TWI799476B - 用於從半導體基板及對應製程中移除蝕刻後或灰化後殘餘物之清潔組成物 - Google Patents
用於從半導體基板及對應製程中移除蝕刻後或灰化後殘餘物之清潔組成物 Download PDFInfo
- Publication number
- TWI799476B TWI799476B TW107144121A TW107144121A TWI799476B TW I799476 B TWI799476 B TW I799476B TW 107144121 A TW107144121 A TW 107144121A TW 107144121 A TW107144121 A TW 107144121A TW I799476 B TWI799476 B TW I799476B
- Authority
- TW
- Taiwan
- Prior art keywords
- post
- etch
- semiconductor substrate
- manufacturing process
- cleaning composition
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/24—Organic compounds containing halogen
- C11D3/245—Organic compounds containing halogen containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17206097.2 | 2017-12-08 | ||
??17206097.2 | 2017-12-08 | ||
EP17206097 | 2017-12-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201925447A TW201925447A (zh) | 2019-07-01 |
TWI799476B true TWI799476B (zh) | 2023-04-21 |
Family
ID=60654767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107144121A TWI799476B (zh) | 2017-12-08 | 2018-12-07 | 用於從半導體基板及對應製程中移除蝕刻後或灰化後殘餘物之清潔組成物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11377624B2 (zh) |
EP (1) | EP3720938A1 (zh) |
JP (1) | JP7330972B2 (zh) |
KR (1) | KR20200088821A (zh) |
CN (1) | CN111465679A (zh) |
IL (1) | IL274877B2 (zh) |
TW (1) | TWI799476B (zh) |
WO (1) | WO2019110681A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11629315B2 (en) | 2018-04-27 | 2023-04-18 | Mitsubishi Gas Chemical Company, Inc. | Aqueous composition and cleaning method using same |
KR20220058069A (ko) * | 2020-10-30 | 2022-05-09 | 주식회사 이엔에프테크놀로지 | 세정제 조성물 및 이를 이용한 세정방법 |
KR20220061628A (ko) * | 2020-11-06 | 2022-05-13 | 주식회사 케이씨텍 | 연마 입자 용해용 조성물 및 이를 이용한 세정 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200923076A (en) * | 2007-11-23 | 2009-06-01 | Anji Microelectronics Co Ltd | Cleaning solution for plasma etch residue removal |
US20100163788A1 (en) * | 2006-12-21 | 2010-07-01 | Advanced Technology Materials, Inc. | Liquid cleaner for the removal of post-etch residues |
US20150307818A1 (en) * | 2010-07-16 | 2015-10-29 | Advanced Technology Materials, Inc. | Aqueous cleaner for the removal of post-etch residues |
CN113214920A (zh) * | 2015-03-31 | 2021-08-06 | 弗萨姆材料美国有限责任公司 | 清洁制剂 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6696222B2 (en) | 2001-07-24 | 2004-02-24 | Silicon Integrated Systems Corp. | Dual damascene process using metal hard mask |
US7399365B2 (en) * | 2003-04-18 | 2008-07-15 | Ekc Technology, Inc. | Aqueous fluoride compositions for cleaning semiconductor devices |
WO2004100245A1 (en) | 2003-05-02 | 2004-11-18 | Ekc Technology, Inc. | Removal of post-etch residues in semiconductor processing |
JP4390616B2 (ja) | 2004-04-27 | 2009-12-24 | Necエレクトロニクス株式会社 | 洗浄液及び半導体装置の製造方法 |
US7888302B2 (en) | 2005-02-03 | 2011-02-15 | Air Products And Chemicals, Inc. | Aqueous based residue removers comprising fluoride |
KR101752684B1 (ko) | 2008-10-21 | 2017-07-04 | 엔테그리스, 아이엔씨. | 구리 세척 및 보호 조성물 |
US8114773B2 (en) | 2010-07-06 | 2012-02-14 | United Microelectronics Corp. | Cleaning solution, cleaning method and damascene process using the same |
TW201404877A (zh) | 2012-05-18 | 2014-02-01 | Advanced Tech Materials | 用於改善有機殘餘物移除之具有低銅蝕刻速率之清潔水溶液 |
US9536730B2 (en) * | 2012-10-23 | 2017-01-03 | Air Products And Chemicals, Inc. | Cleaning formulations |
SG10201708364XA (en) | 2013-06-06 | 2017-11-29 | Entegris Inc | Compositions and methods for selectively etching titanium nitride |
WO2015173730A1 (en) | 2014-05-13 | 2015-11-19 | Basf Se | Tin pull-back and cleaning composition |
KR102160019B1 (ko) | 2016-09-29 | 2020-09-28 | 후지필름 가부시키가이샤 | 처리액 및 적층체의 처리 방법 |
US20200339523A1 (en) * | 2017-12-08 | 2020-10-29 | Basf Se | Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt |
-
2018
- 2018-12-05 IL IL274877A patent/IL274877B2/en unknown
