JP2021174923A - 積層型セラミック電子部品の製造方法および消失性インク - Google Patents
積層型セラミック電子部品の製造方法および消失性インク Download PDFInfo
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- JP2021174923A JP2021174923A JP2020079251A JP2020079251A JP2021174923A JP 2021174923 A JP2021174923 A JP 2021174923A JP 2020079251 A JP2020079251 A JP 2020079251A JP 2020079251 A JP2020079251 A JP 2020079251A JP 2021174923 A JP2021174923 A JP 2021174923A
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Abstract
Description
有機材料粉末 8.36 〜 8.37質量部
溶剤 90.18 〜89.63質量部
分散剤 0.58 〜 0.59質量部
樹脂 0.80 〜 1.28質量部
可塑剤 0.08 〜 0.13質量部。
有機材料粉末 8.35 〜 8.37質量部
溶剤 90.14 〜89.59質量部
分散剤 0.29質量部
樹脂 1.11 〜 1.58質量部
可塑剤 0.11 〜 0.16質量部。
有機材料粉末 8.35 〜 8.34質量部
溶剤 90.17 〜89.66質量部
分散剤 0.54質量部
樹脂 0.85 〜 1.32質量部
可塑剤 0.08 〜 0.13質量部。
有機材料粉末 6.10 〜 6.09質量部
溶剤 91.85 〜90.37質量部
分散剤 0.43質量部
樹脂 1.00 〜 1.48質量部
可塑剤 0.10 〜 0.15質量部。
実験例1では、消失性インクに含まれる有機材料粉末として、Pigment Red 57:1およびPigment Violet 19を用いた。
B:メトキシブタノール
C:イソプロピルアルコール
D:エタノール
E:1−3ブタンジオール
F:エチレングリコール
なお、「B+F」は、メトキシブタノールとエチレングリコールとを質量比1:1で混合した混合溶剤であることを示している。
実験例2では、実験例1と比較して、消失性インクに含まれる樹脂として、アクリル樹脂を用いた点を除いて、実験例1の場合と同様の手順で、試料となる、表2に示す組成を有する実施例21〜30および比較例31〜38に係る消失性インクを得た。なお、アクリル樹脂としては、より具体的には、三菱ケミカル社製アクリル樹脂「ダイヤナール」を用いた。
実験例3では、実験例1と比較して、消失性インクに含まれる樹脂として、ポリビニルブチラール樹脂を用いた点を除いて、実験例1の場合と同様の手順で、試料となる、表3に示す組成を有する実施例41〜50および比較例51〜58に係る消失性インクを得た。なお、ポリビニルブチラール樹脂としては、より具体的には、積水化学社製ポリビニルブチラール樹脂「エスレック」を用いた。
実験例4では、消失性インクに含まれる有機材料粉末として、Pigment Yellow 180を用いた。
実験例5では、実験例4と比較して、消失性インクに含まれる樹脂として、アクリル樹脂を用いた点を除いて、実験例4の場合と同様の手順で、試料となる、表5に示す組成を有する実施例71〜75および比較例76〜79に係る消失性インクを得た。なお、アクリル樹脂としては、より具体的には、実験例2の場合と同様、三菱ケミカル社製アクリル樹脂「ダイヤナール」を用いた。
実験例6では、実験例4と比較して、消失性インクに含まれる樹脂として、ポリビニルブチラール樹脂を用いた点を除いて、実験例4の場合と同様の手順で、試料となる、表6に示す組成を有する実施例81〜85および比較例86〜89に係る消失性インクを得た。なお、ポリビニルブチラール樹脂としては、より具体的には、実験例3の場合と同様、積水化学社製ポリビニルブチラール樹脂「エスレック」を用いた。
実験例7では、消失性インクに含まれる有機材料粉末として、Pigment Blue 15:3を用いた。
実験例8では、実験例7と比較して、消失性インクに含まれる樹脂として、アクリル樹脂を用いた点を除いて、実験例7の場合と同様の手順で、試料となる、表8に示す組成を有する実施例101〜105および比較例106〜109に係る消失性インクを得た。なお、アクリル樹脂としては、より具体的には、実験例2の場合と同様、三菱ケミカル社製アクリル樹脂「ダイヤナール」を用いた。
実験例9では、実験例7と比較して、消失性インクに含まれる樹脂として、ポリビニルブチラール樹脂を用いた点を除いて、実験例7の場合と同様の手順で、試料となる、表9に示す組成を有する実施例111〜115および比較例116〜119に係る消失性インクを得た。なお、ポリビニルブチラール樹脂としては、より具体的には、実験例3の場合と同様、積水化学社製ポリビニルブチラール樹脂「エスレック」を用いた。
実験例10では、消失性インクに含まれる有機材料粉末として、真球状微粒子ポリマーを用いた。
実験例11では、実験例10と比較して、消失性インクに含まれる樹脂として、アクリル樹脂を用いた点を除いて、実験例10の場合と同様の手順で、試料となる、表11に示す組成を有する実施例131〜135および比較例136〜139に係る消失性インクを得た。なお、アクリル樹脂としては、より具体的には、実験例2の場合と同様、三菱ケミカル社製アクリル樹脂「ダイヤナール」を用いた。
