ja) * 1998-06-25 2000-01-14 Nikon Corp 位置検出方法及び装置、並びに前記装置を備えた露光装置
JP2004508711A (ja) * 2000-08-30 2004-03-18 ケーエルエー−テンカー・コーポレーション 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法
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JP2015095631A (ja) * 2013-11-14 2015-05-18 マイクロン テクノロジー， インク． 半導体装置
JP2017509013A (ja) * 2014-02-21 2017-03-30 エーエスエムエル ネザーランズ ビー．ブイ． ターゲット構成の最適化及び関連するターゲット
JP2018514807A (ja) * 2015-04-21 2018-06-07 ケーエルエー−テンカー コーポレイション 傾斜デバイス設計のための計測ターゲット設計
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023522847A (ja) * 2020-04-15 2023-06-01 ケーエルエー コーポレイション 半導体デバイスの位置ずれを計測する際役立つデバイス規模フィーチャを有する位置ずれターゲット
JP7369306B2 (ja) 2020-04-15 2023-10-25 ケーエルエー コーポレイション 半導体デバイスの位置ずれを計測する際役立つデバイス規模フィーチャを有する位置ずれターゲット

Also Published As

Publication number Publication date
KR102408316B1 (ko) 2022-06-10
US20200124982A1 (en) 2020-04-23
JP2022183203A (ja) 2022-12-08
TWI780291B (zh) 2022-10-11
JP7544781B2 (ja) 2024-09-03
TW201939171A (zh) 2019-10-01
CN111542784A (zh) 2020-08-14
CN111542784B (zh) 2025-05-06
US11137692B2 (en) 2021-10-05
WO2019139685A1 (en) 2019-07-18
KR20200099615A (ko) 2020-08-24
SG11201913459RA (en) 2020-07-29

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