JP2021132076A - 研磨用組成物、研磨方法、および半導体基板の製造方法 - Google Patents
研磨用組成物、研磨方法、および半導体基板の製造方法 Download PDFInfo
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- JP2021132076A JP2021132076A JP2020025618A JP2020025618A JP2021132076A JP 2021132076 A JP2021132076 A JP 2021132076A JP 2020025618 A JP2020025618 A JP 2020025618A JP 2020025618 A JP2020025618 A JP 2020025618A JP 2021132076 A JP2021132076 A JP 2021132076A
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- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
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- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
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- 238000007865 diluting Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
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- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
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- 229910052735 hafnium Inorganic materials 0.000 description 1
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- 229940102253 isopropanolamine Drugs 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
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- 238000007561 laser diffraction method Methods 0.000 description 1
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- 230000010534 mechanism of action Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical compound CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
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- 229960003104 ornithine Drugs 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052696 pnictogen Inorganic materials 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- WPLOVIFNBMNBPD-ATHMIXSHSA-N subtilin Chemical compound CC1SCC(NC2=O)C(=O)NC(CC(N)=O)C(=O)NC(C(=O)NC(CCCCN)C(=O)NC(C(C)CC)C(=O)NC(=C)C(=O)NC(CCCCN)C(O)=O)CSC(C)C2NC(=O)C(CC(C)C)NC(=O)C1NC(=O)C(CCC(N)=O)NC(=O)C(CC(C)C)NC(=O)C(NC(=O)C1NC(=O)C(=C/C)/NC(=O)C(CCC(N)=O)NC(=O)C(CC(C)C)NC(=O)C(C)NC(=O)CNC(=O)C(NC(=O)C(NC(=O)C2NC(=O)CNC(=O)C3CCCN3C(=O)C(NC(=O)C3NC(=O)C(CC(C)C)NC(=O)C(=C)NC(=O)C(CCC(O)=O)NC(=O)C(NC(=O)C(CCCCN)NC(=O)C(N)CC=4C5=CC=CC=C5NC=4)CSC3)C(C)SC2)C(C)C)C(C)SC1)CC1=CC=CC=C1 WPLOVIFNBMNBPD-ATHMIXSHSA-N 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Abstract
Description
本発明に係る研磨対象物は、特に制限されないが、不純物がドープされていない多結晶シリコン(アンドープトポリシリコン)と、n型不純物がドープされた多結晶シリコン(n型ドープトポリシリコン)と、を含むことが好ましい。
本発明の研磨用組成物は、砥粒としてシリカを含む。シリカの種類としては、好ましくはコロイダルシリカである。コロイダルシリカの製造方法としては、ケイ酸ソーダ法、ゾルゲル法等が挙げられ、いずれの製造方法で製造されたコロイダルシリカであっても、本発明に係るシリカとして好適に用いられる。しかしながら、金属不純物低減の観点から、高純度で製造できるゾルゲル法により製造されたコロイダルシリカが好ましい。
本発明の研磨用組成物は、窒素含有アルカリ化合物を含む。かような化合物を含むことにより、研磨用組成物の電気伝導度の上昇は抑えられ、砥粒であるシリカ表面の電気二重層は厚くなりやすく、過酸化水素により酸化された研磨対象物(n型ドープトポリシリコン)表面に対して接触しにくくなる。よって、n型ドープトポリシリコンの研磨速度は抑制され、選択比が向上する。
本発明の研磨用組成物は、過酸化水素を含む。過酸化水素は研磨対象物(特に、n型ドープトポリシリコン)の表面を酸化する酸化剤として働き、研磨速度を向上させうる。