- 2018-12-05 US US16/767,336 patent/US11377624B2/en active Active
- 2018-12-05 CN CN201880079173.3A patent/CN111465679A/zh active Pending
- 2018-12-05 KR KR1020207014948A patent/KR20200088821A/ko not_active Application Discontinuation
- 2018-12-05 EP EP18811283.3A patent/EP3720938A1/en active Pending
- 2018-12-05 JP JP2020531513A patent/JP7330972B2/ja active Active
- 2018-12-05 WO PCT/EP2018/083684 patent/WO2019110681A1/en unknown
- 2018-12-07 TW TW107144121A patent/TWI799476B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100163788A1 (en) * | 2006-12-21 | 2010-07-01 | Advanced Technology Materials, Inc. | Liquid cleaner for the removal of post-etch residues |
TW200923076A (en) * | 2007-11-23 | 2009-06-01 | Anji Microelectronics Co Ltd | Cleaning solution for plasma etch residue removal |
US20150307818A1 (en) * | 2010-07-16 | 2015-10-29 | Advanced Technology Materials, Inc. | Aqueous cleaner for the removal of post-etch residues |
CN113214920A (zh) * | 2015-03-31 | 2021-08-06 | 弗萨姆材料美国有限责任公司 | 清洁制剂 |
Also Published As
Publication number | Publication date |
---|---|
CN111465679A (zh) | 2020-07-28 |
TW201925447A (zh) | 2019-07-01 |
WO2019110681A1 (en) | 2019-06-13 |
JP2021506131A (ja) | 2021-02-18 |
JP7330972B2 (ja) | 2023-08-22 |
EP3720938A1 (en) | 2020-10-14 |
IL274877B2 (en) | 2024-03-01 |
US11377624B2 (en) | 2022-07-05 |
KR20200088821A (ko) | 2020-07-23 |
IL274877A (en) | 2020-07-30 |
US20210301221A1 (en) | 2021-09-30 |
IL274877B1 (en) | 2023-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL262630B (en) | Cleaning products for removing the light-resistant materials from the substrate layers made of semiconductor | |
IL269487A (en) | Cleaning products for removing residues from substrates that are semi-conductive | |
SG10201510541PA (en) | Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation | |
IL265773B (en) | Cleaning agents for removing residues on semiconductor substrates | |
IL274877A (en) | A cleaning agent for removing residues after burning or after ash from a semiconductor substrate and a corresponding manufacturing process | |
SG10201906909VA (en) | COMPOSITION FOR TiN HARD MASK REMOVAL AND ETCH RESIDUE CLEANING | |
IL253202A0 (en) | Stripping compounds for removing photoresist from semiconductor materials | |
SG11202001854VA (en) | Compositions and methods for etching silicon nitride-containing substrates | |
TWI563076B (en) | Aqueous, nitrogen-free cleaning composition and its use for removing residues and contaminants from semiconductor substrates suitable for manufacturing microelectronic devices | |
EP3245668A4 (en) | Cleaning composition and method for cleaning semiconductor wafers after cmp | |
EP2922083A3 (en) | Plasma pre-clean process | |
WO2015187675A3 (en) | Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility | |
MY163132A (en) | Cleaning formulations | |
EP3265551A4 (en) | COMPOSITIONS AND METHODS FOR CLEANING A SURFACE AND OTHER APPLICATIONS | |
EP3552530A4 (en) | SURFACE CLEANING ROBOTS AND METHOD FOR CREATING A TRACE FOR IT | |
EP3986997A4 (en) | CLEANING COMPOSITION FOR SEMICONDUCTOR SUBSTRATES | |
EP3101160A4 (en) | Semiconductor substrate manufacturing method | |
SG11201807140QA (en) | Method for cleaning semiconductor wafer | |
SG10201704204RA (en) | Process For The Manufacture Of A High Resistivity Semiconductor Substrate | |
SG11201902965XA (en) | Method for removing silicon dioxide from wafer and manufacturing process for integrated circuit | |
SG10201912088UA (en) | Substrate cleaning device | |
IL287327A (en) | Preparations for removing materials that protect against light from semiconductor substrates | |
EP3558080A4 (en) | CLEANING BIN FOR CLEANING ROBOT | |
EP3375914A4 (en) | METHOD FOR PRODUCING A SEMICONDUCTOR WAFERS | |
SG11201908162RA (en) | Method for manufacturing wafer |