JP2021503560A - レベリング剤を含んだコバルト電気メッキ用組成物 - Google Patents

レベリング剤を含んだコバルト電気メッキ用組成物 Download PDF

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Publication number
JP2021503560A
JP2021503560A JP2020545450A JP2020545450A JP2021503560A JP 2021503560 A JP2021503560 A JP 2021503560A JP 2020545450 A JP2020545450 A JP 2020545450A JP 2020545450 A JP2020545450 A JP 2020545450A JP 2021503560 A JP2021503560 A JP 2021503560A
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JP
Japan
Prior art keywords
group
alkyl
formula
integer
cobalt
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Pending
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JP2020545450A
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English (en)
Japanese (ja)
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JP2021503560A5 (https=
Inventor
エンゲルハルト，ナディン
マイアー，ディーター
アルノルド，マルコ
フリューゲル，アレクサンダー
エムネット，シャルロッテ
ベンジャミン ヘンダーソン，ルーカス
ベンジャミン ヘンダーソン，ルーカス
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BASF SE
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BASF SE
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Application filed by BASF SE filed Critical BASF SE
Publication of JP2021503560A publication Critical patent/JP2021503560A/ja
Publication of JP2021503560A5 publication Critical patent/JP2021503560A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2020545450A 2017-11-20 2018-11-19 レベリング剤を含んだコバルト電気メッキ用組成物 Pending JP2021503560A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17202568.6 2017-11-20
EP17202568 2017-11-20
PCT/EP2018/081692 WO2019097044A1 (en) 2017-11-20 2018-11-19 Composition for cobalt electroplating comprising leveling agent

Publications (2)

Publication Number Publication Date
JP2021503560A true JP2021503560A (ja) 2021-02-12
JP2021503560A5 JP2021503560A5 (https=) 2022-01-04

Family

ID=60409228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020545450A Pending JP2021503560A (ja) 2017-11-20 2018-11-19 レベリング剤を含んだコバルト電気メッキ用組成物

Country Status (8)

Country Link
US (2) US11377748B2 (https=)
EP (1) EP3714085B1 (https=)
JP (1) JP2021503560A (https=)
KR (1) KR102647950B1 (https=)
CN (2) CN111344438B (https=)
IL (1) IL274486A (https=)
TW (2) TWI870818B (https=)
WO (1) WO2019097044A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020126687A1 (en) * 2018-12-21 2020-06-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
FR3119848B1 (fr) * 2021-02-18 2025-10-31 Aveni Electrolyte et Procédé d’électrodéposition de cobalt
US12410534B2 (en) 2022-09-26 2025-09-09 Dupont Electronic Materials International, Llc Nickel electroplating compositions for rough nickel
US12428744B2 (en) 2022-09-26 2025-09-30 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel

Citations (4)

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JPS5424971B1 (https=) * 1970-12-10 1979-08-24
US20060251800A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W Contact metallization scheme using a barrier layer over a silicide layer
JP2007146285A (ja) * 2005-09-30 2007-06-14 Rohm & Haas Electronic Materials Llc レベラー化合物
JP2009079247A (ja) * 2007-09-26 2009-04-16 C Uyemura & Co Ltd 電気めっき方法

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US3814674A (en) * 1970-11-05 1974-06-04 Oxy Metal Finishing Corp Electrodeposition of cobalt
DE2100971B2 (de) * 1971-01-11 1975-04-17 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
US4036709A (en) * 1975-09-22 1977-07-19 M & T Chemicals Inc. Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
FR2472621A3 (fr) * 1979-12-28 1981-07-03 Xantia National Corp Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome
US4425198A (en) 1981-06-16 1984-01-10 Omi International Corporation Brightening composition for zinc alloy electroplating bath and its method of use
CA2257185A1 (en) * 1996-06-03 1997-12-11 Satoru Shimizu Electroless copper plating solution and method for electroless copper plating
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
JP4128005B2 (ja) 2001-12-28 2008-07-30 日本リーロナール有限会社 電気ニッケルめっき液
BRPI0407625B1 (pt) 2003-02-24 2013-07-09 composição para tratar superfícies metálicas, camada passivadora sobre uma superfície metálica, superfície, processo para formar uma camada passivadora sobre uma superfície metálica, uso de uma composição, sistema em uma superfície metálica, e, processo para formar um sistema de revestimento
DE102005038608A1 (de) 2005-08-16 2007-02-22 Basf Ag Polymerzusammensetzung für den Korrosionsschutz
US20090188805A1 (en) 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
JP5775077B2 (ja) * 2009-07-30 2015-09-09 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物
MY157126A (en) * 2009-07-30 2016-05-13 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US8691687B2 (en) 2010-01-07 2014-04-08 International Business Machines Corporation Superfilled metal contact vias for semiconductor devices
US9834677B2 (en) * 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
EP2392692A1 (en) * 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
MY170653A (en) * 2010-12-21 2019-08-23 Basf Se Composition for metal electroplating comprising leveling agent
US9631292B2 (en) * 2011-06-01 2017-04-25 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US9514983B2 (en) 2012-12-28 2016-12-06 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
US20150071980A1 (en) * 2013-09-06 2015-03-12 Savannah River Nuclear Solutions, Llc Formation of nanosized metal particles on a titanate carrier
WO2016006631A1 (ja) * 2014-07-09 2016-01-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
US9777386B2 (en) * 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
WO2017004424A1 (en) 2015-06-30 2017-01-05 Enthone Inc. Cobalt filling of interconnects in microelectronics
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
KR102566586B1 (ko) 2016-07-18 2023-08-16 바스프 에스이 보이드 없는 서브미크론 피쳐 충전을 위한 첨가제를 포함하는 코발트 도금용 조성물
US10329683B2 (en) * 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US11035048B2 (en) * 2017-07-05 2021-06-15 Macdermid Enthone Inc. Cobalt filling of interconnects
WO2019089282A1 (en) * 2017-11-01 2019-05-09 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424971B1 (https=) * 1970-12-10 1979-08-24
US20060251800A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W Contact metallization scheme using a barrier layer over a silicide layer
JP2007146285A (ja) * 2005-09-30 2007-06-14 Rohm & Haas Electronic Materials Llc レベラー化合物
JP2009079247A (ja) * 2007-09-26 2009-04-16 C Uyemura & Co Ltd 電気めっき方法

Also Published As

Publication number Publication date
EP3714085A1 (en) 2020-09-30
CN111344438B (zh) 2025-06-06
US11377748B2 (en) 2022-07-05
IL274486A (en) 2020-06-30
US20200347503A1 (en) 2020-11-05
TW202334510A (zh) 2023-09-01
CN111344438A (zh) 2020-06-26
EP3714085B1 (en) 2023-08-09
TW201923154A (zh) 2019-06-16
WO2019097044A1 (en) 2019-05-23
KR102647950B1 (ko) 2024-03-14
US20220298664A1 (en) 2022-09-22
KR20200089697A (ko) 2020-07-27
TWI870818B (zh) 2025-01-21
CN120776404A (zh) 2025-10-14
TWI800558B (zh) 2023-05-01

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