本発明の研磨用組成物は、各成分を分散するための分散媒を含むことが好ましい。分散媒としては、水;メタノール、エタノール、エチレングリコール等のアルコール類;アセトン等のケトン類等や、これらの混合物などが例示できる。これらのうち、分散媒としては水が好ましい。すなわち、本発明のより好ましい形態によると、分散媒は水を含む。本発明のさらに好ましい形態によると、分散媒は実質的に水からなる。なお、上記の「実質的に」とは、本発明の目的効果が達成され得る限りにおいて、水以外の分散媒が含まれ得ることを意図し、より具体的には、好ましくは90質量%以上100質量%以下の水と0質量%以上10質量%以下の水以外の分散媒とからなり、より好ましくは99質量%以上100質量%以下の水と0質量%以上1質量%以下の水以外の分散媒とからなる。最も好ましくは、分散媒は水である。
本発明の研磨用組成物のpHは9を超える。pHが9以下の場合、不純物がドープされた多結晶シリコンの研磨速度に対する、不純物がドープされていない多結晶シリコンの研磨速度の比(選択比)が低下する。
本発明の研磨用組成物は、本発明の効果が著しく妨げられない範囲で、酸化剤、錯化剤、防腐剤、防カビ剤等の、研磨用組成物に用いられ得る公知の添加剤を、必要に応じてさらに含有してもよい。
本発明の研磨用組成物の電気伝導度は0.25mS/cm以下であることが好ましい。この範囲であれば、シリカ表面の電気二重層が厚くなり、研磨対象物としてn型ドープトポリシリコンを含む場合、n型ドープトポリシリコンとの反発力が高まり、研磨速度が抑制され、選択比がより向上する。当該電気伝導度は、0.05mS/cm以上0.25mS/cm以下であることがより好ましい。
本発明の研磨用組成物の製造方法は、特に制限されず、例えば、シリカ、窒素含有アルカリ化合物、過酸化水素、および必要に応じて他の添加剤を、分散媒(例えば、水)中で攪拌混合することにより得ることができる。各成分の詳細は上述した通りである。したがって、本発明は、前記シリカ、前記窒素含有アルカリ化合物、および過酸化水素を混合する工程を含む、本発明の研磨用組成物の製造方法を提供する。
上述のように、本発明の研磨用組成物は、不純物がドープされていない多結晶シリコンと、n型不純物がドープされた多結晶シリコンと、を含む研磨対象物の研磨に好適に用いられる。よって、本発明は、不純物がドープされていない多結晶シリコンと、n型不純物がドープされた多結晶シリコンと、を含む研磨対象物を、本発明の研磨用組成物で研磨する研磨方法を提供する。また、本発明は、不純物がドープされていない多結晶シリコンと、n型不純物がドープされた多結晶シリコンと、を含む半導体基板を前記研磨方法で研磨する工程を含む半導体基板の製造方法を提供する。
(実施例1)
コロイダルシリカ(平均一次粒子径:35nm、平均二次粒子径:66.1nm)と、窒素含有アルカリ化合物としてL−アルギニンと、過酸化水素とを、分散媒(純水)中で攪拌混合することにより研磨用組成物を調製した(混合温度:約25℃、混合時間:約10分)。
窒素含有アルカリ化合物の種類、研磨用組成物のpH、および過酸化水素の含有量を下記表1のように変更したこと以外は、実施例1と同様にして、研磨用組成物を調製した。窒素含有アルカリ化合物は、表1に示す研磨用組成物のpHとなる量で添加した。なお、比較例1は過酸化水素を添加していない例である。
上記で得られた各研磨用組成物を用いて、上記の各研磨対象物を以下の研磨条件で研磨した際の研磨速度を測定した。
研磨装置:小型卓上研磨機(日本エンギス株式会社製、EJ380IN)
研磨パッド:ニッタ・ハース株式会社製 硬質ポリウレタンパッド IC1010
研磨圧力:2.25psi(1psi=6894.76Pa)
プラテン(定盤)回転数:60rpm
ヘッド(キャリア)回転数:60rpm
研磨用組成物の供給:掛け流し
研磨用組成物供給量:100mL/分
研磨時間:アンドープトポリシリコンは30秒、リンドープトポリシリコンは60秒。
研磨速度(研磨レート)は、以下の式により計算した。
Claims (9)
- シリカ、窒素含有アルカリ化合物、および過酸化水素を含有する研磨用組成物であって、
前記過酸化水素の含有量は、研磨用組成物の全質量に対して0質量%を超え0.03質量%未満であり、
pHが9を超える、研磨用組成物。 - 前記窒素含有アルカリ化合物は、塩基性アミノ酸である、請求項1に記載の研磨用組成物。
- 前記過酸化水素の含有量は、0質量%を超え0.02質量%以下である、請求項1または2に記載の研磨用組成物。
- 前記過酸化水素の含有量は、0質量%を超え0.01質量%未満である、請求項3に記載の研磨用組成物。
- 電気伝導度が0.25mS/cm以下である、請求項1〜4のいずれか1項に記載の研磨用組成物。
- 前記電気伝導度が0.05mS/cm以上0.25mS/cm以下である、請求項5に記載の研磨用組成物。
- 不純物がドープされていない多結晶シリコンと、n型不純物がドープされた多結晶シリコンと、を含む研磨対象物を研磨する用途で使用される、請求項1〜6のいずれか1項に記載の研磨用組成物。
- 請求項1〜7のいずれか1項に記載の研磨用組成物を用いて、研磨対象物を研磨する工程を含む、研磨方法。
- 不純物がドープされていない多結晶シリコンと、n型不純物がドープされた多結晶シリコンと、を含む半導体基板を、請求項8に記載の研磨方法により研磨する工程を有する、半導体基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2020025618A JP7409899B2 (ja) | 2020-02-18 | 2020-02-18 | 研磨用組成物、研磨方法、および半導体基板の製造方法 |
TW110104223A TW202132493A (zh) | 2020-02-18 | 2021-02-04 | 研磨用組合物、研磨方法、及半導體基板之製造方法 |
US17/171,393 US11718768B2 (en) | 2020-02-18 | 2021-02-09 | Polishing composition, polishing method, and method of producing semiconductor substrate |
SG10202101446XA SG10202101446XA (en) | 2020-02-18 | 2021-02-11 | Polishing composition, polishing method, and method of producing semiconductor substrate |
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US6740589B2 (en) * | 2000-11-30 | 2004-05-25 | Showa Denko Kabushiki Kaisha | Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same |
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