JP2007049145A5 - - Google Patents
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- Publication number
- JP2007049145A5 JP2007049145A5 JP2006213669A JP2006213669A JP2007049145A5 JP 2007049145 A5 JP2007049145 A5 JP 2007049145A5 JP 2006213669 A JP2006213669 A JP 2006213669A JP 2006213669 A JP2006213669 A JP 2006213669A JP 2007049145 A5 JP2007049145 A5 JP 2007049145A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- mass
- dielectric constant
- film according
- persulfate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims 2
- 150000002222 fluorine compounds Chemical class 0.000 claims 2
- -1 peracid compound Chemical class 0.000 claims 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims 1
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 230000003796 beauty Effects 0.000 claims 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 claims 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050072471A KR100685738B1 (ko) | 2005-08-08 | 2005-08-08 | 절연 물질 제거용 조성물, 이를 이용한 절연막의 제거 방법및 기판의 재생 방법 |
| KR10-2005-0072471 | 2005-08-08 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007049145A JP2007049145A (ja) | 2007-02-22 |
| JP2007049145A5 true JP2007049145A5 (https=) | 2009-09-17 |
| JP4904111B2 JP4904111B2 (ja) | 2012-03-28 |
Family
ID=37851670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006213669A Active JP4904111B2 (ja) | 2005-08-08 | 2006-08-04 | 絶縁膜の除去方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7566666B2 (https=) |
| JP (1) | JP4904111B2 (https=) |
| KR (1) | KR100685738B1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100742276B1 (ko) * | 2004-11-10 | 2007-07-24 | 삼성전자주식회사 | 저유전율 유전막을 제거하기 위한 식각 용액 및 이를이용한 저유전율 유전막 식각 방법 |
| US7208325B2 (en) * | 2005-01-18 | 2007-04-24 | Applied Materials, Inc. | Refreshing wafers having low-k dielectric materials |
| KR100685738B1 (ko) * | 2005-08-08 | 2007-02-26 | 삼성전자주식회사 | 절연 물질 제거용 조성물, 이를 이용한 절연막의 제거 방법및 기판의 재생 방법 |
| KR100706822B1 (ko) * | 2005-10-17 | 2007-04-12 | 삼성전자주식회사 | 절연 물질 제거용 조성물, 이를 이용한 절연막의 제거 방법및 기판의 재생 방법 |
| EP1946358A4 (en) | 2005-11-09 | 2009-03-04 | Advanced Tech Materials | COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS ON WHICH DIELECTRIC MATERIAL WITH LOW DIELECTRIC CONSTANT |
| SG175559A1 (en) * | 2006-09-25 | 2011-11-28 | Advanced Tech Materials | Compositions and methods for the removal of photoresist for a wafer rework application |
| US20100019327A1 (en) * | 2008-07-22 | 2010-01-28 | Eun Jong Shin | Semiconductor Device and Method of Fabricating the Same |
| JP5066152B2 (ja) * | 2009-09-25 | 2012-11-07 | 株式会社東芝 | 洗浄システム |
| CN102668044A (zh) * | 2009-11-18 | 2012-09-12 | 3M创新有限公司 | 用于ii-vi族半导体的新型湿蚀刻剂及方法 |
| WO2012048079A2 (en) | 2010-10-06 | 2012-04-12 | Advanced Technology Materials, Inc. | Composition and process for selectively etching metal nitrides |
| SG11201403556WA (en) | 2011-12-28 | 2014-07-30 | Advanced Tech Materials | Compositions and methods for selectively etching titanium nitride |
| KR102338550B1 (ko) * | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법 |
| JP6329733B2 (ja) * | 2013-06-28 | 2018-05-23 | 一般財団法人ファインセラミックスセンター | 半導体ウェハのエッチング方法、半導体ウェハの製造方法および半導体ウェハの結晶欠陥検出方法 |
| KR102338526B1 (ko) * | 2013-07-31 | 2021-12-14 | 엔테그리스, 아이엔씨. | Cu/W 호환성을 갖는, 금속 하드 마스크 및 에칭-후 잔여물을 제거하기 위한 수성 제형 |
| US10689573B2 (en) | 2016-12-26 | 2020-06-23 | Mitsubishi Gas Chemical Company, Inc. | Wet etching composition for substrate having SiN layer and Si layer and wet etching method using same |
| JP6319536B1 (ja) * | 2016-12-26 | 2018-05-09 | 三菱瓦斯化学株式会社 | ＳｉＮ層およびＳｉ層を有する基板用ウェットエッチング組成物およびこれを用いたウェットエッチング方法 |
| JP7345966B2 (ja) * | 2019-06-24 | 2023-09-19 | 株式会社ディスコ | ウェーハの再生方法 |
