JP2021503560A5 - - Google Patents
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- JP2021503560A5 JP2021503560A5 JP2020545450A JP2020545450A JP2021503560A5 JP 2021503560 A5 JP2021503560 A5 JP 2021503560A5 JP 2020545450 A JP2020545450 A JP 2020545450A JP 2020545450 A JP2020545450 A JP 2020545450A JP 2021503560 A5 JP2021503560 A5 JP 2021503560A5
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- JP
- Japan
- Prior art keywords
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000003118 aryl group Chemical group 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 125000002877 alkyl aryl group Chemical group 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims 4
- 229910017052 cobalt Inorganic materials 0.000 claims 4
- 239000010941 cobalt Substances 0.000 claims 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 125000002837 carbocyclic group Chemical group 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 125000000623 heterocyclic group Chemical group 0.000 claims 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910001429 cobalt ion Inorganic materials 0.000 claims 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 claims 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 claims 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17202568.6 | 2017-11-20 | ||
| EP17202568 | 2017-11-20 | ||
| PCT/EP2018/081692 WO2019097044A1 (en) | 2017-11-20 | 2018-11-19 | Composition for cobalt electroplating comprising leveling agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021503560A JP2021503560A (ja) | 2021-02-12 |
| JP2021503560A5 true JP2021503560A5 (https=) | 2022-01-04 |
Family
ID=60409228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020545450A Pending JP2021503560A (ja) | 2017-11-20 | 2018-11-19 | レベリング剤を含んだコバルト電気メッキ用組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11377748B2 (https=) |
| EP (1) | EP3714085B1 (https=) |
| JP (1) | JP2021503560A (https=) |
| KR (1) | KR102647950B1 (https=) |
| CN (2) | CN111344438B (https=) |
| IL (1) | IL274486A (https=) |
| TW (2) | TWI800558B (https=) |
| WO (1) | WO2019097044A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102901043B1 (ko) * | 2018-12-21 | 2025-12-16 | 바스프 에스이 | 보이드-프리 서브마이크론 피처 충전용 첨가제를 포함하는 코발트 도금용 조성물 |
| US11230778B2 (en) | 2019-12-13 | 2022-01-25 | Macdermid Enthone Inc. | Cobalt chemistry for smooth topology |
| FR3119848B1 (fr) * | 2021-02-18 | 2025-10-31 | Aveni | Electrolyte et Procédé d’électrodéposition de cobalt |
| US12410534B2 (en) | 2022-09-26 | 2025-09-09 | Dupont Electronic Materials International, Llc | Nickel electroplating compositions for rough nickel |
| US12428744B2 (en) | 2022-09-26 | 2025-09-30 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions for rough nickel |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1283417A (en) | 1968-10-24 | 1972-07-26 | Kewanee Oil Co | High speed electrodeposition of nickel and/or cobalt |
| US3814674A (en) * | 1970-11-05 | 1974-06-04 | Oxy Metal Finishing Corp | Electrodeposition of cobalt |
| JPS5424971B1 (https=) * | 1970-12-10 | 1979-08-24 | ||
| DE2100971B2 (de) * | 1971-01-11 | 1975-04-17 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten |
| US4036709A (en) * | 1975-09-22 | 1977-07-19 | M & T Chemicals Inc. | Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron |
| FR2472621A3 (fr) * | 1979-12-28 | 1981-07-03 | Xantia National Corp | Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome |
| US4425198A (en) | 1981-06-16 | 1984-01-10 | Omi International Corporation | Brightening composition for zinc alloy electroplating bath and its method of use |
| US6193789B1 (en) * | 1996-06-03 | 2001-02-27 | Hideo Honma | Electroless copper plating solution and method for electroless copper plating |
| US6508924B1 (en) * | 2000-05-31 | 2003-01-21 | Shipley Company L.L.C. | Control of breakdown products in electroplating baths |
| WO2002063070A1 (en) * | 2001-02-08 | 2002-08-15 | The University Of Alabama In Huntsville | Nickel cobalt phosphorous low stress electroplating |
