JP2021506131A5 - - Google Patents
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- Publication number
- JP2021506131A5 JP2021506131A5 JP2020531513A JP2020531513A JP2021506131A5 JP 2021506131 A5 JP2021506131 A5 JP 2021506131A5 JP 2020531513 A JP2020531513 A JP 2020531513A JP 2020531513 A JP2020531513 A JP 2020531513A JP 2021506131 A5 JP2021506131 A5 JP 2021506131A5
- Authority
- JP
- Japan
- Prior art keywords
- fluoride
- ammonium
- acid
- mass
- fluorosilicate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 4
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 claims 2
- 239000012459 cleaning agent Substances 0.000 claims 2
- QEWYKACRFQMRMB-UHFFFAOYSA-N fluoroacetic acid Chemical compound OC(=O)CF QEWYKACRFQMRMB-UHFFFAOYSA-N 0.000 claims 2
- -1 Ammonium Fluorosilicate Chemical compound 0.000 claims 1
- SRLUQXUPKGPNMZ-UHFFFAOYSA-N CCN(CC)CC.F.F.F.Cl Chemical compound CCN(CC)CC.F.F.F.Cl SRLUQXUPKGPNMZ-UHFFFAOYSA-N 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 claims 1
- QNZDVGURVWUWIY-UHFFFAOYSA-N azanium;2-fluoroacetate Chemical compound [NH4+].[O-]C(=O)CF QNZDVGURVWUWIY-UHFFFAOYSA-N 0.000 claims 1
- HQABUPZFAYXKJW-UHFFFAOYSA-O butylazanium Chemical compound CCCC[NH3+] HQABUPZFAYXKJW-UHFFFAOYSA-O 0.000 claims 1
- 229940104869 fluorosilicate Drugs 0.000 claims 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17206097.2 | 2017-12-08 | ||
| EP17206097 | 2017-12-08 | ||
| PCT/EP2018/083684 WO2019110681A1 (en) | 2017-12-08 | 2018-12-05 | Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021506131A JP2021506131A (ja) | 2021-02-18 |
| JP2021506131A5 true JP2021506131A5 (https=) | 2021-12-16 |
| JP7330972B2 JP7330972B2 (ja) | 2023-08-22 |
Family
ID=60654767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020531513A Active JP7330972B2 (ja) | 2017-12-08 | 2018-12-05 | 半導体基板からエッチング後または灰化後の残留物を除去するための洗浄剤組成物、およびそれに対応する製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11377624B2 (https=) |
| EP (1) | EP3720938A1 (https=) |
| JP (1) | JP7330972B2 (https=) |
| KR (1) | KR102786662B1 (https=) |
| CN (1) | CN111465679A (https=) |
| IL (1) | IL274877B2 (https=) |
| TW (1) | TWI799476B (https=) |
| WO (1) | WO2019110681A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11629315B2 (en) | 2018-04-27 | 2023-04-18 | Mitsubishi Gas Chemical Company, Inc. | Aqueous composition and cleaning method using same |
| KR20220058069A (ko) * | 2020-10-30 | 2022-05-09 | 주식회사 이엔에프테크놀로지 | 세정제 조성물 및 이를 이용한 세정방법 |
| KR102944353B1 (ko) * | 2020-11-06 | 2026-03-27 | 주식회사 케이씨텍 | 연마 입자 용해용 조성물 및 이를 이용한 세정 방법 |
| US12599937B2 (en) * | 2024-01-23 | 2026-04-14 | Applied Materials, Inc. | Water-based, high-efficiency chemical reagent for substrate surface particle removal |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6696222B2 (en) | 2001-07-24 | 2004-02-24 | Silicon Integrated Systems Corp. | Dual damascene process using metal hard mask |
| WO2004094581A1 (en) * | 2003-04-18 | 2004-11-04 | Ekc Technology, Inc. | Aqueous fluoride compositions for cleaning semiconductor devices |
| KR20060014388A (ko) * | 2003-05-02 | 2006-02-15 | 이케이씨 테크놀로지, 인코포레이티드 | 반도체 공정에서의 에칭후 잔류물의 제거 방법 |
| JP4390616B2 (ja) | 2004-04-27 | 2009-12-24 | Ｎｅｃエレクトロニクス株式会社 | 洗浄液及び半導体装置の製造方法 |
| US7888302B2 (en) | 2005-02-03 | 2011-02-15 | Air Products And Chemicals, Inc. | Aqueous based residue removers comprising fluoride |
| SG177915A1 (en) | 2006-12-21 | 2012-02-28 | Advanced Tech Materials | Liquid cleaner for the removal of post-etch residues |
| KR20100082012A (ko) * | 2007-11-16 | 2010-07-15 | 이케이씨 테크놀로지, 인코포레이티드 | 반도체 기판으로부터의 금속 하드 마스크 에칭 잔류물의 제거를 위한 조성물 |
| TWI435932B (zh) * | 2007-11-23 | 2014-05-01 | Anji Microelectronics Co Ltd | 用以清洗等離子蝕刻殘留物之清洗液 |
| WO2010048139A2 (en) | 2008-10-21 | 2010-04-29 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
| US8114773B2 (en) | 2010-07-06 | 2012-02-14 | United Microelectronics Corp. | Cleaning solution, cleaning method and damascene process using the same |
| EP2593964A4 (en) * | 2010-07-16 | 2017-12-06 | Entegris Inc. | Aqueous cleaner for the removal of post-etch residues |
| TWI588253B (zh) * | 2012-03-16 | 2017-06-21 | 巴地斯顏料化工廠 | 光阻剝除與清潔組合物及其製備方法與用途 |
| WO2013173743A2 (en) | 2012-05-18 | 2013-11-21 | Advanced Technology Materials, Inc. | Aqueous clean solution with low copper etch rate for organic residue removal improvement |
| US9536730B2 (en) * | 2012-10-23 | 2017-01-03 | Air Products And Chemicals, Inc. | Cleaning formulations |
| KR102338550B1 (ko) | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법 |
| CN116286222A (zh) | 2014-05-13 | 2023-06-23 | 巴斯夫欧洲公司 | Tin拉回和清洁组合物 |
| CN113214920A (zh) * | 2015-03-31 | 2021-08-06 | 弗萨姆材料美国有限责任公司 | 清洁制剂 |
| JP6970675B2 (ja) * | 2016-09-29 | 2021-11-24 | 富士フイルム株式会社 | 処理液および積層体の処理方法 |
| IL274880B2 (en) * | 2017-12-08 | 2024-04-01 | Basf Se | Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt |
-
2018
- 2018-12-05 IL IL274877A patent/IL274877B2/en unknown
- 2018-12-05 JP JP2020531513A patent/JP7330972B2/ja active Active
- 2018-12-05 WO PCT/EP2018/083684 patent/WO2019110681A1/en not_active Ceased
- 2018-12-05 US US16/767,336 patent/US11377624B2/en active Active
- 2018-12-05 CN CN201880079173.3A patent/CN111465679A/zh active Pending
- 2018-12-05 EP EP18811283.3A patent/EP3720938A1/en active Pending
- 2018-12-05 KR KR1020207014948A patent/KR102786662B1/ko active Active
- 2018-12-07 TW TW107144121A patent/TWI799476B/zh active
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