| CN111524790A (zh) * | 2020-04-26 | 2020-08-11 | 上海华力集成电路制造有限公司 | 一种通过高温湿氧氧化法改善硅片可回收性的工艺方法 |
| JP7779723B2 (ja) * | 2021-12-17 | 2025-12-03 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| US12288693B2 (en) | 2022-03-04 | 2025-04-29 | Tokuyama Corporation | Etching solution, method for treating substrate with the etching solution, and method for manufacturing semiconductor device |
| KR20240025484A (ko) | 2022-08-18 | 2024-02-27 | 가부시끼가이샤 도꾸야마 | 에칭액, 그 에칭액을 사용한 실리콘 디바이스의 제조 방법 및 기판 처리 방법 |
| TW202510061A (zh) * | 2023-03-06 | 2025-03-01 | 日商東京威力科創股份有限公司 | 基板處理方法 |
| CN119120026A (zh) * | 2024-08-06 | 2024-12-13 | 湖北兴福电子材料股份有限公司 | 一种掺碳氮化硅/氧化硅的选择性蚀刻液 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3036885A (en) * | 1958-11-15 | 1962-05-29 | Degussa | Process for the production of caro's acid salts and solutions thereof |
| US6017811A (en) | 1993-09-09 | 2000-01-25 | The United States Of America As Represented By The Secretary Of The Navy | Method of making improved electrical contact to porous silicon |
| KR100248113B1 (ko) * | 1997-01-21 | 2000-03-15 | 이기원 | 전자 표시 장치 및 기판용 세정 및 식각 조성물 |
| JP2002528903A (ja) * | 1998-10-23 | 2002-09-03 | アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド | 活性剤溶液を含有し、化学機械的に磨くためのスラリーシステム |
| US6471735B1 (en) * | 1999-08-17 | 2002-10-29 | Air Liquide America Corporation | Compositions for use in a chemical-mechanical planarization process |
| JP2001065459A (ja) | 1999-08-30 | 2001-03-16 | Kobe Steel Ltd | 油冷式圧縮機 |
| JP2002134468A (ja) | 2000-10-26 | 2002-05-10 | Daikin Ind Ltd | 犠牲またはマスク酸化膜除去液 |
| US6391794B1 (en) * | 2000-12-07 | 2002-05-21 | Micron Technology, Inc. | Composition and method for cleaning residual debris from semiconductor surfaces |
| JP3889271B2 (ja) | 2000-12-15 | 2007-03-07 | 株式会社東芝 | 半導体装置の製造方法 |
| KR100387265B1 (ko) | 2000-12-29 | 2003-06-12 | 주식회사 하이닉스반도체 | 반도체 소자의 금속 배선 및 커패시터 제조 방법 |
| KR20020081923A (ko) | 2001-04-20 | 2002-10-30 | 삼성전자 주식회사 | 반도체 웨이퍼의 세정방법 |
| EP1389496A1 (en) | 2001-05-22 | 2004-02-18 | Mitsubishi Chemical Corporation | Method for cleaning surface of substrate |
| JP4803625B2 (ja) * | 2001-09-04 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US6573175B1 (en) * | 2001-11-30 | 2003-06-03 | Micron Technology, Inc. | Dry low k film application for interlevel dielectric and method of cleaning etched features |
| JP2004140196A (ja) | 2002-10-17 | 2004-05-13 | Nec Electronics Corp | 半導体装置の製造方法および基板洗浄装置 |
| US6693047B1 (en) * | 2002-12-19 | 2004-02-17 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method for recycling semiconductor wafers having carbon doped low-k dielectric layers |
| SG129274A1 (en) * | 2003-02-19 | 2007-02-26 | Mitsubishi Gas Chemical Co | Cleaaning solution and cleaning process using the solution |
| KR100554515B1 (ko) | 2003-02-27 | 2006-03-03 | 삼성전자주식회사 | 세정액 및 이를 이용한 기판의 세정방법 |
| JP4270544B2 (ja) | 2003-03-06 | 2009-06-03 | 花王株式会社 | 剥離剤組成物 |
| KR100546099B1 (ko) | 2003-05-30 | 2006-01-24 | 주식회사 하이닉스반도체 | 반도체소자의 금속배선 형성방법 |
| JP2005167181A (ja) | 2003-11-10 | 2005-06-23 | Daikin Ind Ltd | Ｌｏｗ−ｋ膜用エッチング液及びエッチング方法 |
| US7208325B2 (en) * | 2005-01-18 | 2007-04-24 | Applied Materials, Inc. | Refreshing wafers having low-k dielectric materials |
| KR100685738B1 (ko) | 2005-08-08 | 2007-02-26 | 삼성전자주식회사 | 절연 물질 제거용 조성물, 이를 이용한 절연막의 제거 방법및 기판의 재생 방법 |
-
2005
- 2005-08-08 KR KR1020050072471A patent/KR100685738B1/ko not_active Expired - Fee Related
-
2006
- 2006-08-04 JP JP2006213669A patent/JP4904111B2/ja active Active
- 2006-08-08 US US11/500,434 patent/US7566666B2/en active Active
-
2009
- 2009-06-30 US US12/494,572 patent/US7842623B2/en active Active
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