実験例12では、実験例10と比較して、消失性インクに含まれる樹脂として、ポリビニルブチラール樹脂を用いた点を除いて、実験例10の場合と同様の手順で、試料となる、表12に示す組成を有する実施例141〜145および比較例146〜149に係る消失性インクを得た。なお、ポリビニルブチラール樹脂としては、より具体的には、実験例3の場合と同様、積水化学社製ポリビニルブチラール樹脂「エスレック」を用いた。
2 セラミック層
3,4 内部電極
3−1,4−1 未焼成の内部電極
5 部品本体
12,13 外部電極
12−1〜12−7,13−1〜13−7 未焼成の外部電極
20 未焼成の積層セラミックコンデンサ
21−1〜21−8 サポート体
22−1〜22−2 未焼成の段差吸収層
Claims (11)
- 積層された複数のセラミック層と前記複数のセラミック層間の界面に沿って配置された内部電極とを含む積層構造の部品本体と、前記内部電極に電気的に接続されかつ前記部品本体の外表面に設けられた外部電極と、を備える、積層型セラミック電子部品の製造方法であって、
前記積層型セラミック電子部品となるべき未焼成の積層型セラミック電子部品を得る第1段階と、次いで、
前記未焼成の積層型セラミック電子部品から焼結状態の積層型セラミック電子部品を得る第2段階と、
を備え、
前記第1段階は、
加熱によって消失する材料からなる消失性インクと、焼成によって前記セラミック層となるセラミック含有インクと、焼成によって前記内部電極となる第1金属含有インクと、焼成によって前記外部電極となる第2金属含有インクと、をそれぞれ用意する工程と、
前記消失性インクをインクジェット方式により吐出することによって、前記未焼成の積層型セラミック電子部品の外形の少なくとも一部を規定するサポート体を成形する工程と、
前記セラミック含有インクをインクジェット方式により吐出することによって、前記セラミック層となるべき未焼成のセラミック層を成形する工程と、
前記第1金属含有インクをインクジェット方式により吐出することによって、前記内部電極となるべき未焼成の内部電極を成形する工程と、
前記第2金属含有インクをインクジェット方式により吐出することによって、前記外部電極となるべき未焼成の外部電極を成形する工程と、
を備え、
前記未焼成のセラミック層を成形する工程および前記未焼成の外部電極を成形する工程は、前記サポート体によって、それぞれ、前記未焼成のセラミック層および前記未焼成の外部電極の輪郭の少なくとも一部が規定された状態で実施され、
前記第2段階は、
前記サポート体を加熱により消失させる工程と、
前記未焼成の積層型セラミック電子部品を焼結させる工程と、
を備える、積層型セラミック電子部品の製造方法。 - 前記サポート体を成形する工程は複数回実施され、前記未焼成のセラミック層を成形する工程は複数回実施され、および前記未焼成の外部電極を成形する工程は複数回実施される、請求項1に記載の積層型セラミック電子部品の製造方法。
- 前記未焼成のセラミック層を成形する工程は、前記サポート体を成形する工程の後に実施されるものを含み、前記未焼成の外部電極を成形する工程は、前記サポート体を成形する各工程の後に実施されるものを含む、請求項2に記載の積層型セラミック電子部品の製造方法。
- 前記未焼成の内部電極を成形する工程は複数回実施される、請求項3に記載の積層型セラミック電子部品の製造方法。
- 前記第1段階は、前記未焼成の内部電極を成形する工程において成形された前記未焼成の内部電極の厚みに等しいか略等しい厚みを有する未焼成の段差吸収層を、前記セラミック含有インクをインクジェット方式により吐出することによって成形する工程をさらに備える、請求項1ないし4のいずれかに記載の積層型セラミック電子部品の製造方法。
- 前記第1段階において、少なくとも、前記サポート体を成形する工程、前記未焼成の外部電極を成形する工程、前記未焼成のセラミック層を成形する工程、前記サポート体を成形する工程、前記未焼成の外部電極を成形する工程、および前記未焼成の内部電極を成形する工程、がこの順序で繰り返される、請求項1ないし5のいずれかに記載の積層型セラミック電子部品の製造方法。
- 前記第2段階において、前記未焼成の積層型セラミック電子部品を加熱する工程の後、連続して前記未焼成の積層型セラミック電子部品を焼成する工程が実施される、請求項1ないし6のいずれかに記載の積層型セラミック電子部品の製造方法。
- 前記加熱によって消失する材料からなる消失性インクを用意する工程は、
有機顔料および微粒子ポリマーの少なくとも一方からなる有機材料粉末と、
分散剤としてのポリカルボン酸系共重合体と、
溶剤としてのメトキシブタノール、エチレングリコール、および1−3ブタンジオールから選ばれる少なくとも1種と、
樹脂としてのセルロース樹脂、アクリル樹脂、およびポリビニルブチラール樹脂から選ばれる少なくとも1種と、
を含む、消失性インクを用意する工程を含む、
請求項1ないし7のいずれかに記載の積層型セラミック電子部品の製造方法。 - 加熱によって消失する材料からなる消失性インクであって、
有機顔料および微粒子ポリマーの少なくとも一方からなる有機材料粉末と、
分散剤としてのポリカルボン酸系共重合体と、
溶剤としてのメトキシブタノール、エチレングリコール、および1−3ブタンジオールから選ばれる少なくとも1種と、
樹脂としてのセルロース樹脂、アクリル樹脂、およびポリビニルブチラール樹脂から選ばれる少なくとも1種と、
を含む、消失性インク。 - 前記有機材料粉末および前記樹脂の合計体積に対する前記有機材料粉末の体積の比率は60%以上かつ90%以下である、請求項9に記載の消失性インク。
- 前記有機顔料は、キナクリドン類、Pigment Yellow 180、および銅フタルシアニンから選ばれる少なくとも1種を含む、請求項9または10に記載の消失性インク。
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