JP7310733B2 - 半導体パッケージ、電子装置、および半導体パッケージの製造方法 - Google Patents

半導体パッケージ、電子装置、および半導体パッケージの製造方法 Download PDF

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JP7310733B2
JP7310733B2 JP2020113132A JP2020113132A JP7310733B2 JP 7310733 B2 JP7310733 B2 JP 7310733B2 JP 2020113132 A JP2020113132 A JP 2020113132A JP 2020113132 A JP2020113132 A JP 2020113132A JP 7310733 B2 JP7310733 B2 JP 7310733B2
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semiconductor chip
semiconductor package
sealing member
pattern
semiconductor
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JP2021015964A (ja
JP2021015964A5 (https=
Inventor
晃弘 山口
典久 今泉
隆磨 上小牧
宏司 近藤
博宇 宮野
智宏 横地
元太郎 増田
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Denso Corp
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Denso Corp
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Priority to CN202080049641.XA priority Critical patent/CN114097076B/zh
Priority to PCT/JP2020/026714 priority patent/WO2021006297A1/ja
Publication of JP2021015964A publication Critical patent/JP2021015964A/ja
Publication of JP2021015964A5 publication Critical patent/JP2021015964A5/ja
Priority to US17/559,608 priority patent/US12400923B2/en
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Publication of JP7310733B2 publication Critical patent/JP7310733B2/ja
Priority to US19/191,967 priority patent/US20250253198A1/en
Priority to US19/193,549 priority patent/US20250259902A1/en
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JP2020113132A 2019-07-10 2020-06-30 半導体パッケージ、電子装置、および半導体パッケージの製造方法 Active JP7310733B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202080049641.XA CN114097076B (zh) 2019-07-10 2020-07-08 半导体封装、电子装置及半导体封装的制造方法
PCT/JP2020/026714 WO2021006297A1 (ja) 2019-07-10 2020-07-08 半導体パッケージ、電子装置、および半導体パッケージの製造方法
US17/559,608 US12400923B2 (en) 2019-07-10 2021-12-22 Semiconductor package, electronic device, and method for manufacturing semiconductor package
US19/191,967 US20250253198A1 (en) 2019-07-10 2025-04-28 Semiconductor package, electronic device, and method for manufacturing semiconductor package
US19/193,549 US20250259902A1 (en) 2019-07-10 2025-04-29 Semiconductor package, electronic device, and method for manufacturing semiconductor package

Applications Claiming Priority (2)

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JP2019128693 2019-07-10
JP2019128693 2019-07-10

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JP2021015964A JP2021015964A (ja) 2021-02-12
JP2021015964A5 JP2021015964A5 (https=) 2021-11-11
JP7310733B2 true JP7310733B2 (ja) 2023-07-19

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7509078B2 (ja) 2021-04-23 2024-07-02 株式会社デンソー 半導体モジュール

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005226096A (ja) 2004-02-10 2005-08-25 Kobe Steel Ltd 電子部品用銅又は銅合金板・条材及びその製造方法
JP2007157863A (ja) 2005-12-02 2007-06-21 Hitachi Ltd パワー半導体装置及びその製造方法
JP2007235004A (ja) 2006-03-03 2007-09-13 Mitsubishi Electric Corp 半導体装置
JP2008066762A (ja) 2007-11-29 2008-03-21 Sanyo Electric Co Ltd 半導体チップ搭載用の絶縁基板
JP2015119048A (ja) 2013-12-18 2015-06-25 株式会社ジェイテクト 半導体装置
JP2018182043A (ja) 2017-04-12 2018-11-15 富士通株式会社 接合体、接合体の製造方法、冷却装置、及び情報処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345928A (ja) * 1998-06-03 1999-12-14 Hitachi Cable Ltd 半導体装置とその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005226096A (ja) 2004-02-10 2005-08-25 Kobe Steel Ltd 電子部品用銅又は銅合金板・条材及びその製造方法
JP2007157863A (ja) 2005-12-02 2007-06-21 Hitachi Ltd パワー半導体装置及びその製造方法
JP2007235004A (ja) 2006-03-03 2007-09-13 Mitsubishi Electric Corp 半導体装置
JP2008066762A (ja) 2007-11-29 2008-03-21 Sanyo Electric Co Ltd 半導体チップ搭載用の絶縁基板
JP2015119048A (ja) 2013-12-18 2015-06-25 株式会社ジェイテクト 半導体装置
JP2018182043A (ja) 2017-04-12 2018-11-15 富士通株式会社 接合体、接合体の製造方法、冷却装置、及び情報処理装置

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