KR102647950B1 - 레벨링제를 포함하는 코발트 전기도금용 조성물 - Google Patents

레벨링제를 포함하는 코발트 전기도금용 조성물 Download PDF

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Publication number
KR102647950B1
KR102647950B1 KR1020207016960A KR20207016960A KR102647950B1 KR 102647950 B1 KR102647950 B1 KR 102647950B1 KR 1020207016960 A KR1020207016960 A KR 1020207016960A KR 20207016960 A KR20207016960 A KR 20207016960A KR 102647950 B1 KR102647950 B1 KR 102647950B1
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South Korea
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composition
formula
cobalt
group
integer
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Korean (ko)
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KR20200089697A (ko
Inventor
나디네 엥겔하르트
디터 마이어
마르코 아르놀트
알렉산더 플뤼겔
하를로테 엠네트
루카스 벤자민 헨더슨
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바스프 에스이
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020207016960A 2017-11-20 2018-11-19 레벨링제를 포함하는 코발트 전기도금용 조성물 Active KR102647950B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17202568.6 2017-11-20
EP17202568 2017-11-20
PCT/EP2018/081692 WO2019097044A1 (en) 2017-11-20 2018-11-19 Composition for cobalt electroplating comprising leveling agent

Publications (2)

Publication Number Publication Date
KR20200089697A KR20200089697A (ko) 2020-07-27
KR102647950B1 true KR102647950B1 (ko) 2024-03-14

Family

ID=60409228

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207016960A Active KR102647950B1 (ko) 2017-11-20 2018-11-19 레벨링제를 포함하는 코발트 전기도금용 조성물

Country Status (8)

Country Link
US (2) US11377748B2 (https=)
EP (1) EP3714085B1 (https=)
JP (1) JP2021503560A (https=)
KR (1) KR102647950B1 (https=)
CN (2) CN111344438B (https=)
IL (1) IL274486A (https=)
TW (2) TWI870818B (https=)
WO (1) WO2019097044A1 (https=)

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* Cited by examiner, † Cited by third party
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WO2020126687A1 (en) * 2018-12-21 2020-06-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
FR3119848B1 (fr) * 2021-02-18 2025-10-31 Aveni Electrolyte et Procédé d’électrodéposition de cobalt
US12410534B2 (en) 2022-09-26 2025-09-09 Dupont Electronic Materials International, Llc Nickel electroplating compositions for rough nickel
US12428744B2 (en) 2022-09-26 2025-09-30 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel

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DE2100971B2 (de) * 1971-01-11 1975-04-17 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
US4036709A (en) * 1975-09-22 1977-07-19 M & T Chemicals Inc. Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
FR2472621A3 (fr) * 1979-12-28 1981-07-03 Xantia National Corp Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome
US4425198A (en) 1981-06-16 1984-01-10 Omi International Corporation Brightening composition for zinc alloy electroplating bath and its method of use
CA2257185A1 (en) * 1996-06-03 1997-12-11 Satoru Shimizu Electroless copper plating solution and method for electroless copper plating
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
JP4128005B2 (ja) 2001-12-28 2008-07-30 日本リーロナール有限会社 電気ニッケルめっき液
BRPI0407625B1 (pt) 2003-02-24 2013-07-09 composição para tratar superfícies metálicas, camada passivadora sobre uma superfície metálica, superfície, processo para formar uma camada passivadora sobre uma superfície metálica, uso de uma composição, sistema em uma superfície metálica, e, processo para formar um sistema de revestimento
US20060251801A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W In-situ silicidation metallization process
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TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
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MY157126A (en) * 2009-07-30 2016-05-13 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US8691687B2 (en) 2010-01-07 2014-04-08 International Business Machines Corporation Superfilled metal contact vias for semiconductor devices
US9834677B2 (en) * 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
EP2392692A1 (en) * 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
MY170653A (en) * 2010-12-21 2019-08-23 Basf Se Composition for metal electroplating comprising leveling agent
US9631292B2 (en) * 2011-06-01 2017-04-25 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
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WO2016006631A1 (ja) * 2014-07-09 2016-01-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
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US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
KR102566586B1 (ko) 2016-07-18 2023-08-16 바스프 에스이 보이드 없는 서브미크론 피쳐 충전을 위한 첨가제를 포함하는 코발트 도금용 조성물
US10329683B2 (en) * 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US11035048B2 (en) * 2017-07-05 2021-06-15 Macdermid Enthone Inc. Cobalt filling of interconnects
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Also Published As

Publication number Publication date
EP3714085A1 (en) 2020-09-30
CN111344438B (zh) 2025-06-06
US11377748B2 (en) 2022-07-05
IL274486A (en) 2020-06-30
US20200347503A1 (en) 2020-11-05
TW202334510A (zh) 2023-09-01
CN111344438A (zh) 2020-06-26
EP3714085B1 (en) 2023-08-09
JP2021503560A (ja) 2021-02-12
TW201923154A (zh) 2019-06-16
WO2019097044A1 (en) 2019-05-23
US20220298664A1 (en) 2022-09-22
KR20200089697A (ko) 2020-07-27
TWI870818B (zh) 2025-01-21
CN120776404A (zh) 2025-10-14
TWI800558B (zh) 2023-05-01

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