JP2021015964A5 - - Google Patents
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- Publication number
- JP2021015964A5 JP2021015964A5 JP2020113132A JP2020113132A JP2021015964A5 JP 2021015964 A5 JP2021015964 A5 JP 2021015964A5 JP 2020113132 A JP2020113132 A JP 2020113132A JP 2020113132 A JP2020113132 A JP 2020113132A JP 2021015964 A5 JP2021015964 A5 JP 2021015964A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- semiconductor chip
- package according
- sealing member
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 120
- 238000007789 sealing Methods 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 28
- 239000000470 constituent Substances 0.000 claims description 21
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 10
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005304 joining Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 17
- 239000004020 conductor Substances 0.000 claims 6
- 238000003825 pressing Methods 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims 1
- 239000012670 alkaline solution Substances 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 235000013405 beer Nutrition 0.000 claims 1
- 239000002826 coolant Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202080049641.XA CN114097076B (zh) | 2019-07-10 | 2020-07-08 | 半导体封装、电子装置及半导体封装的制造方法 |
| PCT/JP2020/026714 WO2021006297A1 (ja) | 2019-07-10 | 2020-07-08 | 半導体パッケージ、電子装置、および半導体パッケージの製造方法 |
| US17/559,608 US12400923B2 (en) | 2019-07-10 | 2021-12-22 | Semiconductor package, electronic device, and method for manufacturing semiconductor package |
| US19/191,967 US20250253198A1 (en) | 2019-07-10 | 2025-04-28 | Semiconductor package, electronic device, and method for manufacturing semiconductor package |
| US19/193,549 US20250259902A1 (en) | 2019-07-10 | 2025-04-29 | Semiconductor package, electronic device, and method for manufacturing semiconductor package |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019128693 | 2019-07-10 | ||
| JP2019128693 | 2019-07-10 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021015964A JP2021015964A (ja) | 2021-02-12 |
| JP2021015964A5 true JP2021015964A5 (https=) | 2021-11-11 |
| JP7310733B2 JP7310733B2 (ja) | 2023-07-19 |
Family
ID=74530738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020113132A Active JP7310733B2 (ja) | 2019-07-10 | 2020-06-30 | 半導体パッケージ、電子装置、および半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7310733B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7509078B2 (ja) | 2021-04-23 | 2024-07-02 | 株式会社デンソー | 半導体モジュール |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345928A (ja) * | 1998-06-03 | 1999-12-14 | Hitachi Cable Ltd | 半導体装置とその製造方法 |
| JP2005226096A (ja) | 2004-02-10 | 2005-08-25 | Kobe Steel Ltd | 電子部品用銅又は銅合金板・条材及びその製造方法 |
| JP2007157863A (ja) | 2005-12-02 | 2007-06-21 | Hitachi Ltd | パワー半導体装置及びその製造方法 |
| JP2007235004A (ja) | 2006-03-03 | 2007-09-13 | Mitsubishi Electric Corp | 半導体装置 |
| JP4698658B2 (ja) | 2007-11-29 | 2011-06-08 | 三洋電機株式会社 | 半導体チップ搭載用の絶縁基板 |
| JP2015119048A (ja) | 2013-12-18 | 2015-06-25 | 株式会社ジェイテクト | 半導体装置 |
| JP2018182043A (ja) | 2017-04-12 | 2018-11-15 | 富士通株式会社 | 接合体、接合体の製造方法、冷却装置、及び情報処理装置 |
-
2020
- 2020-06-30 JP JP2020113132A patent/JP7310733B2/ja active Active
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