JP2021090012A5 - - Google Patents
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- Publication number
- JP2021090012A5 JP2021090012A5 JP2019220606A JP2019220606A JP2021090012A5 JP 2021090012 A5 JP2021090012 A5 JP 2021090012A5 JP 2019220606 A JP2019220606 A JP 2019220606A JP 2019220606 A JP2019220606 A JP 2019220606A JP 2021090012 A5 JP2021090012 A5 JP 2021090012A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- layer
- metal layer
- pillar bump
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 3
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019220606A JP2021090012A (ja) | 2019-12-05 | 2019-12-05 | 銅ピラーバンプ、半導体チップ、半導体装置 |
| US17/090,082 US11380642B2 (en) | 2019-12-05 | 2020-11-05 | Copper pillar bump having annular protrusion |
| CN202011243111.7A CN112928087B (zh) | 2019-12-05 | 2020-11-09 | 柱状铜凸点、半导体芯片及半导体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019220606A JP2021090012A (ja) | 2019-12-05 | 2019-12-05 | 銅ピラーバンプ、半導体チップ、半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021090012A JP2021090012A (ja) | 2021-06-10 |
| JP2021090012A5 true JP2021090012A5 (enExample) | 2022-08-12 |
Family
ID=76163606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019220606A Pending JP2021090012A (ja) | 2019-12-05 | 2019-12-05 | 銅ピラーバンプ、半導体チップ、半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11380642B2 (enExample) |
| JP (1) | JP2021090012A (enExample) |
| CN (1) | CN112928087B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10943880B2 (en) * | 2019-05-16 | 2021-03-09 | Advanced Micro Devices, Inc. | Semiconductor chip with reduced pitch conductive pillars |
| US11694982B2 (en) * | 2021-02-25 | 2023-07-04 | Qualcomm Incorporated | Sidewall wetting barrier for conductive pillars |
| CN120033169A (zh) * | 2025-02-18 | 2025-05-23 | 气派科技股份有限公司 | 一种高可靠性凸块结构及制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142811A (ja) * | 2001-11-06 | 2003-05-16 | Ngk Spark Plug Co Ltd | 配線基板及び配線基板の製造方法 |
| JP3860028B2 (ja) * | 2001-12-25 | 2006-12-20 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置 |
| JP2006295109A (ja) | 2005-03-14 | 2006-10-26 | Citizen Watch Co Ltd | 半導体装置とその製造方法 |
| US8293587B2 (en) | 2007-10-11 | 2012-10-23 | International Business Machines Corporation | Multilayer pillar for reduced stress interconnect and method of making same |
| KR101159723B1 (ko) * | 2010-10-04 | 2012-06-28 | 에스케이하이닉스 주식회사 | 반도체 소자의 콘택 및 그 형성 방법 |
| US9663868B2 (en) * | 2011-12-28 | 2017-05-30 | Mitsui Mining & Smelting Co., Ltd. | Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil |
| US8803337B1 (en) * | 2013-03-14 | 2014-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit structure having dies with connectors |
| JP6456232B2 (ja) * | 2015-04-30 | 2019-01-23 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2016213238A (ja) * | 2015-04-30 | 2016-12-15 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
| KR102462504B1 (ko) * | 2015-11-19 | 2022-11-02 | 삼성전자주식회사 | 범프를 갖는 반도체 소자 및 그 형성 방법 |
| JP2019050274A (ja) * | 2017-09-08 | 2019-03-28 | 富士通株式会社 | 半導体装置、電子装置、及び、半導体装置の製造方法 |
| US10811377B2 (en) * | 2017-12-14 | 2020-10-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure with a barrier layer and method for forming the same |
| CN111373517B (zh) * | 2018-03-01 | 2024-03-19 | 新电元工业株式会社 | 半导体装置 |
-
2019
- 2019-12-05 JP JP2019220606A patent/JP2021090012A/ja active Pending
-
2020
- 2020-11-05 US US17/090,082 patent/US11380642B2/en active Active
- 2020-11-09 CN CN202011243111.7A patent/CN112928087B/zh active Active
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