TWI800558B - 用於電鍍鈷之包含調平劑之組成物 - Google Patents

用於電鍍鈷之包含調平劑之組成物 Download PDF

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Publication number
TWI800558B
TWI800558B TW107141016A TW107141016A TWI800558B TW I800558 B TWI800558 B TW I800558B TW 107141016 A TW107141016 A TW 107141016A TW 107141016 A TW107141016 A TW 107141016A TW I800558 B TWI800558 B TW I800558B
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TW
Taiwan
Prior art keywords
group
cobalt
composition
acid
leveling agent
Prior art date
Application number
TW107141016A
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English (en)
Chinese (zh)
Other versions
TW201923154A (zh
Inventor
納迪尼 安傑哈德特
迪耶特 邁爾
馬可 亞諾
亞歷山大 福路格
夏洛特 艾姆尼
盧卡斯 班傑明 漢恩德森
Original Assignee
德商巴斯夫歐洲公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 德商巴斯夫歐洲公司 filed Critical 德商巴斯夫歐洲公司
Publication of TW201923154A publication Critical patent/TW201923154A/zh
Application granted granted Critical
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW107141016A 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物 TWI800558B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17202568.6 2017-11-20
??17202568.6 2017-11-20
EP17202568 2017-11-20

Publications (2)

Publication Number Publication Date
TW201923154A TW201923154A (zh) 2019-06-16
TWI800558B true TWI800558B (zh) 2023-05-01

Family

ID=60409228

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107141016A TWI800558B (zh) 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物
TW112112867A TWI870818B (zh) 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112112867A TWI870818B (zh) 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物

Country Status (8)

Country Link
US (2) US11377748B2 (https=)
EP (1) EP3714085B1 (https=)
JP (1) JP2021503560A (https=)
KR (1) KR102647950B1 (https=)
CN (2) CN111344438B (https=)
IL (1) IL274486A (https=)
TW (2) TWI800558B (https=)
WO (1) WO2019097044A1 (https=)

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KR102901043B1 (ko) * 2018-12-21 2025-12-16 바스프 에스이 보이드-프리 서브마이크론 피처 충전용 첨가제를 포함하는 코발트 도금용 조성물
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
FR3119848B1 (fr) * 2021-02-18 2025-10-31 Aveni Electrolyte et Procédé d’électrodéposition de cobalt
US12410534B2 (en) 2022-09-26 2025-09-09 Dupont Electronic Materials International, Llc Nickel electroplating compositions for rough nickel
US12428744B2 (en) 2022-09-26 2025-09-30 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel

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TW200707640A (en) * 2005-03-18 2007-02-16 Applied Materials Inc Contact metallization scheme using a barrier layer over a silicide layer
TW201631108A (zh) * 2014-07-09 2016-09-01 日立化成股份有限公司 Cmp用研磨液及研磨方法

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TW200707640A (en) * 2005-03-18 2007-02-16 Applied Materials Inc Contact metallization scheme using a barrier layer over a silicide layer
TW201631108A (zh) * 2014-07-09 2016-09-01 日立化成股份有限公司 Cmp用研磨液及研磨方法

Also Published As

Publication number Publication date
CN111344438B (zh) 2025-06-06
KR20200089697A (ko) 2020-07-27
IL274486A (en) 2020-06-30
US20220298664A1 (en) 2022-09-22
EP3714085A1 (en) 2020-09-30
TWI870818B (zh) 2025-01-21
CN111344438A (zh) 2020-06-26
EP3714085B1 (en) 2023-08-09
TW202334510A (zh) 2023-09-01
WO2019097044A1 (en) 2019-05-23
JP2021503560A (ja) 2021-02-12
CN120776404A (zh) 2025-10-14
US20200347503A1 (en) 2020-11-05
US11377748B2 (en) 2022-07-05
KR102647950B1 (ko) 2024-03-14
TW201923154A (zh) 2019-06-16

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