| JP4128005B2 (ja) | 2001-12-28 | 2008-07-30 | 日本リーロナール有限会社 | 電気ニッケルめっき液 |
| ES2303311T3 (es) | 2003-02-24 | 2008-08-01 | Basf Se | Polimeros que contienen grupos de acido fosforico y/o acido fosfonico para el tratamiento de superficies metalicas. |
| TW200707640A (en) * | 2005-03-18 | 2007-02-16 | Applied Materials Inc | Contact metallization scheme using a barrier layer over a silicide layer |
| DE102005038608A1 (de) | 2005-08-16 | 2007-02-22 | Basf Ag | Polymerzusammensetzung für den Korrosionsschutz |
| TWI328622B (en) * | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
| JP5201315B2 (ja) * | 2007-09-26 | 2013-06-05 | 上村工業株式会社 | 電気めっき方法 |
| US20090188805A1 (en) | 2008-01-25 | 2009-07-30 | Government Of The United States Of America, As Represented By The | Superconformal electrodeposition of nickel iron and cobalt magnetic alloys |
| RU2539895C2 (ru) * | 2009-07-30 | 2015-01-27 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
| SG10201404394QA (en) * | 2009-07-30 | 2014-10-30 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filing |
| US8691687B2 (en) | 2010-01-07 | 2014-04-08 | International Business Machines Corporation | Superfilled metal contact vias for semiconductor devices |
| EP2547731B1 (en) * | 2010-03-18 | 2014-07-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2392692A1 (en) * | 2010-06-01 | 2011-12-07 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2655457B1 (en) * | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN103547631B (zh) * | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| EP2530102A1 (en) * | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US9514983B2 (en) | 2012-12-28 | 2016-12-06 | Intel Corporation | Cobalt based interconnects and methods of fabrication thereof |
| EP2801640A1 (en) * | 2013-05-08 | 2014-11-12 | ATOTECH Deutschland GmbH | Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy |
| US20150071980A1 (en) * | 2013-09-06 | 2015-03-12 | Savannah River Nuclear Solutions, Llc | Formation of nanosized metal particles on a titanate carrier |
| KR102458648B1 (ko) * | 2014-07-09 | 2022-10-26 | 쇼와덴코머티리얼즈가부시끼가이샤 | Cmp용 연마액 및 연마 방법 |
| US9777386B2 (en) * | 2015-03-19 | 2017-10-03 | Lam Research Corporation | Chemistry additives and process for cobalt film electrodeposition |
| WO2017004424A1 (en) | 2015-06-30 | 2017-01-05 | Enthone Inc. | Cobalt filling of interconnects in microelectronics |
| US20170067173A1 (en) * | 2015-09-09 | 2017-03-09 | Rohm And Haas Electronic Materials Llc | Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits |
| KR102566586B1 (ko) | 2016-07-18 | 2023-08-16 | 바스프 에스이 | 보이드 없는 서브미크론 피쳐 충전을 위한 첨가제를 포함하는 코발트 도금용 조성물 |
| US10329683B2 (en) * | 2016-11-03 | 2019-06-25 | Lam Research Corporation | Process for optimizing cobalt electrofill using sacrificial oxidants |
| US11035048B2 (en) * | 2017-07-05 | 2021-06-15 | Macdermid Enthone Inc. | Cobalt filling of interconnects |
| KR102568350B1 (ko) * | 2017-11-01 | 2023-08-21 | 램 리써치 코포레이션 | 전기화학적 도금 장치 상에서 도금 전해질 농도 제어 |
| WO2019201623A2 (en) | 2018-04-19 | 2019-10-24 | Basf Se | Composition for cobalt or cobalt alloy electroplating |
-
2018
- 2018-11-19 EP EP18800670.4A patent/EP3714085B1/en active Active
- 2018-11-19 JP JP2020545450A patent/JP2021503560A/ja active Pending
- 2018-11-19 CN CN201880072834.XA patent/CN111344438B/zh active Active
- 2018-11-19 WO PCT/EP2018/081692 patent/WO2019097044A1/en not_active Ceased
- 2018-11-19 KR KR1020207016960A patent/KR102647950B1/ko active Active
- 2018-11-19 CN CN202510649087.3A patent/CN120776404A/zh active Pending
- 2018-11-19 US US16/762,717 patent/US11377748B2/en active Active
- 2018-11-20 TW TW107141016A patent/TWI800558B/zh active
- 2018-11-20 TW TW112112867A patent/TWI870818B/zh active
-
2020
- 2020-05-06 IL IL274486A patent/IL274486A/en unknown
-
2022
- 2022-06-02 US US17/805,144 patent/US20220298664A1/en not_active Abandoned
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